公开(公告)号：US11984151B2

公开(公告)日：2024-05-14

申请号：US17850207

申请日：2022-06-27

Applicant: STMicroelectronics International N.V.

Inventor： Harsh Rawat ,  Kedar Janardan Dhori ,  Promod Kumar ,  Nitin Chawla ,  Manuj Ayodhyawasi

IPC: G11C11/10 ,  G11C11/4074 ,  G11C11/408 ,  G11C11/4094 ,  G11C11/4096

CPC classification number: G11C11/4085 ,  G11C11/4074 ,  G11C11/4094 ,  G11C11/4096

Abstract: A circuit includes a memory array with SRAM cells connected in rows by word lines and in columns by bit lines. A row controller circuit simultaneously actuates, through a word line driver circuit for each row, word lines in parallel for an in-memory compute operation. A column processing circuit processes analog voltages developed on the bit lines in response to the simultaneous actuation to generate a decision output for the in-memory compute operation. A bit line precharge circuit generates a precharge voltage for application to each pair of bit lines. The precharge voltage has a first voltage level (not greater than a positive supply voltage for the SRAM cells) when the memory array is operating in a data read/write mode. The precharge voltage has a second voltage level (greater than the first voltage level) in advance of the simultaneous actuation of the word lines for the in-memory compute operation.

公开(公告)号：US11758707B2

公开(公告)日：2023-09-12

申请号：US17118372

申请日：2020-12-10

Applicant: STMicroelectronics International N.V.

Inventor： Shafquat Jahan Ahmed ,  Kedar Janardan Dhori

IPC: H10B10/00

CPC classification number: H10B10/12 ,  H10B10/18

Abstract: A memory cell including a set of active regions that overlay a set of gate regions to form a pair of cross-coupled inverters. A first active region extends along a first axis. A first gate region extends transversely to the first active region and overlays the first active region to form a first transistor of the pair of cross-coupled inverters. A second gate region extends transversely to the first active region and overlays the first active region to form a second transistor of the pair of cross-coupled inverters. A second active region extends along a second axis and overlays the first gate region to form a third transistor of the pair of cross-coupled inverters. A fourth active region extending along a third axis and overlays a gate region to form a transistor of a read port.

公开(公告)号：US09685209B1

公开(公告)日：2017-06-20

申请号：US15132388

申请日：2016-04-19

Applicant: STMicroelectronics International N.V.

Inventor： Kedar Janardan Dhori ,  Vinay Kumar ,  Ashish Kumar

IPC: G11C7/00 ,  G11C7/12 ,  G11C7/14 ,  G11C7/06

CPC classification number: G11C7/12 ,  G11C7/062 ,  G11C7/08 ,  G11C7/14 ,  G11C7/227 ,  G11C11/419

Abstract: A sense amplifier enable signal generating circuit includes an input coupled to a dummy bit line of a memory. A voltage comparator circuit compares a voltage on the dummy bit line to a threshold voltage and generates an output signal when the voltage falls below that threshold voltage. A multi-bit counter circuit counts a count value in response to the output signal. A pull-up circuit pulls up the voltage on the dummy bit line in response to the output signal. A count comparator circuit compares the count value to a count threshold and generates a sense amplifier enable signal when the count value equals the count threshold.

公开(公告)号：US12183424B2

公开(公告)日：2024-12-31

申请号：US17954060

申请日：2022-09-27

Applicant: STMicroelectronics International N.V.

Inventor： Harsh Rawat ,  Kedar Janardan Dhori ,  Promod Kumar ,  Nitin Chawla ,  Manuj Ayodhyawasi

IPC: G11C7/10 ,  G11C7/12

Abstract: A memory array includes a plurality of bit-cells arranged as a set of rows of bit-cells intersecting a plurality of columns. The memory array also includes a plurality of in-memory-compute (IMC) cells arranged as a set of rows of IMC cells intersecting the plurality of columns of the memory array. Each of the IMC cells of the memory array includes a first bit-cell having a latch, a write-bit line and a complementary write-bit line, and a second bit-cell having a latch, a write-bit line and a complementary write-bit line, wherein the write-bit line of the first bit-cell is coupled to the complementary write-bit line of the second bit-cell and the complementary write-bit line of the first bit-cell is coupled to the write-bit line of the second bit-cell.

公开(公告)号：US12087356B2

公开(公告)日：2024-09-10

申请号：US17849903

申请日：2022-06-27

Applicant: STMicroelectronics International N.V.

Inventor： Harsh Rawat ,  Kedar Janardan Dhori ,  Promod Kumar ,  Nitin Chawla ,  Manuj Ayodhyawasi

IPC: G11C11/418

CPC classification number: G11C11/418

Abstract: SRAM cells are connected in columns by bit lines and connected in rows by first and second word lines coupled to first and second data storage sides of the SRAM cells. First the first word lines are actuated in parallel and then next the second word lines are actuated in parallel in first and second phases, respectively, of an in-memory compute operation. Bit line voltages in the first and second phases are processed to generate an in-memory compute operation decision. A low supply node reference voltage for the SRAM cells is selectively modulated between a ground voltage and a negative voltage. The first data storage side receives the negative voltage and the second data storage side receives the ground voltage during the second phase. Conversely, the second data storage side receives the negative voltage and the first data storage side receives the ground voltage during the first phase.

公开(公告)号：US10224097B2

公开(公告)日：2019-03-05

申请号：US15909261

申请日：2018-03-01

Applicant: STMicroelectronics International N.V.

Inventor： Ashish Kumar ,  Vinay Kumar ,  Kedar Janardan Dhori

IPC: G11C11/419 ,  G11C11/418 ,  G11C5/14 ,  G11C5/06

Abstract: Read stability of a memory is enhanced in low voltage operation mode by selectively boosting a cell supply voltage for a row of memory cells. The boosted voltage results from a capacitive coupling to the word line in that row. The capacitive coupling is implemented by running the metal line of the power supply line for the cell supply voltage and the metal line for the word line adjacent to each other in a common metallization level. The selective voltage boost is controlled in response to operation of a modified memory cell exhibiting a deteriorated write margin. An output of the modified memory cell is compared to a threshold to generate a signal for controlling the selective voltage boost. Word line under-voltage circuitry is further provided to control application of an under-voltage to the word line.

公开(公告)号：US09865333B2

公开(公告)日：2018-01-09

申请号：US15132680

申请日：2016-04-19

Applicant: STMicroelectronics International N.V.

Inventor： Kedar Janardan Dhori ,  Ashish Kumar ,  Hitesh Chawla ,  Praveen Kumar Verma

IPC: G11C11/00 ,  G11C11/419

CPC classification number: G11C11/419 ,  G11C8/08 ,  G11C11/418

Abstract: A memory circuit includes a wordline, memory cells connected to the wordline and a wordline driver circuit including a p-channel pull-up transistor. The memory circuit further includes a read assist circuit including an n-channel pull-down transistor having a source-drain path connected between the wordline and a ground node and an n-channel diode-connected transistor having a source-drain path connected between a positive supply node and a gate terminal of the n-channel pull-down transistor. The n-channel diode-connected transistor is configured to apply a biasing voltage to the gate terminal of the n-channel pull-down transistor that is a relatively lower voltage for relatively lower temperatures and a relatively higher voltage for relatively higher temperatures.

公开(公告)号：US12237007B2

公开(公告)日：2025-02-25

申请号：US17852567

申请日：2022-06-29

Applicant: STMicroelectronics International N.V.

Inventor： Kedar Janardan Dhori ,  Harsh Rawat ,  Promod Kumar ,  Nitin Chawla ,  Manuj Ayodhyawasi

IPC: G11C11/418 ,  G11C11/412 ,  G11C11/419

Abstract: A circuit includes a memory array with SRAM cells connected in rows by word lines and in columns by bit lines. A row controller circuit simultaneously actuates, through a word line driver circuit for each row, word lines in parallel for an in-memory compute operation. A column processing circuit processes analog voltages developed on the bit lines in response to the simultaneous actuation to generate a decision output for the in-memory compute operation. A bit line clamping circuit includes a sensing circuit that compares the analog voltages on a given pair of bit lines to a threshold voltage. A voltage clamp circuit is actuated in response to the comparison to preclude the analog voltages on the given pair of bit lines from decreasing below a clamping voltage level.

公开(公告)号：US12170120B2

公开(公告)日：2024-12-17

申请号：US18227545

申请日：2023-07-28

Applicant: STMicroelectronics International N.V.

Inventor： Hitesh Chawla ,  Tanuj Kumar ,  Bhupender Singh ,  Harsh Rawat ,  Kedar Janardan Dhori ,  Manuj Ayodhyawasi ,  Nitin Chawla ,  Promod Kumar

IPC: G11C29/00 ,  G11C29/12 ,  G11C29/36

Abstract: The memory array of a memory includes sub-arrays with memory cells arranged in a row-column matrix where each row includes a word line and each sub-array column includes a local bit line. A row decoder circuit supports two modes of memory circuit operation: a first mode where only one word line in the memory array is actuated during a memory read and a second mode where one word line per sub-array are simultaneously actuated during the memory read. An input/output circuit for each column includes inputs to the local bit lines of the sub-arrays, a column data output coupled to the bit line inputs, and a sub-array data output coupled to each bit line input. Both BIST and ATPG testing of the input/output circuit are supported. For BIST testing, multiple data paths between the bit line inputs and the column data output are selectively controlled to provide complete circuit testing.

公开(公告)号：US20240015945A1

公开(公告)日：2024-01-11

申请号：US18347435

申请日：2023-07-05

Applicant: STMicroelectronics SA ,  STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics International N.V.

Inventor： Olivier Weber ,  Kedar Janardan Dhori ,  Promod Kumar ,  Shafquat Jahan Ahmed ,  Christophe Lecocq ,  Pascal Urard

IPC: H10B10/00 ,  G11C11/417

CPC classification number: H10B10/12 ,  H10B10/18 ,  G11C11/417

Abstract: In one embodiment, a semiconductor device includes a carrier substrate, a buried dielectric region overlying the carrier substrate, and a semiconductor film separated from the carrier substrate by the buried dielectric region. NMOS transistors and PMOS transistors are disposed at a surface of the semiconductor film and coupled together to form a static random access memory (SRAM) cell. The NMOS transistors and the PMOS transistors each include a gate dielectric layer having a thickness greater than three nanometers and an active region in the semiconductor film. The active region of the PMOS transistors are formed from a silicon-germanium alloy.