公开(公告)号：US20160104663A1

公开(公告)日：2016-04-14

申请号：US14512208

申请日：2014-10-10

Applicant: STMicroelectronics Pte Ltd

Inventor： Wing Shenq WONG

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A lead frame having a plurality of concentric lead frame rings configured to receive and support a variety of integrated circuit die having a variety of sizes. The rings are separated from each other by gaps and coupled together by a plurality of tie bars. The concentric rings may be circular or rectangular. The tie bars may extend diagonally from the rings or perpendicularly to the rings.

Abstract translation: 具有多个同心引线框架环的引线框架，其被配置为接收和支撑具有各种尺寸的各种集成电路管芯。 环通过间隙彼此分开，并通过多个连接杆联接在一起。 同心环可以是圆形或矩形。 连接杆可以从环或者垂直于环对角地延伸。

公开(公告)号：US20160172272A1

公开(公告)日：2016-06-16

申请号：US14567070

申请日：2014-12-11

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq WONG

IPC: H01L23/495 ,  H01L25/065 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29011 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/014

Abstract: A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.

Abstract translation: 单芯片集成电路（IC）封装包括管芯焊盘和在焊盘上的间隔环，其限定焊料接收区域。 焊料体位于焊料接收区域内的焊盘上。 IC芯片位于间隔环上，并通过焊料体在焊料接收区域内固定到管芯焊盘。 封装材料围绕芯片焊盘，间隔环和IC芯片。 对于多芯片IC封装，模块焊盘上有一个坝结构，并定义了多个焊料接收区域。 相应的焊料体在相应的焊料接收区域内的焊盘上。 IC芯片在每个相应的焊料接收区域内，并通过相应的焊料体保持就位。 封装材料围绕芯片焊盘，堤坝结构和多个IC管芯。

公开(公告)号：US20160197113A1

公开(公告)日：2016-07-07

申请号：US14589210

申请日：2015-01-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq WONG

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/16235 ,  H01L2924/00014

Abstract: An image sensor device may include an interconnect layer, an image sensor IC carried by the interconnect layer and having an image sensing surface, and encapsulation material laterally surrounding the image sensor IC and covering an upper surface of the image sensor IC up to the image sensing surface. The image sensor device may include an optical plate having a peripheral lower surface carried by an upper surface of the encapsulation material and aligned with the image sensing surface, the optical plate being spaced above the image sensing surface to define an internal cavity, and a lens assembly coupled to the encapsulation material and aligned with the image sensing surface.

Abstract translation: 图像传感器装置可以包括互连层，由互连层承载并具有图像感测表面的图像传感器IC，以及侧向围绕图像传感器IC并且覆盖图像传感器IC的上表面的封装材料，直到图像感测 表面。 图像传感器装置可以包括光学板，其具有由封装材料的上表面承载并与图像感测表面对准的周边下表面，光学板在图像感测表面上方间隔开以限定内部空腔，并且透镜 组件耦合到封装材料并与图像感测表面对齐。

公开(公告)号：US20210382197A1

公开(公告)日：2021-12-09

申请号：US17411948

申请日：2021-08-25

Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED ,  STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq WONG ,  Andy PRICE ,  Eric CHRISTISON

IPC: G01V8/12 ,  H01L25/16 ,  H01L31/167

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

公开(公告)号：US20200301042A1

公开(公告)日：2020-09-24

申请号：US16890778

申请日：2020-06-02

Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED ,  STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq WONG ,  Andy PRICE ,  Eric CHRISTISON

IPC: G01V8/12 ,  H01L25/16 ,  H01L31/167

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

公开(公告)号：US20160284920A1

公开(公告)日：2016-09-29

申请号：US14671707

申请日：2015-03-27

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Eric SAUGIER ,  Wing Shenq WONG ,  David GANI

IPC: H01L31/167 ,  H01L31/18 ,  H01S5/022 ,  H01S5/183 ,  H01L31/02 ,  H01L25/16

CPC classification number: H01L31/167 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/18 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01S5/02248 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.

Abstract translation: 具有相对较小占地面积的接近传感器包括衬底，半导体管芯，发光器件和帽。 发光器件覆盖半导体管芯。 半导体管芯被固定到基板上并且包括能够检测来自发光器件的光的传感器区域。 盖子也被固定到基板上并且包括防止由发光装置发射的一些光到达传感器区域的光栅。 在一个实施例中，发光器件和半导体管芯位于衬底的相同侧上，其中发光器件位于半导体管芯上。 在另一个实施例中，发光器件位于衬底的一侧，并且半导体管芯位于衬底的相对侧上。

公开(公告)号：US20160197030A1

公开(公告)日：2016-07-07

申请号：US14589094

申请日：2015-01-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq WONG

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/17738 ,  H01L2924/17763 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.

Abstract translation: 集成电路（IC）封装包括芯片焊盘和固定在裸片焊盘上的IC芯片。 IC芯片具有与芯片焊盘的外边缘对准的外边缘。 封装材料体围绕芯片焊盘和IC芯片。 引线从封装材料体向外延伸并耦合到IC管芯。 每个引线具有与IC芯片的上表面共面的上表面。 管芯焊盘具有通过封装材料体暴露的下表面，并且其厚度大于多个引线中的每一个的厚度。