Abstract:
A non-volatile memory device includes a memory array with memory cells arranged in rows and columns. Each cell has respective current-conduction regions and a control-gate region. The control-gate regions of the memory cells of a same row are coupled to a control-gate terminal and biased at a respective control-gate voltage. A control-gate decoder selects and biases the control-gate regions of the rows at respective control voltages according to operations to be performed on the memory cells. The current-conduction regions of the memory cells are arranged within a same bulk well, and the control-gate decoder has a number of driver blocks each of which supplies the control-gate voltages to a respective number of rows of the array. The driver blocks are provided in respective biasing wells, separate and distinct from one another.
Abstract:
A semiconductor well of a non-volatile memory houses memory cells. The memory cells each have a floating gate and a control gate. Erasing of the memory cells includes biasing the semiconductor well with a first erase voltage having an absolute value greater than a breakdown voltage level of bipolar junctions of a control gate switching circuit of the memory. An absolute value of the first erase voltage is based on a comparison of a value of an indication of wear of the memory cells to a wear threshold value.
Abstract:
A decoding system for a phase change non-volatile memory device having a memory array may include a column decoder that selects at least one column of the memory array during programming operations. The decoding system includes a selection circuit that includes selection switches on a number of hierarchical decoding levels for defining a conductive path between at least one column and a driving stage. A biasing circuit may supply biasing signals to the selection switches for defining the first conductive path and bringing the selected column to a programming voltage value. The programming selection circuit may have protection elements between columns and the selection switches. The selection switches and the protection elements may include metal oxide semiconductor (MOS) transistors having an upper threshold voltage level lower than the programming voltage.