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    ELECTROSTATIC CHUCK DEVICE, AND SEMICONDUCTOR MANUFACTURING DEVICE
    2.
    发明申请
    ELECTROSTATIC CHUCK DEVICE, AND SEMICONDUCTOR MANUFACTURING DEVICE 审中-公开

    公开(公告)号：US20180025933A1

    公开(公告)日：2018-01-25

    申请号：US15550205

    申请日：2016-02-03

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Kazunori ISHIMURA ,  Kazuto ANDO ,  Kentaro TAKAHASHI ,  Yuhki KINPARA ,  Shinichi MAETA ,  Mamoru KOSAKAI

    IPC: H01L21/683 ,  H01L21/67

    CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/68757

    Abstract: An electrostatic chuck part of an electrostatic chuck device has an electrostatic chuck part inner peripheral surface surrounding an opening of a chuck part through-hole, and an electrostatic chuck part outer peripheral surface surrounding the electrostatic chuck part inner peripheral surface. An insulator has an insulator main body in which an insulator through-hole having an opening on the electrostatic chuck part side is formed, an insulator inner end face, and an insulator outer end face which faces the electrostatic chuck part outer peripheral surface. The insulator inner end face and the electrostatic chuck part inner peripheral surface are in contact with each other, or an adhesion layer or a plasma-resistant adhesive layer extends in a gap between the insulator inner end face and the electrostatic chuck part inner peripheral surface. The plasma-resistant adhesive layer is formed between the electrostatic chuck part outer peripheral surface and the insulator outer end face.

    ELECTROSTATIC CHUCK DEVICE
    3.
    发明申请
    ELECTROSTATIC CHUCK DEVICE 审中-公开

    公开(公告)号：US20190019714A1

    公开(公告)日：2019-01-17

    申请号：US16070478

    申请日：2017-01-18

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Mamoru KOSAKAI ,  Yukio MIURA ,  Kazunori ISHIMURA ,  Keisuke MAEDA ,  Hitoshi KOUNO ,  Yuuki KINPARA ,  Shinichi MAETA ,  Tomomi ITO

    IPC: H01L21/683 ,  H01L21/67 ,  H02N13/00

    Abstract: An electrostatic chuck device includes: an electrostatic chuck part which incorporates an internal electrode for electrostatic attraction and has a placing surface on which a plate-like sample is placed; a base part which cools the electrostatic chuck part; and an adhesion layer which bonds the electrostatic chuck part and the base part to integrate the parts together, in which a first through-hole is provided in the electrostatic chuck part, a second through-hole that communicates with the first through-hole is provided in the base part, a tubular insulator is fixed in the second through-hole, an annular sealing member is sandwiched between the electrostatic chuck part and a distal end surface of the insulator, wherein the distal end surface is located on the electrostatic chuck part side of the insulator, and a tubular insulating wall member is located at the inner side of the sealing member in the radial direction.

    ELECTROSTATIC CHUCKING DEVICE
    4.
    发明申请
    ELECTROSTATIC CHUCKING DEVICE 审中-公开

    公开(公告)号：US20170323819A1

    公开(公告)日：2017-11-09

    申请号：US15528008

    申请日：2015-11-11

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Mamoru KOSAKAI

    IPC: H01L21/683 ,  H01L21/67

    CPC classification number: H01L21/6833 ,  B23Q3/15 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H02N13/00

    Abstract: Provided is an electrostatic chucking device having high heat resistance. The electrostatic chucking device of the present invention includes a first ceramic plate which includes a first surface on which a substrate is able to be placed and a second surface on the opposite side thereof, and in which an internal electrode for electrostatic adsorption is embedded; a heating member fixed to the second surface; a second ceramic plate adhered to the first ceramic plate and the heating member via a first adhesive layer; and a cooling base portion adhered to the second ceramic plate via a second adhesive layer and cools at least the second ceramic plate. The first adhesive layer has a higher heat resistance than the second adhesive layer. The second adhesive layer has a smaller Young's modulus than the first adhesive layer.

    ELECTROSTATIC CHUCK DEVICE
    5.
    发明申请
    ELECTROSTATIC CHUCK DEVICE 审中-公开

    公开(公告)号：US20200266088A1

    公开(公告)日：2020-08-20

    申请号：US16649969

    申请日：2018-09-26

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Mamoru KOSAKAI ,  Masaki OZAKI ,  Keisuke MAEDA

    IPC: H01L21/683 ,  H01L21/3065 ,  H01L21/67 ,  H01L21/768 ,  H01J37/32 ,  H02N13/00

    Abstract: An electrostatic chuck device includes: an electrostatic chuck part having a sample placing surface on which a sample is placed and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample placing surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the electrostatic chuck part has a recess and protrusion on the adhesive layer side, and a sheet resistance value of the first electrode is higher than 1.0 Ω/□ and lower than 1.0×1010 Ω/□.

    ELECTROSTATIC CHUCK DEVICE AND METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK DEVICE
    6.
    发明申请
    ELECTROSTATIC CHUCK DEVICE AND METHOD FOR MANUFACTURING ELECTROSTATIC CHUCK DEVICE 审中-公开

    公开(公告)号：US20190019713A1

    公开(公告)日：2019-01-17

    申请号：US16069141

    申请日：2017-01-12

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Nobuhiro HIDAKA ,  Hironori KUGIMOTO ,  Mamoru KOSAKAI

    IPC: H01L21/683 ,  C04B35/117 ,  C04B35/626 ,  C04B35/645

    Abstract: An electrostatic chuck device includes: a base having one principal surface which is a placing surface on which a plate-shaped sample is placed, wherein the base is made from a sintered compact of ceramic particles, which include silicon carbide particles and aluminum oxide particles, as a forming material; and an electrostatic attraction electrode which is provided on a surface of the base on the side opposite to the placing surface of the base, or in the interior of the base, in which the volume resistivity value of the sintered compact is 0.5×1015 Ωcm or more in the entire range from 24° C. to 300° C., a graph which shows the relationship of the volume resistivity value of the sintered compact to a temperature at which the volume resistivity value of the sintered compact is measured has a maximum value in the range from 24° C. to 300° C., and the amount of metal impurities in the sintered compact other than aluminum and silicon in the sintered compact is 100 ppm or less.

    ELECTROSTATIC CHUCK DEVICE
    7.
    发明申请
    ELECTROSTATIC CHUCK DEVICE 审中-公开

    公开(公告)号：US20200273736A1

    公开(公告)日：2020-08-27

    申请号：US16649611

    申请日：2018-09-12

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Mamoru KOSAKAI ,  Masaki OZAKI ,  Keisuke MAEDA

    IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687 ,  H01J37/32

    Abstract: An object of the present invention is to reduce non-uniformity of etching in a plane of a wafer. An electrostatic chuck device includes: an electrostatic chuck part having a sample mounting surface on which a sample is mounted and having a first electrode for electrostatic attraction; a cooling base part placed on a side opposite to the sample mounting surface with respect to the electrostatic chuck part to cool the electrostatic chuck part; and an adhesive layer that bonds the electrostatic chuck part and the cooling base part together, in which the cooling base part has a function of a second electrode that is an RF electrode, a third electrode for RF electrode or LC adjustment is provided between the electrostatic chuck part and the cooling base part, and the third electrode is bonded to the electrostatic chuck part and the cooling base part and insulated from the cooling base part.

    ELECTROSTATIC CHUCK DEVICE
    10.
    发明申请
    ELECTROSTATIC CHUCK DEVICE 审中-公开

    公开(公告)号：US20190088517A1

    公开(公告)日：2019-03-21

    申请号：US15528026

    申请日：2015-11-19

    Applicant: SUMITOMO OSAKA CEMENT CO., LTD.

    Inventor： Mamoru KOSAKAI ,  Yukio MIURA

    IPC: H01L21/683 ,  H02N13/00 ,  H01L21/67

    Abstract: An aspect of the present invention has an object to provide an electrostatic chuck device which is provided with a plurality of divided heaters and in which uniform temperature control of a zone which is heated by each heater can be performed with a simple configuration. An electrostatic chuck device according to an aspect of the present invention includes: an electrostatic chuck part which has a mounting surface on one principal surface thereof to mount a plate-shaped sample and has an electrode for electrostatic attraction; a temperature controlling base part which is provided at a side opposite to the mounting surface of the electrostatic chuck part and is configured to cool the electrostatic chuck part; a high frequency generating electrode which is provided in a layer between the electrostatic chuck part and the temperature controlling base part; a high frequency power source which is connected to the high frequency generating electrode; a first heater element which is configured with a plurality of main heaters which are provided in a layer between the high frequency generating electrode and the temperature controlling base part; and a guard electrode which is provided in a layer between the high frequency generating electrode and the first heater element.

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