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公开(公告)号:US12256547B2
公开(公告)日:2025-03-18
申请号:US17494549
申请日:2021-10-05
Applicant: SUNRISE MEMORY CORPORATION
Inventor: Scott Brad Herner , Christopher J. Petti , George Samachisa , Wu-Yi Henry Chien
Abstract: A thin-film storage transistor in a NOR memory string has a gate dielectric layer that includes a silicon oxide nitride (SiON) tunnel dielectric layer. In one embodiment, the SiON tunnel dielectric layer has a thickness between 0.5 to 5.0 nm thick and an index of refraction between 1.5 and 1.9. The SiON tunnel dielectric layer may be deposited at between 720° C. and 900° C. and between 100 and 800 mTorr vapor pressure, using an LPCVD technique under DCS, N2O, and NH3 gas flows. The SiON tunnel dielectric layer may have a nitrogen content of 1-30 atomic percent (at %).
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公开(公告)号:US12160996B2
公开(公告)日:2024-12-03
申请号:US18483322
申请日:2023-10-09
Applicant: SUNRISE MEMORY CORPORATION
Inventor: Christopher J. Petti , Vinod Purayath , George Samachisa , Wu-Yi Henry Chien , Eli Harari
Abstract: Thin-film Ferroelectric field-effect transistor (FeFET) may be organized as 3-dimensional NOR memory string arrays. Each 3-dimensional NOR memory string array includes a row of active stack each including a predetermined number of active strips each provided one on top of another and each being spaced apart from another by an isolation layer. Each active strip may include a shared source layer and a shared drain layer shared by the FeFETs provided along the active strip. Data storage in the active strip is provided by ferroelectric elements that can individually electrically set into one of two polarization states. FeFETs on separate active strips may be configured for read, programming or erase operations in parallel.
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公开(公告)号:US20240363592A1
公开(公告)日:2024-10-31
申请号:US18767750
申请日:2024-07-09
Applicant: SUNRISE MEMORY CORPORATION
Inventor: Khandker Nazrul Quader , Robert Norman , Frank Sai-keung Lee , Christopher J. Petti , Scott Brad Herner , Siu Lung Chan , Sayeef Salahuddin , Mehrdad Mofidi , Eli Harari
IPC: H01L25/065 , G06F3/06 , G06F11/10 , G06F12/0802 , G06N3/02 , G11C16/04 , H01L25/00
CPC classification number: H01L25/0657 , G06F3/0604 , G06F3/0655 , G06F3/0679 , G06F11/1068 , G06F12/0802 , G06N3/02 , H01L25/50 , G06F2212/60 , G06F2212/72 , G11C16/0483 , H01L2225/06513 , H01L2225/06541
Abstract: An electronic device with embedded access to a high-bandwidth, high-capacity fast-access memory includes (a) a memory circuit fabricated on a first semiconductor die, wherein the memory circuit includes numerous modular memory its, each modular memory unit having (i) a three-dimensional array of storage transistors, and (ii) a group of conductors exposed to a surface of the first semiconductor die, the group of conductors being configured for communicating control, address and data signals associated the memory unit; and (b) a logic circuit fabricated on a second semiconductor die, wherein the logic circuit also includes conductors each exposed at a surface of the second semiconductor die, wherein the first and second semiconductor dies are wafer-bonded, such that the conductors exposed at the surface of the first semiconductor die are each electrically connected to a corresponding one of the conductors exposed to the surface of the second semiconductor die. The three-dimensional array of storage transistors may be formed by NOR memory strings.
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公开(公告)号:US11839086B2
公开(公告)日:2023-12-05
申请号:US17812375
申请日:2022-07-13
Applicant: SUNRISE MEMORY CORPORATION
Inventor: Christopher J. Petti , Vinod Purayath , George Samachisa , Wu-Yi Henry Chien , Eli Harari
CPC classification number: H10B51/30 , G11C11/223 , G11C11/2273 , G11C11/2275 , H10B51/20
Abstract: Thin-film Ferroelectric field-effect transistor (FeFET) may be organized as 3-dimensional NOR memory string arrays. Each 3-dimensional NOR memory string array includes a row of active stack each including a predetermined number of active strips each provided one on top of another and each being spaced apart from another by an isolation layer. Each active strip may include a shared source layer and a shared drain layer shared by the FeFETs provided along the active strip. Data storage in the active strip is provided by ferroelectric elements that can individually electrically set into one of two polarization states. FeFETs on separate active strips may be configured for read, programming or erase operations in parallel.
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公开(公告)号:US11670620B2
公开(公告)日:2023-06-06
申请号:US16776279
申请日:2020-01-29
Applicant: Sunrise Memory Corporation
Inventor: Khandker Nazrul Quader , Robert Norman , Frank Sai-keung Lee , Christopher J. Petti , Scott Brad Herner , Siu Lung Chan , Sayeef Salahuddin , Mehrdad Mofidi , Eli Harari
IPC: H01L25/065 , H01L25/00 , G06N3/02 , G06F3/06 , G06F11/10 , G06F12/0802 , G11C16/04
CPC classification number: H01L25/0657 , G06F3/0604 , G06F3/0655 , G06F3/0679 , G06F11/1068 , G06F12/0802 , G06N3/02 , H01L25/50 , G06F2212/60 , G06F2212/72 , G11C16/0483 , H01L2225/06513 , H01L2225/06541
Abstract: An electronic device with embedded access to a high-bandwidth, high-capacity fast-access memory includes (a) a memory circuit fabricated on a first semiconductor die, wherein the memory circuit includes numerous modular memory units, each modular memory unit having (i) a three-dimensional array of storage transistors, and (ii) a group of conductors exposed to a surface of the first semiconductor die, the group of conductors being configured for communicating control, address and data signals associated the memory unit; and (b) a logic circuit fabricated on a second semiconductor die, wherein the logic circuit also includes conductors each exposed at a surface of the second semiconductor die, wherein the first and second semiconductor dies are wafer-bonded, such that the conductors exposed at the surface of the first semiconductor die are each electrically connected to a corresponding one of the conductors exposed to the surface of the second semiconductor die. The three-dimensional array of storage transistors may be formed by NOR memory strings.
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公开(公告)号:US20220238551A1
公开(公告)日:2022-07-28
申请号:US17576416
申请日:2022-01-14
Applicant: SUNRISE MEMORY CORPORATION
Inventor: Christopher J. Petti
IPC: H01L27/11582 , H01L27/11573 , H01L27/11597 , H01L27/11592 , G11C16/26 , G11C11/22
Abstract: A semiconductor memory device is implemented as strings of storage transistors, where the storage transistors in each string have drain terminals connected to a bit line and gate terminals connected to respective word lines. In some embodiments, the semiconductor memory device includes a reference bit line structure to provide a reference bit line signal for read operation. The reference bit line structure configures word line connections to provide a reference bit line to be used with a storage transistor being selected for read access. The reference bit line structure provides a reference bit line having the same electrical characteristics as an active bit line and is configured so that no storage transistors are selected when a word line is activated to access a selected storage transistor associated with the active bit line.
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公开(公告)号:US20240040798A1
公开(公告)日:2024-02-01
申请号:US18483322
申请日:2023-10-09
Applicant: SUNRISE MEMORY CORPORATION
Inventor: Christopher J. Petti , Vinod Purayath , George Samachisa , Wu-Yi Henry Chien , Eli Harari
CPC classification number: H10B51/30 , G11C11/2275 , G11C11/2273 , G11C11/223 , H10B51/20
Abstract: Thin-film Ferroelectric field-effect transistor (FeFET) may be organized as 3-dimensional NOR memory string arrays. Each 3-dimensional NOR memory string array includes a row of active stack each including a predetermined number of active strips each provided one on top of another and each being spaced apart from another by an isolation layer. Each active strip may include a shared source layer and a shared drain layer shared by the FeFETs provided along the active strip. Data storage in the active strip is provided by ferroelectric elements that can individually electrically set into one of two polarization states. FeFETs on separate active strips may be configured for read, programming or erase operations in parallel.
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公开(公告)号:US20230077181A1
公开(公告)日:2023-03-09
申请号:US17817609
申请日:2022-08-04
Applicant: SUNRISE MEMORY CORPORATION
Inventor: Christopher J. Petti , Eli Harari
IPC: H01L27/11556 , H01L27/11519 , H01L27/11565 , H01L27/11582 , G11C16/04 , H01L29/786 , H01L29/06 , H01L29/78
Abstract: A memory structure includes storage transistors organized as horizontal NOR memory strings where the storage transistors are thin-film ferroelectric field-effect transistors (FeFETs) having a ferroelectric gate dielectric layer formed adjacent a semiconductor channel. In some embodiments, the semiconductor channel is formed by an oxide semiconductor material and the ferroelectric storage transistors are junctionless transistors with no p/n junction in the channel. In some embodiments, the ferroelectric storage transistors in each NOR memory string share a first conductive layer as a common source line and a second conductive layer as a common bit line, the first and second conductive layers being in electrical contact with the semiconductor channel. The ferroelectric storage transistors in a multiplicity of NOR memory strings are arranged to form semi-autonomous three-dimensional memory arrays (tiles) with each tile individually addressed and controlled by circuitry in the semiconductor substrate underneath each tile in cooperation with a memory controller.
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公开(公告)号:US20220293188A1
公开(公告)日:2022-09-15
申请号:US17685133
申请日:2022-03-02
Applicant: SUNRISE MEMORY CORPORATION
Inventor: Christopher J. Petti
Abstract: A semiconductor memory device implements a write disturb reduction method to reduce write disturb on unselected memory cells by alternating the order of the write logical “1” step and write logical “0” step in the write operations of selected memory cells associated with the same group of bit lines. In one embodiment, a method in an array of memory cells includes performing write operation on the memory cells in one of the memory pages to store write data into the memory cells where the write operation includes a first write step of writing a data of a first logical state and a second write step of writing data of a second logical state; and performing the write operation for each row of memory cells by alternately performing the first write step followed by the second write step and performing the second write step followed by the first write step.
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公开(公告)号:US20200243486A1
公开(公告)日:2020-07-30
申请号:US16776279
申请日:2020-01-29
Applicant: Sunrise Memory Corporation
Inventor: Khandker Nazrul Quader , Robert Norman , Frank Sai-keung Lee , Christopher J. Petti , Scott Brad Herner , Siu Lung Chan , Sayeef Salahuddin , Mehrdad Mofidi , Eli Harari
IPC: H01L25/065 , H01L25/00 , G06F3/06 , G06F12/0802 , G06N3/02 , G06F11/10 , G11C16/04
Abstract: An electronic device with embedded access to a high-bandwidth, high-capacity fast-access memory includes (a) a memory circuit fabricated on a first semiconductor die, wherein the memory circuit includes numerous modular memory units, each modular memory unit having (i) a three-dimensional array of storage transistors, and (ii) a group of conductors exposed to a surface of the first semiconductor die, the group of conductors being configured for communicating control, address and data signals associated the memory unit; and (b) a logic circuit fabricated on a second semiconductor die, wherein the logic circuit also includes conductors each exposed at a surface of the second semiconductor die, wherein the first and second semiconductor dies are wafer-bonded, such that the conductors exposed at the surface of the first semiconductor die are each electrically connected to a corresponding one of the conductors exposed to the surface of the second semiconductor die. The three-dimensional array of storage transistors may be formed by NOR memory strings.
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