Abstract:
Provided is a digital exposure device. The digital exposure device includes a stage mounted with a substrate on which a pattern is formed, a first light source, a first head, and a digital micro-mirror device control unit. The stage is configured to move in a scan direction. The first light source is configured to provide a first light. The first head is spaced apart from the stage in a first direction and is configured to receive the first light, to generate at least one spot beam by modulating the first light, and to project the at least one spot beam onto the substrate. The digital micro-mirror device control unit is configured to control an energy of the at least one spot beam generated from the first head to be inversely proportional to a size of the at least spot beam generated from the first head.
Abstract:
A digital exposure device includes: a stage having a substrate seated thereon where a pattern is to be formed and moving in a scan direction; a data modification unit receiving design data and generating modified data by extending the design data; and a digital exposure unit receiving the design data and projecting a light controlled according to the design data on the substrate, wherein the modified data includes intermedial data corresponding to the size difference between an image of the design data and an image of the modified data and some of unit data forming the intermedial data are data obtained when unit data of the design data are shifted in any expansion direction.
Abstract:
Provided is a digital exposure device. The digital exposure device includes a stage mounted with a substrate on which a pattern is formed, a first light source, a first head, and a digital micro-mirror device control unit. The stage is configured to move in a scan direction. The first light source is configured to provide a first light. The first head is spaced apart from the stage in a first direction and is configured to receive the first light, to generate at least one spot beam by modulating the first light, and to project the at least one spot beam onto the substrate. The digital micro-mirror device control unit is configured to control an energy of the at least one spot beam generated from the first head to be inversely proportional to a size of the at least spot beam generated from the first head.
Abstract:
A method of managing a critical dimension error includes (i) defining, in a photomask, N openings having a width, where N is a natural number, (ii) using graphs for each of the N openings, each of the graphs being obtained by setting locations through an opening of the N openings as a first axis and an intensity of transmitting light as a second axis, obtaining ILSi proportional to an inclination of a tangent to a graph of the graphs at a location corresponding to an edge of an opening and Ii which is an intensity of transmitting light at the location, where i is a natural number from 1 to N, (iii) obtaining, with respect to each of the N openings, a real width CDi of the openings, and (iv) when I a v e = 1 N ∑ i = 1 N I i , CD a v e = 1 N ∑ i = 1 N CD i and ILS a v e = 1 N ∑ i = 1 N ILS i , obtaining AIMEEFi which is an aerial image mask error enhancement factor with respect to each of the N openings according to an equation below: AIMEEF i = - 2 I i - I a v e ( C D i - C D a v e ) · ILS a v e · I a v e . [ Equation ]
Abstract:
A method of managing a critical dimension error includes (i) defining, in a photomask, N openings having a width, where N is a natural number, (ii) using graphs for each of the N openings, each of the graphs being obtained by setting locations through an opening of the N openings as a first axis and an intensity of transmitting light as a second axis, obtaining ILSi proportional to an inclination of a tangent to a graph of the graphs at a location corresponding to an edge of an opening and Ii which is an intensity of transmitting light at the location, where i is a natural number from 1 to N, (iii) obtaining, with respect to each of the N openings, a real width CDi of the openings, and (iv) when
I
a v e
=
1 N
∑
i = 1
N
I i
,
CD
a v e
=
1 N
∑
i = 1
N
CD i
and
ILS
a v e
=
1 N
∑
i = 1
N
ILS i
,
obtaining AIMEEFi which is an aerial image mask error enhancement factor with respect to each of the N openings according to an equation below:
Abstract:
A photoresist composition includes an alkali soluble resin, a hardening agent, a photo acid generator, and an organic solvent. The photo acid generator may be represented by Formula 1, in which L11 is selected from a single bond, a C1-C10 alkylene group, a C2-C10 alkenylene group, and a C2-C10 alkynylene group; and R11 is selected from a C6-C15 aryl group, or a C6-C15 aryl group with at least one substitutent group selected from a group comprising deuterium, a hydroxyl group, a C1-C10 alkyl group, a C1-C10 alkoxy group, and a C6-C15 aryl group.
Abstract:
A digital exposure device includes: a stage having a substrate seated thereon where a pattern is to be formed and moving in a scan direction; a data modification unit receiving design data and generating modified data by extending the design data; and a digital exposure unit receiving the design data and projecting a light controlled according to the design data on the substrate, wherein the modified data includes intermedial data corresponding to the size difference between an image of the design data and an image of the modified data and some of unit data forming the intermedial data are data obtained when unit data of the design data are shifted in any expansion direction.