ACOUSTIC RESONATOR PACKAGE
    2.
    发明申请

    公开(公告)号:US20230084640A1

    公开(公告)日:2023-03-16

    申请号:US17684732

    申请日:2022-03-02

    IPC分类号: H03H9/10 H03H9/17 H03H3/02

    摘要: An acoustic resonator package includes a substrate, a cap including a protrusion portion protruding toward the substrate, an acoustic resonator disposed between the substrate and the cap and including a first electrode, a piezoelectric layer, and a second electrode, a metal layer connected to one of the first electrode and the second electrode, and a conductive pad at least partially disposed between the protrusion portion and the metal layer and extending in a first direction different from a second direction in which the acoustic resonator faces the conductive pad.

    BULK-ACOUSTIC WAVE RESONATOR
    4.
    发明申请

    公开(公告)号:US20200252051A1

    公开(公告)日:2020-08-06

    申请号:US16388979

    申请日:2019-04-19

    IPC分类号: H03H9/54 H03H9/02 H03H9/205

    摘要: A bulk-acoustic wave resonator includes a substrate; a membrane layer forming a cavity with the substrate; a first electrode at least partially disposed on an upper portion of the cavity including an end portion that is thicker than other portions of the first electrode; an insertion layer including a first portion disposed adjacent to from the end portion of the first electrode and a second portion disposed on an upper portion of the first electrode; a piezoelectric layer disposed to cover the insertion layer; and a second electrode disposed on an upper portion of the piezoelectric layer.

    MEMS DEVICE
    5.
    发明申请
    MEMS DEVICE 审中-公开

    公开(公告)号:US20200087141A1

    公开(公告)日:2020-03-19

    申请号:US16357588

    申请日:2019-03-19

    IPC分类号: B81B7/00 B81B7/02 B81C1/00

    摘要: A MEMS device includes a substrate, a MEMS element portion disposed on a surface of the substrate, a cap having a cavity formed to oppose the MEMS element portion, and a diffusion prevention layer formed on at least a portion of the cap, wherein at least one of the cap and the substrate includes a bonding layer disposed outside of the cavity, and wherein the cap includes a spreading prevention portion disposed between the bonding layer and the cavity and having a V-shape in cross-section.

    BULK ACOUSTIC WAVE RESONATOR
    6.
    发明申请

    公开(公告)号:US20180337656A1

    公开(公告)日:2018-11-22

    申请号:US15814869

    申请日:2017-11-16

    IPC分类号: H03H9/125 H03H9/17

    摘要: A bulk acoustic wave resonator includes a substrate including a first via and a second via, a lower electrode connection member, a lower electrode, a piezoelectric layer, an upper electrode, and an upper electrode connection member spaced apart from the lower electrode connection member. The lower electrode, the piezoelectric layer, and the upper electrode constitute a resonant portion. The lower electrode connection member electrically connects the lower electrode to the first via and supports a first edge portion of the resonant portion. The upper electrode connection member electrically connects the upper electrode to the second via and supports a second edge portion of the resonant portion. Either one or both of the upper electrode connection member and the lower electrode connection member includes a respective extension portion connected to a respective one of the first via and the second via that is disposed below the resonant portion.

    BULK ACOUSTIC WAVE RESONATOR
    7.
    发明申请

    公开(公告)号:US20180309427A1

    公开(公告)日:2018-10-25

    申请号:US15797224

    申请日:2017-10-30

    摘要: A bulk acoustic wave resonator includes: support members disposed between air cavities; a resonant part including a first electrode, a piezoelectric layer, and a second electrode sequentially disposed above the air cavities and on the support members; and a wiring electrode connected either one or both of the first electrode and the second electrode, and disposed above one of the air cavities, wherein a width of an upper surface of the support members is greater than a width of a lower surface of the support members, and side surfaces of the support members connecting the upper surface and the lower surface to each other are inclined.