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公开(公告)号：US20180019726A1
公开(公告)日：2018-01-18
申请号：US15638809
申请日：2017-06-30
发明人： Sung HAN , Jae Chang LEE , Won HAN , Tae Yoon KIM , Jong Woon KIM , Tae Kyung LEE , Moon Chul LEE , Tae Hun LEE , Sung Min CHO , In Young KANG
CPC分类号： H03H9/1014 , H03H9/02086 , H03H9/02102 , H03H9/02118 , H03H9/02157 , H03H9/172 , H03H9/173 , H03H9/54
摘要： A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.
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公开(公告)号：US20150136450A1
公开(公告)日：2015-05-21
申请号：US14185433
申请日：2014-02-20
发明人： Sung HAN , Yang Je Lee
CPC分类号： H05K3/0058 , G06F3/044 , G06F2203/04103
摘要： There are provided a touch panel and a method of manufacturing the same. The touch panel includes: a substrate; and a plurality of fine conductive lines, each of the fine conductive lines including a first black layer formed to have a predetermined pattern, a metal layer formed in accordance with the first black layer, and a second black layer formed on the upper and side surfaces of the metal layer.
摘要翻译： 提供了触摸面板及其制造方法。 触摸面板包括：基板; 以及多个细导电线，每个细导电线包括形成为具有预定图案的第一黑色层，根据第一黑色层形成的金属层和形成在上表面和侧表面上的第二黑色层 的金属层。
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公开(公告)号：US20170179923A1
公开(公告)日：2017-06-22
申请号：US15085072
申请日：2016-03-30
发明人： Ran Hee SHIN , Tae Kyung LEE , Sung HAN , Yun Sung KANG , Sung Sun KIM , Jin Suk SON , Jeong Suong YANG , Hwa Sun LEE , Eun Tae PARK
CPC分类号： H03H9/173 , H03H3/02 , H03H9/02015 , H03H9/02118 , H03H9/174 , H03H2003/021 , H03H2003/023
摘要： An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.
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公开(公告)号：US20160300996A1
公开(公告)日：2016-10-13
申请号：US15003045
申请日：2016-01-21
发明人： Tae Kyung LEE , Sung HAN , Ran Hee SHIN , Hwa Sun LEE , Seung Joo SHIN
IPC分类号： H03H9/54 , H03H9/17 , H01L41/047 , H03H9/13
CPC分类号： H01L41/0477 , H03H9/13 , H03H9/173 , H03H9/587 , H03H9/605
摘要： In examples, there is provided a bulk acoustic wave resonator including: a substrate, a first electrode and a second electrode formed on the substrate, and a piezoelectric layer formed between the first electrode and the second electrode, wherein at least one of the first electrode and the second electrode is formed of an alloy including a molybdenum element. Additionally, such a bulk acoustic wave resonator may include an air cavity formed between the substrate and the first electrode.
摘要翻译： 在实施例中，提供了一种体声波谐振器，包括：基板，形成在基板上的第一电极和第二电极，以及形成在第一电极和第二电极之间的压电层，其中，第一电极 并且第二电极由包括钼元素的合金形成。 另外，这样的体声波谐振器可以包括在基板和第一电极之间形成的空气腔。
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公开(公告)号：US20140182915A1
公开(公告)日：2014-07-03
申请号：US14060345
申请日：2013-10-22
发明人： Sung HAN , Young Do KWEON , Jin Gu KIM , Hyung Jin JEON , Yoon Su KIM
CPC分类号： H05K1/116 , H05K1/113 , H05K3/0017 , H05K3/002 , H05K3/421 , H05K2201/0195 , H05K2201/09563 , H05K2201/09854 , H05K2203/0733
摘要： The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.
摘要翻译： 本发明涉及一种电路板。 根据本发明实施例的电路板包括：基底; 覆盖基底的层间绝缘层; 通孔结构至少穿过基底衬底的层间绝缘层和层间绝缘层在垂直方向上; 以及在水平方向上设置在层间绝缘层上以围绕通孔结构并由绝缘材料制成的蚀刻停止图案。
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公开(公告)号：US20230179170A1
公开(公告)日：2023-06-08
申请号：US17859534
申请日：2022-07-07
发明人： Seung Wook PARK , Seong Hun NA , Jae Hyun JUNG , Sung HAN , Jang Ho PARK
CPC分类号： H03H9/105 , H03H3/02 , H03H9/173 , H03H2003/021
摘要： An acoustic wave resonator package includes an acoustic resonator comprising an acoustic wave generator on a surface of a substrate, a cover member disposed over the acoustic wave generator, a bonding member, disposed between the substrate and the cover member, to bond the substrate and the cover member to each other, and a wiring layer, disposed along surfaces of the cover member, connected to the acoustic resonator. Among the surfaces of the cover member, bonding surfaces to which the bonding member and the wiring layer are bonded at least partially have a roughness Rz in a range of 70 nm to 3.5 µm.
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公开(公告)号：US20230008635A1
公开(公告)日：2023-01-12
申请号：US17554326
申请日：2021-12-17
发明人： Tae Kyung LEE , Sung HAN , Jae Goon AUM
摘要： An acoustic resonator package includes: a substrate; an acoustic resonator disposed on the substrate; a cap disposed on the substrate and the acoustic resonator; and a bonding portion bonding the substrate and the cap to each other. The cap includes a central portion accommodating the acoustic resonator, and an outer portion disposed outside of the central portion and having a bonding surface. The outer portion includes protrusions in contact with the bonding portion, and at least one trench disposed between the protrusions. The acoustic resonator package further includes a first protective layer and a second protective layer, the first protective layer and the second protective layer being disposed on a region of the bonding surface formed on each of the protrusions.
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公开(公告)号：US20220069800A1
公开(公告)日：2022-03-03
申请号：US17106415
申请日：2020-11-30
发明人： Sung HAN , Yoon Sok PARK , Tae Kyung LEE , Hwa Sun LEE
摘要： An acoustic resonator filter is provided. The acoustic resonator filter includes a rear filter electrically connected between a front port and a rear port, through which a radio frequency (RF) signal passes, the rear filter including at least one film bulk acoustic resonator (FBAR); and a front filter electrically connected between the front port and the rear filter and including at least one solidly mounted resonator (SMR).
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公开(公告)号：US20180278232A1
公开(公告)日：2018-09-27
申请号：US15992606
申请日：2018-05-30
发明人： Tae Kyung LEE , Sung HAN , Hwa Sun LEE , Seung Joo SHIN , Ran Hee SHIN
CPC分类号： H03H9/13 , H03H9/02149 , H03H9/173 , H03H9/54
摘要： A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode disposed on the substrate, and a piezoelectric layer disposed between the first electrode and the second electrode. At least one of the first electrode and the second electrode includes an alloy of molybdenum and tantalum.
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公开(公告)号：US20180083597A1
公开(公告)日：2018-03-22
申请号：US15459756
申请日：2017-03-15
发明人： Sung HAN , Tae Kyung LEE , Sung Sun KIM , Won HAN , Hwa Sun LEE , Seung Joo SHIN
CPC分类号： H03H9/17 , H03H9/02118 , H03H9/02157 , H03H9/173 , H03H9/547
摘要： An acoustic wave resonator includes: a first piezoelectric portion of a piezoelectric layer, disposed on a cavity and having a first average thickness; and a second piezoelectric portion of the piezoelectric layer, disposed adjacent to an edge of the first piezoelectric portion and having a second average thickness that is different from the first average thickness.
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