利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.019 秒)

    MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240274355A1

    公开(公告)日：2024-08-15

    申请号：US18417590

    申请日：2024-01-19

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Je Jung KIM ,  Jeong Mo KANG ,  Seong Min OH ,  Eon Ju NOH ,  Jin Hwan KIM

    IPC分类号： H01G4/012 ,  H01G4/30

    CPC分类号： H01G4/012 ,  H01G4/30 ,  H01G4/1227 ,  H01G4/2325

    摘要： A multilayer electronic component includes first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and connected to first and second external electrodes, respectively, in which the first and second internal electrodes include first and second bend portions, respectively, bent in margin regions of a body adjacent to third and fourth surfaces of the body, respectively. The present disclosure is intended to control an angle of the first and second bent portions so that the moisture resistance reliability of the multilayer electronic component is not reduced even if the bent portion is formed in a region in which the first internal electrode is adjacent to the third surface and a region in which the second internal electrode is adjacent to the fourth surface.

    POWER INDUCTOR WITH A CHIP STRUCTURE
    3.
    发明申请
    POWER INDUCTOR WITH A CHIP STRUCTURE 审中-公开

    公开(公告)号：US20170372833A1

    公开(公告)日：2017-12-28

    申请号：US15457235

    申请日：2017-03-13

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Young Su JANG ,  Bum Sik WANG ,  Jin Hwan KIM ,  Hwi Dae KIM ,  Min Ha HWANG

    IPC分类号： H01F27/28 ,  H01F27/29

    摘要： An inductor includes first and second coil patterns disposed in a single chip, and at least one common lead terminal electrically connected to respective end portions of the first and second coil patterns. The first and second coil patterns operate independently of each other, such that a range of a current passing through the first coil pattern and a range of a current passing through the second coil pattern are different from each other. The first and second coil patterns are coil patterns having different electrical characteristics.

    COMPOSITE ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, BOARD FOR MOUNTING THEREOF, AND PACKAGING UNIT THEREOF
    5.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, BOARD FOR MOUNTING THEREOF, AND PACKAGING UNIT THEREOF 审中-公开
    复合电子元件，其制造方法，用于安装的板及其包装单元

    公开(公告)号：US20150340154A1

    公开(公告)日：2015-11-26

    申请号：US14521116

    申请日：2014-10-22

    申请人： Samsung Electro-Mechanics Co., Ltd.

    发明人： Jin Hwan KIM ,  Dae Bok OH ,  Jae Young PARK ,  Ichiro TANAKA ,  Chang Ho LEE

    IPC分类号： H01G2/14 ,  H01G4/12 ,  H05K1/18 ,  H01G4/30 ,  H05K1/11 ,  H01G4/012 ,  H01G4/248

    CPC分类号： H01G2/14 ,  H01G2/06 ,  H01G2/22 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/30 ,  H01G4/40 ,  H05K1/0259 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10636 ,  Y02P70/611

    摘要： A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.

    摘要翻译： 一种由包括电容器的复合体和彼此耦合的静电放电（ESD）保护装置组成的复合电子部件。 电容器包括陶瓷体，其中多个电介质层和内部电极层叠有相应的介电层。 ESD保护装置包括设置在陶瓷体上的第一和第二电极，设置在第一和第二电极之间的放电部分和设置在第一和第二电极和放电部分上的保护层。 输入端子，设置在复合体的第一端面上，并连接到内部电极和第一和第二电极。 一种接地端子，形成在复合体的第二端面上，并连接到内部电极和第一和第二电极。