NONVOLATILE MEMORY
    1.
    发明申请

    公开(公告)号:US20250138940A1

    公开(公告)日:2025-05-01

    申请号:US18639856

    申请日:2024-04-18

    Abstract: A nonvolatile memory device includes a plurality of latch groups, an address controller, an encoder, and a buffer. The address controller controls an input address and an output address to indicate one of the plurality of latch groups. The encoder receives sector data from a latch group corresponding to the output address among the plurality of latch groups and also compresses the received sector data. The buffer stores the compressed sector data. Among the plurality of latch groups, the compressed sector data stored in the buffer is overwritten in a latch group corresponding to the input address.

    Memory package, semiconductor device, and storage device

    公开(公告)号:US11736098B2

    公开(公告)日:2023-08-22

    申请号:US17866517

    申请日:2022-07-17

    CPC classification number: H03K5/14 H03K5/135 H03L7/0816 H03K2005/00247

    Abstract: A memory package includes a plurality of memory chips, and an interface chip relaying communications between a controller and the plurality of memory chips and receiving a plurality of signals from the plurality of memory chips. The interface chip includes receivers outputting a data signal and a raw clock signal based on the plurality of signals, a delay circuit outputting a delay clock signal by applying an offset delay corresponding to ½ of one unit interval of the data signal and an additional delay to the raw clock signal, and a sampler sampling the data signal in synchronization with a clock signal. The delay circuit outputs the clock signal generated by removing the offset delay from the delay clock signal when the delay clock signal and the data signal have a phase difference corresponding to one unit interval of the data signal.

    MEMORY PACKAGE, SEMICONDUCTOR DEVICE, AND STORAGE DEVICE

    公开(公告)号:US20230179193A1

    公开(公告)日:2023-06-08

    申请号:US17866517

    申请日:2022-07-17

    CPC classification number: H03K5/14 H03K5/135 H03L7/0816 H03K2005/00247

    Abstract: A memory package includes a plurality of memory chips, and an interface chip relaying communications between a controller and the plurality of memory chips and receiving a plurality of signals from the plurality of memory chips. The interface chip includes receivers outputting a data signal and a raw clock signal based on the plurality of signals, a delay circuit outputting a delay clock signal by applying an offset delay corresponding to ½ of one unit interval of the data signal and an additional delay to the raw clock signal, and a sampler sampling the data signal in synchronization with a clock signal. The delay circuit outputs the clock signal generated by removing the offset delay from the delay clock signal when the delay clock signal and the data signal have a phase difference corresponding to one unit interval of the data signal.

    Page buffer circuits and nonvolatile memory devices including the same

    公开(公告)号:US11600336B2

    公开(公告)日:2023-03-07

    申请号:US17332350

    申请日:2021-05-27

    Abstract: A nonvolatile memory device includes a memory cell array including memory cells and a page buffer circuit. The page buffer circuit includes page buffer units and cache latches. The cache latches are spaced apart from the page buffer units in a first horizontal direction, and correspond to respective ones of the plurality of page buffer units. Each of the page buffer units includes a pass transistor connected to each sensing node and driven in response to a pass control signal. The page buffer circuit being configured to perform a data transfer operation, based on performing a first data output operation to output data, provided from a first portion of page buffer units, from a first portion of cache latches to a data input/output (I/O) line, the data transfer operation configured to dump sensed data from a second portion of page buffer units to a second portion of cache latches.

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