公开(公告)号：US11709524B2

公开(公告)日：2023-07-25

申请号：US17736612

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungsu Kim ,  Jaehoon Kim

IPC: G06F1/08 ,  H03K19/20

CPC classification number: G06F1/08 ,  H03K19/20

Abstract: A system-on-chip includes: a dynamic power monitor configured to generate a power detection signal by calculating an amount of power consumed by a functional circuit in real time; a frequency controller configured to detect an idle period and a running period of the functional circuit in response to the power detection signal, and generate a clock control signal based on the power detection signal; and a clock controller configured to change a frequency of a clock signal provided to the functional circuit, based on the clock control signal. The running period includes: a first running period in which the frequency of the clock signal has a first value based on the clock control signal; and a second running period in which the frequency of the clock signal has a second value that is greater than the first value based on the clock control signal.

公开(公告)号：US20240319761A1

公开(公告)日：2024-09-26

申请号：US18609073

申请日：2024-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeyoung Lee ,  Byungsu Kim ,  Youngsan Kim ,  Jaegon Lee ,  Jaehoon Kim ,  Byeongho Lee ,  Jongjin Lee ,  Wookyeong Jeong

IPC: G06F1/08 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H03K5/133 ,  H03K5/1534

CPC classification number: G06F1/08 ,  H03K5/133 ,  H01L23/49816 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/16225 ,  H03K5/1534

Abstract: A semiconductor device includes an intellectual property (IP) block configured to operate based on a first clock signal and a power voltage, a clock gating circuit configured to operate based on the power voltage, and generate the first clock signal by selectively performing clock gating on a second clock signal based on an enable signal, and a critical path monitor (CPM) configured to generate a digital code having a value, which varies according to a voltage drop of the power voltage, and activate the enable signal based on a comparison of the value of the digital code with a reference value.

公开(公告)号：US20220382319A1

公开(公告)日：2022-12-01

申请号：US17736612

申请日：2022-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungsu Kim ,  Jaehoon Kim

IPC: G06F1/08

Abstract: A system-on-chip includes: a dynamic power monitor configured to generate a power detection signal by calculating an amount of power consumed by a functional circuit in real time; a frequency controller configured to detect an idle period and a running period of the functional circuit in response to the power detection signal, and generate a clock control signal based on the power detection signal; and a clock controller configured to change a frequency of a clock signal provided to the functional circuit, based on the clock control signal. The running period includes: a first running period in which the frequency of the clock signal has a first value based on the clock control signal; and a second running period in which the frequency of the clock signal has a second value that is greater than the first value based on the clock control signal.

公开(公告)号：US12123789B2

公开(公告)日：2024-10-22

申请号：US17366348

申请日：2021-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungsu Kim ,  Yunhyeok Im ,  Inhwan Baek ,  Dongsuk Shin

IPC: G01K7/42 ,  G05D23/19 ,  G06F1/20 ,  G06F1/3206 ,  G06F1/3296 ,  G06F11/30 ,  G06F1/28 ,  G06F1/3237 ,  G06F1/324 ,  G06F123/02 ,  G06N20/00

CPC classification number: G01K7/425 ,  G01K7/42 ,  G05D23/19 ,  G06F1/206 ,  G06F1/3206 ,  G06F1/3296 ,  G06F11/3058 ,  G06F1/28 ,  G06F1/3237 ,  G06F1/324 ,  G06F11/3062 ,  G06F2123/02 ,  G06N20/00 ,  Y02D10/00

Abstract: The present disclosure provides a device and methods to control a temperature of an integrated circuit (IC). For example, a device may include a circuit (e.g., an IC), a power monitor, a temperature sensor, and a controller. In some examples, temperature may be estimated based on power measured by a dynamic power monitor (DPM). In some cases, the estimated temperatures may be corrected based on temperature sensed by a temperature sensor on the IC. The power may be measured in shorter time periods and/or more frequent time periods compared to a time periods that the temperature sensor senses temperature. Accordingly, the temperature of an IC may be detected and adjusted more frequently based on the power measurements, and the temperature estimates may be adjusted for accuracy based on sensed temperatures.

公开(公告)号：US20230260888A1

公开(公告)日：2023-08-17

申请号：US17958952

申请日：2022-10-03

Applicant: Samsung Electronics Co., Ltd

Inventor： Seungmin Kim ,  Byungsu Kim ,  Hwanwook Jung

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L21/563 ,  H01L21/565 ,  H01L21/561 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/182

Abstract: A package substrate includes a base insulating layer, a first main line pattern on a first surface of the base insulating layer, a plurality of first conductive pads on the first surface of the base insulating layer, a plurality of first branch line patterns on the first surface of the base insulating layer, the plurality of first branch line patterns extending between the first main line pattern and the plurality of first conductive pads; and a first insulating layer on the first surface of the base insulating layer, the first insulating layer including a plurality of first through grooves. Each of the plurality of first branch line patterns includes a first cut portion, a first segment and a second segment separated from each other by the first cut portion, and the plurality of first through grooves overlap first cut portions.

公开(公告)号：US20220136909A1

公开(公告)日：2022-05-05

申请号：US17366348

申请日：2021-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungsu Kim ,  Yunhyeok Im ,  Inhwan Baek ,  Dongsuk Shin

IPC: G01K7/42 ,  G06F1/20 ,  G06F1/3206 ,  G06F1/3296

Abstract: The present disclosure provides a device and methods to control a temperature of an integrated circuit (IC). For example, a device may include a circuit (e.g., an IC), a power monitor, a temperature sensor, and a controller. In some examples, temperature may be estimated based on power measured by a dynamic power monitor (DPM). In some cases, the estimated temperatures may be corrected based on temperature sensed by a temperature sensor on the IC. The power may be measured in shorter time periods and/or more frequent time periods compared to a time periods that the temperature sensor senses temperature. Accordingly, the temperature of an IC may be detected and adjusted more frequently based on the power measurements, and the temperature estimates may be adjusted for accuracy based on sensed temperatures.