公开(公告)号：US20230384239A1

公开(公告)日：2023-11-30

申请号：US18446837

申请日：2023-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung YOON ,  Jeongho AHN ,  Dongryul LEE ,  Dongchul IHM ,  Chungsam JUN

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  H01L22/12 ,  G01N21/8806 ,  G01N21/956

Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

公开(公告)号：US20170176348A1

公开(公告)日：2017-06-22

申请号：US15449423

申请日：2017-03-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choonshik LEEM ,  Chungsam JUN

IPC: G01N21/956 ,  G01N21/88 ,  H01L21/66 ,  G01N21/21

CPC classification number: G01N21/956 ,  G01N21/211 ,  G01N21/8806 ,  G01N2021/8848 ,  G01N2201/0683 ,  G01N2201/12 ,  H01L21/76816 ,  H01L21/76877 ,  H01L22/12

Abstract: An ellipsometer includes a stage, a light source, a polarizer, a detector, and a processor. The stage is configured to support a substrate including a pattern. The light source is configured to emit illumination toward the substrate. The polarizer is configured to polarize the illumination. The detector is configured to generate, in association with a plurality of azimuthal angles, data corresponding to polarized illumination reflected from the substrate. The processor is configured to: control rotation of the stage in association with sequential inspection of the pattern at the plurality of azimuthal angles, and determine asymmetry of the pattern based on the data. Each azimuthal angle of the plurality of azimuthal angles corresponds to a different rotational state of the stage.

公开(公告)号：US20160204041A1

公开(公告)日：2016-07-14

申请号：US14988991

申请日：2016-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minkook KIM ,  Wooseok KO ,  Yusin YANG ,  Sangkil LEE ,  Chungsam JUN

IPC: H01L21/66

CPC classification number: H01L22/12 ,  H01L27/11565 ,  H01L27/11582

Abstract: A method of inspecting a semiconductor device includes providing a substrate, on which a mold layer with a plurality of mold openings is provided, milling the mold layer in a direction inclined at a predetermined angle with respect to a direction normal to a top surface of the substrate, such that an inclined cutting surface exposing milled mold openings is formed, the milled mold openings including first milling openings along a first column extending in a first direction and having different heights, obtaining image data of the cutting surface, the image data including first contour images of the first milling openings, and obtaining a first process parameter, which represents an extent of bending of the mold openings according to a distance from a top surface of the substrate, using positions of center points of the first contour images.

Abstract translation: 一种检查半导体器件的方法包括提供一个衬底，在其上提供具有多个模具开口的模具层，在相对于垂直于该顶部表面的方向倾斜预定角度的方向上铣削模具层 基板，使得形成露出铣削模具开口的倾斜切割表面，所述铣削模具开口包括沿着第一方向延伸并具有不同高度的第一列的第一铣削开口，获得切割表面的图像数据，所述图像数据包括第一 并且使用第一轮廓图像的中心点的位置获得第一加工参数，该第一加工参数代表与基材顶表面距离的距离的模具开口的弯曲程度。

公开(公告)号：US20230123710A1

公开(公告)日：2023-04-20

申请号：US17501318

申请日：2021-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung YOON ,  Jeongho AHN ,  Dongryul LEE ,  Dongchul IHM ,  Chungsam JUN

IPC: G01N21/95 ,  G01N21/956 ,  G01N21/88 ,  H01L21/66

Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

公开(公告)号：US20170363418A1

公开(公告)日：2017-12-21

申请号：US15464896

申请日：2017-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yoon RYU ,  Younghoon SOHN ,  Yusin YANG ,  Chungsam JUN ,  Yunjung JEE

IPC: G01B11/06

CPC classification number: G01B11/06 ,  G01B9/02001 ,  G01B9/02021 ,  G01B11/0616 ,  G01B11/0625 ,  G01B11/0675 ,  G01B2210/56

Abstract: Disclosed are apparatuses and methods for measuring a thickness. The apparatus for measuring a thickness including a light source that emits a femto-second laser, an optical coupler through which a portion of the femto-second laser is incident onto a target and other portion of the femto-second laser is incident onto a reference mirror, a detector configured to receive a reflection signal reflected on the reference mirror and a sample signal generated from the target and configured to measure a thickness of the target based on an interference signal between the reflection signal and the sample signal, and a plurality of optical fiber lines configured to connect the light source, the optical coupler, and the detector to each other may be provided.

公开(公告)号：US20170309523A1

公开(公告)日：2017-10-26

申请号：US15437566

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon SOHN ,  Jinsung KIM ,  Yusin YANG ,  Chungsam JUN

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/027 ,  H01L21/311 ,  H01L21/768 ,  H01L21/67 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L21/02

CPC classification number: H01L22/12 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02271 ,  H01L21/0274 ,  H01L21/31144 ,  H01L21/4846 ,  H01L21/565 ,  H01L21/67259 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76895 ,  H01L22/20 ,  H01L24/06 ,  H01L24/11 ,  H01L2221/68345 ,  H01L2224/02311 ,  H01L2224/13024 ,  H01L2224/14131 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/152 ,  H01L2924/15747

Abstract: A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.