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公开(公告)号:US08497432B2
公开(公告)日:2013-07-30
申请号:US12561526
申请日:2009-09-17
申请人: Nobuaki Hashimoto
发明人: Nobuaki Hashimoto
IPC分类号: H05K1/16
CPC分类号: H05K3/305 , G02F1/13458 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/80 , H01L24/83 , H01L2224/02311 , H01L2224/02313 , H01L2224/02373 , H01L2224/02377 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/0331 , H01L2224/0332 , H01L2224/03515 , H01L2224/0361 , H01L2224/0362 , H01L2224/03831 , H01L2224/0519 , H01L2224/05191 , H01L2224/05548 , H01L2224/05551 , H01L2224/05553 , H01L2224/05556 , H01L2224/05572 , H01L2224/05582 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/0569 , H01L2224/05691 , H01L2224/061 , H01L2224/06155 , H01L2224/06505 , H01L2224/08058 , H01L2224/08238 , H01L2224/09055 , H01L2224/2731 , H01L2224/2732 , H01L2224/27515 , H01L2224/2761 , H01L2224/27825 , H01L2224/27831 , H01L2224/29008 , H01L2224/29011 , H01L2224/29013 , H01L2224/29017 , H01L2224/29023 , H01L2224/29082 , H01L2224/29101 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29191 , H01L2224/29563 , H01L2224/2957 , H01L2224/29582 , H01L2224/29624 , H01L2224/29644 , H01L2224/29647 , H01L2224/29655 , H01L2224/29664 , H01L2224/29666 , H01L2224/29671 , H01L2224/29684 , H01L2224/301 , H01L2224/30155 , H01L2224/30505 , H01L2224/32058 , H01L2224/32238 , H01L2224/33055 , H01L2224/80194 , H01L2224/80203 , H01L2224/80385 , H01L2224/80424 , H01L2224/80444 , H01L2224/80447 , H01L2224/80488 , H01L2224/8085 , H01L2224/80862 , H01L2224/8088 , H01L2224/80902 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83385 , H01L2224/834 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83488 , H01L2224/8385 , H01L2224/83862 , H01L2224/8388 , H01L2224/83902 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H05K3/325 , H05K2201/0367 , H05K2201/0382 , H05K2201/091 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/01023 , H01L2924/00 , H01L2924/01022 , H01L2924/01028
摘要: An electronic component mounting structure includes a substrate having a terminal, an electronic component having an active face, an electrode that is formed on the active face of the electronic component, a base resin that is formed on the active face, a first opening that is formed at the base resin to expose the electrode, and a conductive film that covers a part of a top surface of the base resin and that is electrically connected to the electrode via the first opening. Because the base resin is bonded to the substrate, the bonding strength between the conductive film located on the top surface of the base resin and the terminal of the substrate is increased. Therefore, the reliability of electrical connection between the conductive film and the terminal is improved.
摘要翻译: 一种电子部件安装结构,包括具有端子的基板,具有有源面的电子部件,形成在电子部件的主动面上的电极,形成在主动面上的基体树脂,第一开口部 形成在所述基体树脂上以露出所述电极;以及导电膜,其覆盖所述基础树脂的顶表面的一部分并且经由所述第一开口电连接到所述电极。 由于基体树脂与基板结合,所以位于基体树脂的上表面的导电膜与基板的端子之间的接合强度提高。 因此,提高了导电膜和端子之间的电连接的可靠性。
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公开(公告)号:US09570446B1
公开(公告)日:2017-02-14
申请号:US14974275
申请日:2015-12-18
申请人: Hyo Seok Woo , In Mo Kim , Bora Lee , Sun Young Kim , Hoo Sung Cho
发明人: Hyo Seok Woo , In Mo Kim , Bora Lee , Sun Young Kim , Hoo Sung Cho
IPC分类号: H01L23/48 , G01R31/28 , H01L23/485 , G01R1/067 , H01L27/105 , H01L23/00 , H01L23/522 , H01L21/66
CPC分类号: H01L22/32 , G01R1/067 , G01R31/28 , G11C5/025 , G11C29/1201 , G11C29/48 , G11C2029/5602 , H01L22/34 , H01L24/09 , H01L2224/08055 , H01L2224/09055
摘要: A semiconductor device includes a plurality of semiconductor devices, a plurality of metal lines electrically connected to at least one of the semiconductor devices, and a protective layer on the metal lines. The protective layer includes a plurality of open areas partially exposing the metal lines and which serves as pads. A first pad includes a first area that extends from at least one of the metal lines and at least one second area around and separated from the first area.
摘要翻译: 半导体器件包括多个半导体器件,电连接到至少一个半导体器件的多个金属线以及金属线上的保护层。 保护层包括部分地露出金属线并用作垫的多个开放区域。 第一垫包括从金属线中的至少一个延伸的第一区域和围绕第一区域分离的至少一个第二区域。
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公开(公告)号:US20100071946A1
公开(公告)日:2010-03-25
申请号:US12561526
申请日:2009-09-17
申请人: Nobuaki HASHIMOTO
发明人: Nobuaki HASHIMOTO
CPC分类号: H05K3/305 , G02F1/13458 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/80 , H01L24/83 , H01L2224/02311 , H01L2224/02313 , H01L2224/02373 , H01L2224/02377 , H01L2224/02379 , H01L2224/02381 , H01L2224/0239 , H01L2224/0331 , H01L2224/0332 , H01L2224/03515 , H01L2224/0361 , H01L2224/0362 , H01L2224/03831 , H01L2224/0519 , H01L2224/05191 , H01L2224/05548 , H01L2224/05551 , H01L2224/05553 , H01L2224/05556 , H01L2224/05572 , H01L2224/05582 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/0569 , H01L2224/05691 , H01L2224/061 , H01L2224/06155 , H01L2224/06505 , H01L2224/08058 , H01L2224/08238 , H01L2224/09055 , H01L2224/2731 , H01L2224/2732 , H01L2224/27515 , H01L2224/2761 , H01L2224/27825 , H01L2224/27831 , H01L2224/29008 , H01L2224/29011 , H01L2224/29013 , H01L2224/29017 , H01L2224/29023 , H01L2224/29082 , H01L2224/29101 , H01L2224/29124 , H01L2224/29144 , H01L2224/29147 , H01L2224/2919 , H01L2224/29191 , H01L2224/29563 , H01L2224/2957 , H01L2224/29582 , H01L2224/29624 , H01L2224/29644 , H01L2224/29647 , H01L2224/29655 , H01L2224/29664 , H01L2224/29666 , H01L2224/29671 , H01L2224/29684 , H01L2224/301 , H01L2224/30155 , H01L2224/30505 , H01L2224/32058 , H01L2224/32238 , H01L2224/33055 , H01L2224/80194 , H01L2224/80203 , H01L2224/80385 , H01L2224/80424 , H01L2224/80444 , H01L2224/80447 , H01L2224/80488 , H01L2224/8085 , H01L2224/80862 , H01L2224/8088 , H01L2224/80902 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83385 , H01L2224/834 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83488 , H01L2224/8385 , H01L2224/83862 , H01L2224/8388 , H01L2224/83902 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H05K3/325 , H05K2201/0367 , H05K2201/0382 , H05K2201/091 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , H01L2924/00014 , H01L2924/01023 , H01L2924/00 , H01L2924/01022 , H01L2924/01028
摘要: An electronic component mounting structure includes: an electronic component including a plurality of bump electrodes that includes a base resin provided on an active face of the electronic component and a plurality of conductive films that cover a part of a surface of the base resin, expose an area excluding the part of the surface, and are electrically coupled to a plurality of electrode terminals provided on the active face; and a substrate including a plurality of terminals. In the structure, the electronic component is mounted on the substrate, and the base resin includes: a first opening surrounding the plurality of the electrode terminals; a connection portion in which a part of one ends of the plurality of the conductive films that are drawn out on the surface of the base resin is disposed, the other ends of the conductive films being coupled to the electrode terminals; and a bonding portion that is bonded to the substrate, and is formed in an area excluding the first opening and the connection portion, and an elastic deformation of the base resin at the connection portion allows the bonding portion to bond the substrate so as to maintain the conductive films and the plurality of the terminals on the substrate in a bonded state.
摘要翻译: 电子部件安装结构包括:电子部件,包括多个突起电极,所述突起电极包括设置在所述电子部件的有效面上的基体树脂和覆盖所述基础树脂的表面的一部分的多个导电膜, 并且电耦合到设置在有源面上的多个电极端子; 以及包括多个端子的基板。 在该结构中,电子部件安装在基板上,基体树脂包括:围绕多个电极端子的第一开口; 所述多个导电膜的一端的一部分被设置在所述基体树脂的表面上的连接部,所述导电膜的另一端与所述电极端子连接; 以及接合部,其接合到所述基板,并且形成在除了所述第一开口和所述连接部之外的区域中,并且所述基部树脂在所述连接部处的弹性变形使得所述接合部分接合所述基板以便保持 导电膜和处于接合状态的基板上的多个端子。
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