Method and apparatus for displaying graphical user interface depending on a user's contact pattern
    3.
    发明授权
    Method and apparatus for displaying graphical user interface depending on a user's contact pattern 有权
    用于根据用户的接触模式显示图形用户界面的方法和装置

    公开(公告)号:US08749510B2

    公开(公告)日:2014-06-10

    申请号:US13928010

    申请日:2013-06-26

    Abstract: A graphical user interface (GUI) may be displayed on a display unit in an apparatus which may include a tactile sensor unit. When a contact by a user is detected at the tactile sensor unit, a control unit may receive a contact detection signal therefrom. Based on the contact detection signal, the control unit may determine a contact pattern and may then display the GUI corresponding to the contact pattern. The GUI may be displayed and modified depending on the location and pressure of contacts by a user's manipulating fingers. Therefore, a user can manipulate the apparatus without any inconvenience or accidental touches.

    Abstract translation: 可以在可以包括触觉传感器单元的装置中的显示单元上显示图形用户界面(GUI)。 当在触觉传感器单元处检测到用户的接触时,控制单元可以从其接收接触检测信号。 基于接触检测信号,控制单元可以确定接触图案,然后可以显示与接触图案对应的GUI。 可以根据用户的操纵手指的触点的位置和压力​​来显示和修改GUI。 因此,用户可以在没有任何不便或意外触摸的情况下操纵该设备。

    Semiconductor package
    5.
    发明授权

    公开(公告)号:US11450614B2

    公开(公告)日:2022-09-20

    申请号:US17035000

    申请日:2020-09-28

    Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

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