公开(公告)号：US12051680B2

公开(公告)日：2024-07-30

申请号：US17735158

申请日：2022-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Hwan Kim ,  Hyung Gil Baek ,  Young-Ja Kim ,  Kang Gyune Lee ,  Sang-Won Lee ,  Yong Kwan Lee

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/162 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/165 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/165 ,  H01L2924/1659 ,  H01L2924/182

Abstract: A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.

公开(公告)号：US11450614B2

公开(公告)日：2022-09-20

申请号：US17035000

申请日：2020-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Joo Kim ,  Sun Chul Kim ,  Min Keun Kwak ,  Hyun Ki Kim ,  Hyung Gil Baek ,  Yong Kwan Lee

IPC: H01L23/48 ,  H01L23/538 ,  H01L25/10 ,  H01L25/18 ,  H01L21/48 ,  H01L23/498

Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

公开(公告)号：US11862570B2

公开(公告)日：2024-01-02

申请号：US17891190

申请日：2022-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Joo Kim ,  Sun Chul Kim ,  Min Keun Kwak ,  Hyun Ki Kim ,  Hyung Gil Baek ,  Yong Kwan Lee

IPC: H01L23/48 ,  H01L23/538 ,  H01L25/10 ,  H01L25/18 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L23/5385 ,  H01L21/4846 ,  H01L23/49833 ,  H01L23/5389 ,  H01L25/105 ,  H01L25/18 ,  H01L23/49827 ,  H01L2225/107 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058

Abstract: There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.