公开(公告)号：US20140225139A1

公开(公告)日：2014-08-14

申请号：US14079249

申请日：2013-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myoung Bo PARK ,  Ho Young SONG

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/0008 ,  H01L33/0033 ,  H01L33/0041 ,  H01L33/005 ,  H01L33/382 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0008 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A light emitting device package includes a frame unit including at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the two lead frames; a light emitting device mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and electrically connected to the lead frames; a wavelength conversion unit provided in the light emitting region, and configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength; and a reflective molding unit formed on the surface of the frame unit to cover the light emitting device.

Abstract translation: 发光器件封装包括框架单元，其包括彼此间隔开的至少两个引线框架和由两个引线框架之间的距离限定的发光区域; 安装在所述框架单元的表面上的发光器件，使得所述发光器件位于所述发光区域的两侧，并且电连接到所述引线框架; 波长转换单元，设置在所述发光区域中，并且被配置为转换从所述发光器件发射的光的波长并发射具有所述转换波长的光; 以及形成在框架单元的表面上以覆盖发光器件的反射模制单元。

公开(公告)号：US20150109803A1

公开(公告)日：2015-04-23

申请号：US14490475

申请日：2014-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung Bo PARK ,  Kyung Seok OH ,  Ho Young SONG

IPC: H01L33/38 ,  F21K99/00 ,  F21V23/00 ,  H01L33/40 ,  H01L33/42

CPC classification number: H01L33/38 ,  H01L33/405 ,  H01L33/42 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and second electrode structures using a wire. The LED chip includes a light emitting structure and first and second electrode parts. At least one of the first and second electrode parts includes a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire, and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole filled with the wire. The at least one through hole allows a top surface of the bonding electrode layer to be exposed therebelow.

Abstract translation: 半导体LED封装包括具有第一和第二电极结构的封装体和使用导线连接到第一和第二电极结构中的至少一个的LED芯片。 LED芯片包括发光结构和第一和第二电极部分。 第一电极部分和第二电极部分中的至少一个包括由与导线的材料组成相同的材料制成的接合电极层，并且接合到导线上，以及不平坦电极层，设置在接合电极层上并且至少具有 一个充满电线的通孔。 至少一个通孔允许接合电极层的顶表面暴露在其下面。

公开(公告)号：US20140131748A1

公开(公告)日：2014-05-15

申请号：US13841733

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho Young SONG

IPC: H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: There is provided a light emitting device package including: a package substrate; a blue light emitting device and a green light emitting device mounted on the package substrate; a flow prevention part formed on the package substrate and substantially enclosing the blue light emitting device; and a wavelength conversion part including a red wavelength conversion material and formed on a region defined by the flow prevention part to cover the blue light emitting device, so that white light having a high degree of color reproducibility may be emitted thereby.

Abstract translation: 提供一种发光器件封装，包括：封装衬底; 蓝色发光器件和安装在封装衬底上的绿色发光器件; 形成在所述封装基板上并基本上包围所述蓝色发光器件的防流体部; 以及包括红色波长转换材料并形成在由防流体部分限定的区域上以覆盖蓝色发光器件的波长转换部分，从而可以发射具有高度色彩再现性的白光。

公开(公告)号：US20170244012A1

公开(公告)日：2017-08-24

申请号：US15400217

申请日：2017-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Hwan CHOI ,  Ho Young SONG

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/16245 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A lead frame includes a bonding part to bond to a semiconductor chip, a first trench in the bonding part along a first central axis, the first central axis dividing the bonding part into two parts, and second trenches in the bonding part along a second central axis, the second central axis dividing the bonding part into two parts, and the first and second central axes vertically intersecting each other.

公开(公告)号：US20190333573A1

公开(公告)日：2019-10-31

申请号：US16059791

申请日：2018-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoon SHIN ,  Do Yeon KIM ,  Ho Young SONG

IPC: G11C11/406 ,  G11C11/4091

Abstract: A semiconductor memory device and a memory system having the same are provided. The semiconductor memory device includes a memory cell array including plural memory cell array blocks, and a refresh controller configured to control the memory cell array blocks to perform a normal refresh operation and a hammer refresh operation. The refresh controller controls one or more third memory cell array blocks excluding a first memory cell array block and one or more second memory cell array blocks adjacent to the first memory cell array block to perform the hammer refresh operation while the normal refresh operation is performed on the first memory cell array block among the memory cell array blocks.

公开(公告)号：US20190326480A1

公开(公告)日：2019-10-24

申请号：US16223990

申请日：2018-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Sung YOU ,  Ho Sun PAEK ,  Ho Young SONG ,  Jun Bum LEE

IPC: H01L33/50 ,  H01L33/40 ,  H05B33/08 ,  H01L33/10 ,  H01L33/26

Abstract: A light emitting diode (LED) module includes: a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite the first surface; a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.