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1.发明授权公开(公告)号：US10673285B2
公开(公告)日：2020-06-02
申请号：US16283182
申请日：2019-02-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Mincheol Ha , Changhak O , Kwangseob Kim , Dongzo Kim , Jiwon Kim , Jongchul Hong , Kihyun Kim , Yunjeong Noh , Jaewan Park , Hyungkoo Chung , Jihye Kim , Keumsu Song , Yongsang Yun , Sangmoo Hwangbo
Abstract: Various embodiments related to electronic devices are set forth herein. According to an embodiment, an electronic device comprises a coil, a power transmitting circuit electrically connected with the coil, a sensing circuit, and a control circuit. The control circuit is configured to wirelessly output, using the power transmitting circuit, a first designated power through the coil to an external electronic device, and identify, using the sensing circuit, first energy detected at the coil due to a foreign object of the electronic device. The control circuit is further configured to, when a magnitude of the energy falls within a first designated range, output, using the power transmitting circuit, a second designated power to the external electronic device, and when the magnitude of the energy falls within a second designated range, abstain from outputting the power to the external electronic device using the power transmitting circuit. Other embodiments are possible as well.
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Patent Agency Ranking
2.发明申请COMPOSITIONS FOR ETCHING AND METHODS OF FORMING A SEMICONDUCTOR DEVICE USING THE SAME 审中-公开用于蚀刻的组合物和使用其形成半导体器件的方法公开(公告)号：US20150104932A1
公开(公告)日：2015-04-16
申请号：US14573845
申请日：2014-12-17
Applicant: Samsung Electronics Co., Ltd. , Soulbrain Co., Ltd.
Inventor： Young Taek Hong , Jinuk Lee , Junghun Lim , Jaewan Park , Chanjin Jeong , Hoon Han , Seonghwan Park , Yanghwa Lee , Sang Won Bae , Daehong Eom , Byoungmoon Yoon , Jihoon Jeong , Kyunghyun Kim , Kyounghwan Kim , ChangSup Mun , Se-Ho Cha , Yongsun Ko
IPC: H01L21/02 , H01L27/115 , C09K13/06
CPC classification number: H01L21/02658 , C09K13/04 , C09K13/06 , C23F1/16 , H01L21/31111 , H01L27/11556 , H01L27/11582 , H01L29/66825 , H01L29/66833 , H01L29/7889 , H01L29/7926
Abstract: Etching compositions are provided. The etching composition includes a phosphoric acid, ammonium ions and a silicon compound. The silicon compound includes a silicon atom, an atomic group having an amino group combined with the silicon atom, and at least two oxygen atoms combined with the silicon atom. Methods utilizing the etching compositions are also provided.
Abstract translation: 提供蚀刻组合物。 蚀刻组合物包括磷酸，铵离子和硅化合物。 硅化合物包括硅原子，具有与硅原子结合的氨基的原子团以及与硅原子结合的至少两个氧原子。 还提供了利用蚀刻组合物的方法。
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公开(公告)号：US12095176B2
公开(公告)日：2024-09-17
申请号：US17682615
申请日：2022-02-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghue Hong , Jaewan Park , Minsung Koo , Minsoo Sohn , Woosung Lee
Abstract: An electronic device is provided. The electronic device includes an antenna, a wireless communication module electrically connected to the antenna, a flexible printed circuit board (FPCB) including a first feeding element and a second feeding element which are electrically connected to the wireless communication module, a substrate disposed above the first feeding element and the second feeding element, a first conductive pattern including a first coupling hole and a second conductive pattern including a second coupling hole, which are formed on the upper surface of the substrate, a first coupling fastener configured to penetrate the first coupling hole and the first feeding element and electrically connect the first conductive pattern and the first feeding element, and a second coupling fastener configured to penetrate the second coupling hole and the second feeding element and electrically connect the second conductive pattern and the second feeding element.
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公开(公告)号：US20150348799A1
公开(公告)日：2015-12-03
申请号：US14824786
申请日：2015-08-12
Applicant: Samsung Electronics Co., Ltd. , Soulbrain Co., Ltd.
Inventor： Young Taek Hong , Jinuk Lee , Junghun Lim , Jaewan Park , Chanjin Jeong , Hoon Han , Seonghwan Park , Yanghwa Lee , Sang Won Bae , Daehong Eom , Byoungmoon Yoon , Jihoon Jeong , Kyunghyun Kim , Kyounghwan Kim , ChangSup Mun , Se-Ho Cha , Yongsun Ko
IPC: H01L21/311 , H01L27/115 , H01L29/66 , C09K13/06
CPC classification number: H01L29/7926 , C09K13/04 , C09K13/06 , C23F1/16 , H01L21/31111 , H01L27/11556 , H01L27/11582 , H01L29/66825 , H01L29/66833 , H01L29/7889
Abstract: Etching compositions are provided. The etching composition includes a phosphoric acid, ammonium ions and a silicon compound material. The silicon compound material includes a silicon atom, at least one selected from the group of a nitrogen atom, a phosphorus atom and a sulfur atom combined with the silicon atom, and at least two oxygen atoms combined with the silicon atom. Methods utilizing the etching compositions are also provided.
Abstract translation: 提供蚀刻组合物。 蚀刻组合物包括磷酸，铵离子和硅化合物材料。 硅化合物材料包括硅原子，选自氮原子，磷原子和与硅原子结合的硫原子中的至少一种，以及与硅原子结合的至少两个氧原子。 还提供了利用蚀刻组合物的方法。
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公开(公告)号：US09136120B2
公开(公告)日：2015-09-15
申请号：US14573845
申请日：2014-12-17
Applicant: Samsung Electronics Co., Ltd. , Soulbrain Co., Ltd.
Inventor： Young Taek Hong , Jinuk Lee , Junghun Lim , Jaewan Park , Chanjin Jeong , Hoon Han , Seonghwan Park , Yanghwa Lee , Sang Won Bae , Daehong Eom , Byoungmoon Yoon , Jihoon Jeong , Kyunghyun Kim , Kyounghwan Kim , ChangSup Mun , Se-Ho Cha , Yongsun Ko
IPC: H01L21/302 , H01L21/02 , C09K13/04 , C23F1/16 , C09K13/06 , H01L21/311 , H01L29/66 , H01L29/788 , H01L29/792 , H01L27/115
CPC classification number: H01L21/02658 , C09K13/04 , C09K13/06 , C23F1/16 , H01L21/31111 , H01L27/11556 , H01L27/11582 , H01L29/66825 , H01L29/66833 , H01L29/7889 , H01L29/7926
Abstract: Etching compositions are provided. The etching composition includes a phosphoric acid, ammonium ions and a silicon compound. The silicon compound includes a silicon atom, an atomic group having an amino group combined with the silicon atom, and at least two oxygen atoms combined with the silicon atom. Methods utilizing the etching compositions are also provided.
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公开(公告)号：US09368647B2
公开(公告)日：2016-06-14
申请号：US14824786
申请日：2015-08-12
Applicant: Samsung Electronics Co., Ltd. , Soulbrain Co., Ltd.
Inventor： Young-Taek Hong , Jinuk Lee , Junghun Lim , Jaewan Park , Chanjin Jeong , Hoon Han , Seonghwan Park , Yanghwa Lee , Sang Won Bae , Daehong Eom , Byoungmoon Yoon , Jihoon Jeong , Kyunghyun Kim , Kyounghwan Kim , ChangSup Mun , Se-Ho Cha , Yongsun Ko
IPC: C09K13/04 , H01L29/792 , C09K13/06 , C23F1/16 , H01L21/311 , H01L29/66 , H01L29/788 , H01L27/115
CPC classification number: H01L29/7926 , C09K13/04 , C09K13/06 , C23F1/16 , H01L21/31111 , H01L27/11556 , H01L27/11582 , H01L29/66825 , H01L29/66833 , H01L29/7889
Abstract: Etching compositions are provided. The etching composition includes a phosphoric acid, ammonium ions and a silicon compound material. The silicon compound material includes a silicon atom, at least one selected from the group of a nitrogen atom, a phosphorus atom and a sulfur atom combined with the silicon atom, and at least two oxygen atoms combined with the silicon atom. Methods utilizing the etching compositions are also provided.
Abstract translation: 提供蚀刻组合物。 蚀刻组合物包括磷酸，铵离子和硅化合物材料。 硅化合物材料包括硅原子，选自氮原子，磷原子和与硅原子结合的硫原子中的至少一种，以及与硅原子结合的至少两个氧原子。 还提供了利用蚀刻组合物的方法。
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