公开(公告)号：US08748312B2

公开(公告)日：2014-06-10

申请号：US13722456

申请日：2012-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Wan Seo ,  Hyung Kun Kim

IPC: H01L21/44

CPC classification number: H01L21/50 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing a substrate for mounting an electronic device, includes forming at least one through-hole in a plate-shaped substrate body in a thickness direction thereof. An electrode substrate having at least one core on an upper surface thereof is formed such that the at least one core corresponds to the at least one through-hole. The electrode substrate is coupled to the substrate body by inserting the at least one core into the at least one through-hole. A portion of the coupled electrode substrate is removed except for the at least one core.

Abstract translation: 一种制造用于安装电子装置的基板的方法，包括在板状基板主体的厚度方向上形成至少一个通孔。 在其上表面上具有至少一个芯的电极基板形成为使得至少一个芯对应于至少一个通孔。 通过将至少一个芯插入到至少一个通孔中，将电极基板连接到基板主体。 除了至少一个芯之外，除去耦合的电极基板的一部分。

公开(公告)号：US10008642B2

公开(公告)日：2018-06-26

申请号：US15364739

申请日：2016-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Wan Seo ,  Jin Ha Kim ,  Kwang Bok Woo ,  Dong Hoon Lee ,  Won Joon Lee ,  Sun Hwan Hwang

IPC: H01L33/50 ,  H01L33/38 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L33/504 ,  H01L33/38 ,  H01L33/46 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/56 ,  H01L33/62

Abstract: A semiconductor light emitting device may include a semiconductor light emitting diode (LED) chip, a light-transmitting film on the LED chip, and a light-transmitting bonding layer between the light-transmitting film and the semiconductor LED chip. At least one of the light-transmitting film and the light-transmitting bonding layer may include a wavelength conversion material configured to convert light emitted by the semiconductor LED chip into light having a wavelength different from a wavelength of the emitted light. The light-transmitting bonding layer may have a lateral inclined region extending to the lateral surface to form an inclined surface. The semiconductor light emitting device may further include a reflective packaging portion surrounding the light-transmitting bonding layer, covering the first surface such that an electrode of the LED chip is at least partially exposed. The reflective packaging portion may include a reflective material.

公开(公告)号：US09472740B2

公开(公告)日：2016-10-18

申请号：US14612049

申请日：2015-02-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Wan Seo ,  Kun Yoo Ko ,  Jae Hee Lee

IPC: H01L29/49 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting diode (LED) package may include a package body provided with a pair of lead frames, and an LED chip mounted on the package body and electrically connected to the lead frames through wire bonding. Each lead frame may include a first reflective layer disposed on a mounting surface on which the LED chip is disposed and a second reflective layer disposed on the first reflective layer. A wire may penetrate through the second reflective layer to be connected to the first reflective layer. Accordingly, the LED package may provide the uniform amount of light by suppressing discoloration of the lead frames, and the manufacturing time of the LED package may be reduced, leading to a reduction in manufacturing costs.

Abstract translation: 发光二极管（LED）封装可以包括设置有一对引线框的封装体和安装在封装主体上并通过引线接合电连接到引线框的LED芯片。 每个引线框架可以包括设置在其上设置LED芯片的安装表面上的第一反射层和设置在第一反射层上的第二反射层。 导线可穿透第二反射层以连接到第一反射层。 因此，LED封装可以通过抑制引线框架的变色来提供均匀的光量，并且可以减少LED封装的制造时间，导致制造成本的降低。