公开(公告)号：US20170012025A1

公开(公告)日：2017-01-12

申请号：US15274453

申请日：2016-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heung-Kyu KWON ,  Jong-Kook KIM ,  Ji-Chul KIM ,  Byeong-Yeon CHO

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498 ,  H01L21/66 ,  H01L21/48

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L22/10 ,  H01L22/14 ,  H01L23/3128 ,  H01L23/488 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package.

Abstract translation: 可以提供包括安装基板，安装在安装基板的上表面上的第一半导体芯片，堆叠在第一半导体芯片上的单元封装的半导体封装。 单元封装包括封装衬底和安装在封装衬底上的第二半导体芯片。 多个接合线连接安装基板的接合焊盘和单元封装的连接焊盘，从而将第一和第二半导体芯片彼此电连接。 在安装基板上设置成型部件，以覆盖第一半导体芯片和单元封装。

公开(公告)号：US20130256916A1

公开(公告)日：2013-10-03

申请号：US13756724

申请日：2013-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heung-Kyu KWON ,  Jong-Kook KIM ,  Ji-Chul KIM ,  Byeong-Yeon CHO

IPC: H01L23/488

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L22/10 ,  H01L22/14 ,  H01L23/3128 ,  H01L23/488 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package.

Abstract translation: 可以提供包括安装基板，安装在安装基板的上表面上的第一半导体芯片，堆叠在第一半导体芯片上的单元封装的半导体封装。 单元封装包括封装衬底和安装在封装衬底上的第二半导体芯片。 多个接合线连接安装基板的接合焊盘和单元封装的连接焊盘，从而将第一和第二半导体芯片彼此电连接。 在安装基板上设置模制构件以覆盖第一半导体芯片和单元封装。