公开(公告)号：US20180331071A1

公开(公告)日：2018-11-15

申请号：US15971600

申请日：2018-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heung-Kyu KWON ,  Min-Ok NA ,  Sung-Woo PARK ,  Ji-Hyun PARK ,  Su-Min PARK

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31 ,  H01L25/18 ,  H01L25/10 ,  H01L23/552

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/0557 ,  H01L2224/13099 ,  H01L2224/14181 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01064 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

公开(公告)号：US20190319012A1

公开(公告)日：2019-10-17

申请号：US16448392

申请日：2019-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heung-Kyu KWON ,  Min-Ok NA ,  Sung-Woo Park ,  Ji-Hyun Park ,  Su-Min Park

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/18 ,  H01L25/10 ,  H01L23/552 ,  H01L23/498 ,  H01L25/00

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

公开(公告)号：US20160358893A1

公开(公告)日：2016-12-08

申请号：US15241452

申请日：2016-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heung-Kyu KWON ,  Min-Ok NA ,  Sung-Woo PARK ,  Ji-Hyun PARK ,  Su-Min PARK

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13099 ,  H01L2224/14181 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01064 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract translation: 一种装置包括具有第一焊盘的第一衬底和具有第二焊盘的第二衬底。 第一模塑料置于第一基材和第二基材之间。 第一半导体芯片设置在第一基板上并与第一模制部分接触。 第一连接器接触第一焊盘，第二连接器接触第二焊盘。 第二连接器设置在第一连接器上。 第二连接器的体积大于第一连接器的体积。 露出第一半导体芯片的表面。 第一模塑料与第二连接器相接触，第二连接器的至少一部分由第一模塑料包围。

公开(公告)号：US20170012025A1

公开(公告)日：2017-01-12

申请号：US15274453

申请日：2016-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Heung-Kyu KWON ,  Jong-Kook KIM ,  Ji-Chul KIM ,  Byeong-Yeon CHO

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498 ,  H01L21/66 ,  H01L21/48

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L22/10 ,  H01L22/14 ,  H01L23/3128 ,  H01L23/488 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package.

Abstract translation: 可以提供包括安装基板，安装在安装基板的上表面上的第一半导体芯片，堆叠在第一半导体芯片上的单元封装的半导体封装。 单元封装包括封装衬底和安装在封装衬底上的第二半导体芯片。 多个接合线连接安装基板的接合焊盘和单元封装的连接焊盘，从而将第一和第二半导体芯片彼此电连接。 在安装基板上设置成型部件，以覆盖第一半导体芯片和单元封装。

公开(公告)号：US20130256916A1

公开(公告)日：2013-10-03

申请号：US13756724

申请日：2013-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heung-Kyu KWON ,  Jong-Kook KIM ,  Ji-Chul KIM ,  Byeong-Yeon CHO

IPC: H01L23/488

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L22/10 ,  H01L22/14 ,  H01L23/3128 ,  H01L23/488 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48157 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85005 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package.

Abstract translation: 可以提供包括安装基板，安装在安装基板的上表面上的第一半导体芯片，堆叠在第一半导体芯片上的单元封装的半导体封装。 单元封装包括封装衬底和安装在封装衬底上的第二半导体芯片。 多个接合线连接安装基板的接合焊盘和单元封装的连接焊盘，从而将第一和第二半导体芯片彼此电连接。 在安装基板上设置模制构件以覆盖第一半导体芯片和单元封装。