Abstract:
A duty cycle error accumulation circuit includes first to nth delay units and a feedback unit. The first to nth delay units receive a clock signal, a first input signal and a second input signal, respectively, to generate a first output signal and a second output signal by delaying one signal selected from first and second input signals based on a logic level of the clock signal. The feedback unit supplies second input signal to a kth delay unit based on second output signal of a (k+1)th delay unit. The first output signal of the kth delay unit is supplied to the (k+1)th delay unit as first input signal, and the clock signal is supplied to the first delay unit as first input signal and to the nth delay unit as second input signal. The duty cycle error accumulation circuit effectively corrects a duty cycle of a clock signal.
Abstract:
A digital measurement circuit includes a first input flip-flop which receives a first signal through a data input terminal, receives a first clock signal through a clock input terminal, and outputs a second signal; a second input flip-flop which receives the second signal through a data input terminal, receives a second clock signal, which is an inverted signal of the first clock signal, through a clock input terminal, and outputs a third signal; and a delay line which receives the second signal and outputs first through n-th output signals, wherein n is an integer greater than one, and the first through n-th output signals are sampled based on the third signal to output first through n-th sampling signals is provided.
Abstract:
A semiconductor chip including a plurality of input/output units includes: a plurality of additional pads disposed on a surface of the semiconductor chip, wherein the plurality of additional pads include at least one of a first additional pad to which a ground voltage is applied and a second additional pad to which a power supply voltage is applied; and a plurality of pads disposed on the surface of the semiconductor chip, wherein the plurality of pads include at least one of a first pad to which the ground voltage is applied and a second pad to which the power supply voltage is applied, and further include a third pad through which a signal is input and/or output. The at least one of the first additional pad and the second additional pad is disposed on an input/output unit where the third pad is disposed, among the plurality of input/output units.
Abstract:
A digital measurement circuit includes a first input flip-flop which receives a first signal through a data input terminal, receives a first clock signal through a clock input terminal, and outputs a second signal; a second input flip-flop which receives the second signal through a data input terminal, receives a second clock signal, which is an inverted signal of the first clock signal, through a clock input terminal, and outputs a third signal; and a delay line which receives the second signal and outputs first through n-th output signals, wherein n is an integer greater than one, and the first through n-th output signals are sampled based on the third signal to output first through n-th sampling signals is provided.
Abstract:
An interface circuit may include a first FIFO circuit and a second FIFO circuit. The first FIFO circuit may generate first output data based on a first sampling signal and a second sampling signal. The second FIFO circuit may generate second output data based on a third sampling signal and a fourth sampling signal. The first FIFO circuit and the second FIFO circuit may be cross-reset.
Abstract:
A semiconductor chip including a plurality of input/output units includes: a plurality of additional pads disposed on a surface of the semiconductor chip, wherein the plurality of additional pads include at least one of a first additional pad to which a ground voltage is applied and a second additional pad to which a power supply voltage is applied; and a plurality of pads disposed on the surface of the semiconductor chip, wherein the plurality of pads include at least one of a first pad to which the ground voltage is applied and a second pad to which the power supply voltage is applied, and further include a third pad through which a signal is input and/or output. The at least one of the first additional pad and the second additional pad is disposed on an input/output unit where the third pad is disposed, among the plurality of input/output units.