公开(公告)号：US20210202276A1

公开(公告)日：2021-07-01

申请号：US17198938

申请日：2021-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung-Yoon SONG ,  Chan-Hoon PARK ,  Jong-Woo SUN ,  Jung-Mo SUNG ,  Je-Woo HAN ,  Jin-Young PARK

IPC: H01L21/67 ,  H01J37/32

Abstract: In a plasma processing method, a substrate is loaded onto a lower electrode within a chamber. A plasma power is applied to form plasma within the chamber. A voltage function of a nonsinusoidal wave having a DC pulse portion and a ramp portion is generated. Generating the voltage function may include setting a slope of the ramp portion and setting a duration ratio of the ramp portion to a cycle of the voltage function in order to control an ion energy distribution generated at a surface of the substrate. A bias power of the nonsinusoidal wave is applied to the lower electrode.

公开(公告)号：US20190301937A1

公开(公告)日：2019-10-03

申请号：US16238644

申请日：2019-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeong-Il MUN ,  Hyung-Joo LEE ,  Jong-Woo SUN ,  Ja-Myung GU ,  Jae-Woong HWANG ,  Jong-Hwan AN

IPC: G01J3/443 ,  G01N21/73

Abstract: A calibrator of an OES may include a cover, a reference light source and a controller. The cover may be detachably combined with a ceiling of a plasma chamber of a plasma processing apparatus. The reference light source may be installed at the cover to irradiate a reference light to the OES through an inner space of the plasma chamber. The controller may compare a spectrum of the reference light inputted into the OES with a spectrum of an actual light inputted into the OES during a plasma process in the plasma chamber to calibrate the OES. Thus, the OES may be calibrated without disassembling of the OES from the plasma chamber to decrease a time for calibrating the OES.

公开(公告)号：US20200066499A1

公开(公告)日：2020-02-27

申请号：US16395532

申请日：2019-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyeong-Hun KIM ,  Jeong-Il MUN ,  Hyung-Joo LEE ,  Jong-Woo SUN ,  Dong-Kyu KIM

IPC: H01J37/32 ,  G01N21/68 ,  G01J3/443 ,  G01J3/02

Abstract: Provided is a plasma monitoring apparatus including an objective lens configured to collect light that is emitted from plasma and passes through an optical window of a chamber, a beam splitter configured to divide the light collected by the objective lens into first light and second light, a first optical system and a second optical system that are provided on a first optical path of the first light and a second optical path of the second light, respectively, the first optical system and the second optical system having different focal lengths such that focal points of the first optical system and the second optical system are set at different regions in the plasma, and a light detector configured to detect the first light that has passed through the first optical system and the second light that has passed through the second optical system.

公开(公告)号：US20200027705A1

公开(公告)日：2020-01-23

申请号：US16268790

申请日：2019-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Nam KIM ,  Sung-Yeon KIM ,  Hyung-Jun KIM ,  Jong-Woo SUN ,  Sang-Rok OH ,  Jung-Pyo HONG

IPC: H01J37/32 ,  H01L21/683

Abstract: A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.

公开(公告)号：US20170062245A1

公开(公告)日：2017-03-02

申请号：US15142629

申请日：2016-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Pyo Hong ,  Kwang-Nam KIM ,  Sang-Dong KWON ,  Jong-Woo SUN ,  Sang-Rok OH ,  Yong-Moon JANG

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32009 ,  H01J37/321 ,  H01J37/32119 ,  H01L21/67248

Abstract: Provided are substrate processing apparatuses including a temperature measurement unit. The substrate processing apparatus comprises a chamber including a substrate processing region, a dielectric sheet that is disposed on the substrate processing region and includes an insertion hole and a temperature measurement unit that is disposed on the dielectric sheet to measure the temperature of the dielectric sheet, and has a screw portion inserted into the insertion hole, wherein each of the insertion hole and the screw portion has thread helixes meshed with each other.

Abstract translation: 提供了包括温度测量单元的衬底处理设备。 基板处理装置包括：室，包括基板处理区域，设置在基板处理区域上并且包括插入孔的电介质片和设置在电介质片上以测量电介质片材的温度的温度测量单元， 并且具有插入到所述插入孔中的螺纹部分，其中所述插入孔和所述螺纹部分中的每一个具有彼此啮合的螺纹螺旋。