公开(公告)号：US20170032987A1

公开(公告)日：2017-02-02

申请号：US15096555

申请日：2016-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung-Joo LEE ,  Kwang-Nam KIM ,  Jong-Seo HONG ,  Kye-Hyun BAEK ,  Masayuki TOMOYASU

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32642 ,  H01J37/32009 ,  H01J2237/334 ,  H01L21/6831 ,  H01L21/68735

Abstract: Disclosed are a dry etching apparatus and a method of etching a substrate using the same. The apparatus includes a base at a lower portion of process chamber in which a dry etching process is performed, a substrate holder arranged on the base and holding a substrate on which a plurality of pattern structures is formed by the etching process, a focus ring enclosing the substrate holder and uniformly focusing an etching plasma to a sheath area over the substrate, a driver driving the focus ring in a vertical direction perpendicular to the base and a position controller controlling a vertical position of the focus ring by selectively driving the driver in accordance with inspection results of the pattern structures. Accordingly, the gap distance between the substrate and the focus ring is automatically controlled to thereby increase the uniformity of the etching plasma over the substrate.

Abstract translation: 公开了一种干式蚀刻装置和使用其进行蚀刻的基板的方法。 该设备包括在处理室的下部处的基座，其中执行干法蚀刻工艺;衬底保持器，其布置在基底上并保持通过蚀刻工艺在其上形成多个图案结构的衬底;聚焦环封闭 衬底保持器并且均匀地将蚀刻等离子体聚焦到衬底上的护套区域上，驱动聚焦环的垂直方向与基座垂直的驱动器以及控制聚焦环的垂直位置的位置控制器通过根据 具有图案结构的检查结果。 因此，自动控制基板与聚焦环之间的间隙距离，从而增加蚀刻等离子体在基板上的均匀性。

公开(公告)号：US20200027705A1

公开(公告)日：2020-01-23

申请号：US16268790

申请日：2019-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Nam KIM ,  Sung-Yeon KIM ,  Hyung-Jun KIM ,  Jong-Woo SUN ,  Sang-Rok OH ,  Jung-Pyo HONG

IPC: H01J37/32 ,  H01L21/683

Abstract: A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.

公开(公告)号：US20170062245A1

公开(公告)日：2017-03-02

申请号：US15142629

申请日：2016-04-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Pyo Hong ,  Kwang-Nam KIM ,  Sang-Dong KWON ,  Jong-Woo SUN ,  Sang-Rok OH ,  Yong-Moon JANG

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01J37/32715 ,  H01J37/32009 ,  H01J37/321 ,  H01J37/32119 ,  H01L21/67248

Abstract: Provided are substrate processing apparatuses including a temperature measurement unit. The substrate processing apparatus comprises a chamber including a substrate processing region, a dielectric sheet that is disposed on the substrate processing region and includes an insertion hole and a temperature measurement unit that is disposed on the dielectric sheet to measure the temperature of the dielectric sheet, and has a screw portion inserted into the insertion hole, wherein each of the insertion hole and the screw portion has thread helixes meshed with each other.

Abstract translation: 提供了包括温度测量单元的衬底处理设备。 基板处理装置包括：室，包括基板处理区域，设置在基板处理区域上并且包括插入孔的电介质片和设置在电介质片上以测量电介质片材的温度的温度测量单元， 并且具有插入到所述插入孔中的螺纹部分，其中所述插入孔和所述螺纹部分中的每一个具有彼此啮合的螺纹螺旋。