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    HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF DRIVING THE SAME
    1.
    发明申请
    HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF DRIVING THE SAME 有权
    高电子移动性晶体管及其驱动方法

    公开(公告)号：US20140103969A1

    公开(公告)日：2014-04-17

    申请号：US13868579

    申请日：2013-04-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Woo-chul JEON ,  Jong-seob KIM ,  Ki-yeol PARK ,  Young-hwan PARK ,  Jae-joon OH ,  Jong-bong HA ,  Jai-kwang SHIN

    IPC: H01L29/778 ,  H03K3/012

    CPC classification number: H01L29/7781 ,  H01L29/0619 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/42316 ,  H01L29/66431 ,  H01L29/66462 ,  H01L29/778 ,  H01L29/7782 ,  H01L29/7786 ,  H03K3/012

    Abstract: According to example embodiments, a HEMT includes a channel layer, a channel supply layer on the channel layer, a source electrode and a drain electrode spaced apart on the channel layer, a depletion-forming layer on the channel supply layer, and a plurality of gate electrodes on the depletion-forming layer between the source electrode and the drain electrode. The channel supply layer is configured to induce a two-dimensional electron gas (2DEG) in the channel layer. The depletion-forming layer is configured to form a depletion region in the 2DEG. The plurality of gate electrodes include a first gate electrode and a second gate electrode spaced apart from each other.

    Abstract translation: 根据示例性实施例，HEMT包括沟道层，沟道层上的沟道供应层，在沟道层上隔开的源电极和漏电极，沟道供应层上的耗尽形成层，以及多个 在源电极和漏电极之间的耗尽形成层上的栅电极。 通道供给层被配置为在通道层中诱导二维电子气（2DEG）。 耗尽形成层被配置为在2DEG中形成耗尽区。 多个栅电极包括彼此间隔开的第一栅电极和第二栅电极。

    HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME 有权
    高电子移动性晶体管及其制造方法

    公开(公告)号：US20130234207A1

    公开(公告)日：2013-09-12

    申请号：US13714957

    申请日：2012-12-14

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Hyuk-soon CHOI ,  Jong-seob KIM ,  Jai-kwang SHIN ,  Jae-joon OH ,  Jong-bong HA ,  In-jun HWANG

    IPC: H01L29/778 ,  H01L29/66

    CPC classification number: H01L29/778 ,  H01L29/2003 ,  H01L29/4175 ,  H01L29/66431 ,  H01L29/66462 ,  H01L29/7786

    Abstract: According to example embodiments, a high electron mobility transistor (HEMT) includes: stack including a buffer layer, a channel layer containing a two dimensional electron gas (2DEG) channel, and a channel supply layer sequentially stacked on each other, the stack defining a first hole and a second hole that are spaced apart from each other. A first electrode, a second electrode, and third electrode are spaced apart from each other along a first surface of the channel supply layer. A first pad is on the buffer layer and extends through the first hole of the stack to the first electrode. A second pad is on the buffer layer and extends through the second hole of the stack to the second electrode. A third pad is under the stack and electrically connected to the third electrode.

    Abstract translation: 根据示例性实施例，高电子迁移率晶体管（HEMT）包括：包括缓冲层的堆叠，包含二维电子气体（2DEG）通道的沟道层和相互堆叠的沟道供应层，所述堆叠限定 第一孔和彼此间隔开的第二孔。 第一电极，第二电极和第三电极沿着沟道供应层的第一表面彼此间隔开。 第一焊盘在缓冲层上并且延伸穿过堆叠的第一孔至第一电极。 第二焊盘位于缓冲层上并且延伸穿过堆叠的第二孔至第二电极。 第三焊盘在堆叠下方并电连接到第三电极。

    HIGH ELECTRON MOBILITY TRANSISTOR INCLUDING PLURALITY OF GATE ELECTRODES
    4.
    发明申请
    HIGH ELECTRON MOBILITY TRANSISTOR INCLUDING PLURALITY OF GATE ELECTRODES 有权
    高电位移动晶体管，包括门极电极的多孔性

    公开(公告)号：US20140151747A1

    公开(公告)日：2014-06-05

    申请号：US14018833

    申请日：2013-09-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Woo-chul JEON ,  Young-hwan PARK ,  Ki-yeol PARK ,  Jai-kwang SHIN ,  Jae-joon OH ,  Jong-bong HA ,  Sun-kyu HWANG

    IPC: H01L29/778

    CPC classification number: H01L29/42316 ,  H01L29/2003 ,  H01L29/7787

    Abstract: According to example embodiments, a high electron mobility transistor includes: a channel layer including a first semiconductor material; a channel supply layer on the channel layer and configured to generate a 2-dimensional electron gas (2DEG) in the channel layer, the channel supply layer including a second semiconductor material; source and drain electrodes spaced apart from each other on the channel layer, and an upper surface of the channel supply layer defining a gate electrode receiving part; a first gate electrode; and at least one second gate electrode spaced apart from the first gate electrode and in the gate electrode receiving part. The first gate electrode may be in the gate electrode receiving part and between the source electrode and the drain electrode. The at least one second gate electrode may be between the source electrode and the first gate electrode.

    Abstract translation: 根据示例性实施例，高电子迁移率晶体管包括：包括第一半导体材料的沟道层; 沟道供应层，其被配置为在所述沟道层中产生二维电子气（2DEG），所述沟道供给层包括第二半导体材料; 源极和漏极彼此间隔开，并且沟道供应层的上表面限定栅电极接收部分; 第一栅电极; 以及与第一栅电极和栅电极接收部分间隔开的至少一个第二栅电极。 第一栅电极可以在栅极电极接收部分中，并且在源电极和漏电极之间。 所述至少一个第二栅电极可以在所述源电极和所述第一栅电极之间。

    HIGH ELECTRON MOBILITY TRANSISTOR
    5.
    发明申请
    HIGH ELECTRON MOBILITY TRANSISTOR 有权
    高电子移动晶体管

    公开(公告)号：US20140042449A1

    公开(公告)日：2014-02-13

    申请号：US13732746

    申请日：2013-01-02

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Woo-chul JEON ,  Jong-seob KIM ,  Ki-yeol PARK ,  Young-hwan PARK ,  Jai-kwang SHIN ,  Jae-joon OH ,  Jong-bong HA ,  Sun-kyu HWANG

    IPC: H01L29/778 ,  H01L29/20

    CPC classification number: H01L29/778 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/4236 ,  H01L29/42376 ,  H01L29/7786

    Abstract: According to example embodiments, a high electron mobility transistor (HEMT) includes a channel supply layer that induces a two-dimensional electron gas (2DEG) in a channel layer, a source electrode and a drain electrode that are at sides of the channel supply layer, a depletion-forming layer that is on the channel supply layer and contacts the source electrode, a gate insulating layer on the depletion-forming layer, and a gate electrode on the gate insulating layer. The depletion-forming layer forms a depletion region in the 2DEG.

    Abstract translation: 根据示例性实施例，高电子迁移率晶体管（HEMT）包括在通道层中的二维电子气体（2DEG），沟道供应层侧面的源电极和漏电极 在沟道供给层上并与源电极接触的耗尽型层，耗尽型层上的栅极绝缘层和栅极绝缘层上的栅电极。 耗尽形成层在2DEG中形成耗尽区。

    HIGH-ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    HIGH-ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME 有权
    高电子移动晶体管及其制造方法

    公开(公告)号：US20140097470A1

    公开(公告)日：2014-04-10

    申请号：US13910417

    申请日：2013-06-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jong-seob KIM ,  Kyoung-yeon KIM ,  Joon-yong KIM ,  Jai-kwang SHIN ,  Jae-joon OH ,  Hyuk-soon CHOI ,  Jong-bong HA ,  Sun-kyu HWANG ,  In-jun HWANG

    IPC: H01L29/778 ,  H01L29/66

    CPC classification number: H01L29/778 ,  H01L29/1066 ,  H01L29/2003 ,  H01L29/41766 ,  H01L29/66431 ,  H01L29/66462 ,  H01L29/7786

    Abstract: According to example embodiments, a HEMT includes a channel supply layer on a channel layer, a p-type semiconductor structure on the channel supply layer, a gate electrode on the p-type semiconductor structure, and source and drain electrodes spaced apart from two sides of the gate electrode respectively. The channel supply layer may have a higher energy bandgap than the channel layer. The p-type semiconductor structure may have an energy bandgap that is different than the channel supply layer. The p-type semiconductor structure may include a hole injection layer (HIL) on the channel supply layer and be configured to inject holes into at least one of the channel layer and the channel supply in an on state. The p-type semiconductor structure may include a depletion forming layer on part of the HIL. The depletion forming layer may have a dopant concentration that is different than the dopant concentration of the HIL.

    Abstract translation: 根据示例性实施例，HEMT包括在沟道层上的沟道供应层，沟道供应层上的p型半导体结构，p型半导体结构上的栅电极以及与两侧隔开的源极和漏极 的栅电极。 通道供应层可以具有比沟道层更高的能量带隙。 p型半导体结构可以具有与沟道供给层不同的能量带隙。 p型半导体结构可以包括在沟道供应层上的空穴注入层（HIL），并且被配置为在导通状态下将空穴注入至少一个沟道层和沟道电源。 p型半导体结构可以在HIL的一部分上包括耗尽形成层。 耗尽形成层可以具有不同于HIL的掺杂剂浓度的掺杂剂浓度。

    HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD OF MANUFACTURING THE SAME 有权
    高电子移动性晶体管及其制造方法

    公开(公告)号：US20140021510A1

    公开(公告)日：2014-01-23

    申请号：US13752821

    申请日：2013-01-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Woo-chul JEON ,  Ki-yeol PARK ,  Young-hwan PARK ,  Jai-kwang SHIN ,  Jae-joon OH ,  Hyuk-soon CHOI ,  Jong-bong HA

    IPC: H01L29/778 ,  H01L29/66

    CPC classification number: H01L29/778 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/407 ,  H01L29/41758 ,  H01L29/41766 ,  H01L29/66431 ,  H01L29/66462 ,  H01L29/7786

    Abstract: A higher electron mobility transistor (HEMT) and a method of manufacturing the same are disclosed. According to example embodiments, the HEMT may include a channel supply layer on a channel layer, a source electrode and a drain electrode that are on at least one of the channel layer and the channel supply layer, a gate electrode between the source electrode and the drain electrode, and a source pad and a drain pad. The source pad and a drain pad electrically contact the source electrode and the drain electrode, respectively. At least a portion of at least one of the source pad and the drain pad extends into a corresponding one of the source electrode and drain electrode that the at least one of the source pad and the drain pad is in electrical contact therewith.

    Abstract translation: 公开了一种较高电子迁移率晶体管（HEMT）及其制造方法。 根据示例实施例，HEMT可以包括位于沟道层和沟道供应层中的至少一个上的沟道层，源电极和漏电极上的沟道供应层，源极和源极之间的栅电极 漏电极，以及源极焊盘和漏极焊盘。 源极焊盘和漏极焊盘分别与源电极和漏电极电接触。 源极焊盘和漏极焊盘中的至少一个的至少一部分延伸到源电极和漏电极中的至少一个源极焊盘和漏极焊盘与其电接触的相应的一个。

    HIGH ELECTRON MOBILITY TRANSISTORS AND METHODS OF MANUFACTURING THE SAME
    10.
    发明申请
    HIGH ELECTRON MOBILITY TRANSISTORS AND METHODS OF MANUFACTURING THE SAME 审中-公开
    高电子移动晶体管及其制造方法

    公开(公告)号：US20130307026A1

    公开(公告)日：2013-11-21

    申请号：US13752766

    申请日：2013-01-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sun-kyu HWANG ,  Jai-kwang SHIN ,  Hyuk-soon CHOI ,  Jong-seob KIM ,  Jae-joon OH ,  Jong-bong HA ,  In-jun HWANG ,  Kyoung-yeon KIM

    IPC: H01L29/778 ,  H01L29/66

    CPC classification number: H01L29/778 ,  H01L29/1029 ,  H01L29/2003 ,  H01L29/42316 ,  H01L29/66431 ,  H01L29/66462 ,  H01L29/7787

    Abstract: According to example embodiments, High electron mobility transistors (HEMTs) may include a discontinuation region in a channel region. The discontinuation region may include a plurality of 2DEG unit regions that are spaced apart from one another. The discontinuation region may be formed at an interface between two semiconductor layers or adjacent to the interface. The discontinuation region may be formed by an uneven structure or a plurality of recess regions or a plurality of ion implantation regions. The plurality of 2DEG unit regions may have a nanoscale structure. The plurality of 2DEG unit regions may be formed in a dot pattern, a stripe pattern, or a staggered pattern.

    Abstract translation: 根据示例实施例，高电子迁移率晶体管（HEMT）可以包括沟道区域中的不连续区域。 不连续区域可以包括彼此间隔开的多个2DEG单元区域。 不连续区域可以形成在两个半导体层之间或与界面相邻的界面处。 不连续区域可以由不平坦结构或多个凹陷区域或多个离子注入区域形成。 多个2DEG单元区域可以具有纳米尺度结构。 多个2DEG单元区域可以形成为点图案，条纹图案或交错图案。

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