公开(公告)号：US09023716B2

公开(公告)日：2015-05-05

申请号：US14147718

申请日：2014-01-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chungsun Lee ,  Jung-Seok Ahn ,  Kwang-chul Choi ,  Un-Byoung Kang ,  Jung-Hwan Kim ,  Joonsik Sohn ,  Jeon Il Lee

IPC: H01L21/58 ,  H01L21/304 ,  H01L21/683

CPC classification number: H01L21/6835 ,  B32B37/1284 ,  B32B37/18 ,  B32B37/24 ,  B32B37/26 ,  B32B38/04 ,  B32B38/10 ,  B32B38/162 ,  B32B2037/268 ,  B32B2315/08 ,  B32B2457/14 ,  H01L21/02057 ,  H01L21/02126 ,  H01L21/304 ,  H01L21/6836 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13023 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10S438/977 ,  H01L2924/00

Abstract: A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.

Abstract translation: 一种处理衬底的方法包括：在衬底和载体之间提供接合层，以将衬底粘合到载体上，在衬底由载体支撑的同时处理衬底，以及去除结合层以使衬底与载体分离。 粘合层可以包括热固性剥离层和热固性胶层，其中至少一个热固性胶层设置在热固性剥离层的每一侧上。

公开(公告)号：US11599458B2

公开(公告)日：2023-03-07

申请号：US17551707

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonsik Sohn ,  Hyunjoong Kim ,  Woongjae Song ,  Soowoong Ahn ,  Seunghyun Cho ,  Jihyun Choi

IPC: G11C8/00 ,  G06F12/06 ,  H01L23/48 ,  H01L25/065

Abstract: According to some example embodiments of the inventive concepts, there is provided a method of operating a stacked memory device including a plurality of memory dies stacked in a vertical direction, the method including receiving a command and an address from a memory controller, determining a stack ID indicating a subset of the plurality of memory dies by decoding the address, and accessing at least two memory dies among the subset of memory dies corresponding to the stack ID such that the at least two memory dies are non-adjacent.

公开(公告)号：US11232029B2

公开(公告)日：2022-01-25

申请号：US17003346

申请日：2020-08-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonsik Sohn ,  Hyunjoong Kim ,  Woongjae Song ,  Soowoong Ahn ,  Seunghyun Cho ,  Jihyun Choi

IPC: G11C8/00 ,  G06F12/06 ,  H01L23/48 ,  H01L25/065

Abstract: According to some example embodiments of the inventive concepts, there is provided a method of operating a stacked memory device including a plurality of memory dies stacked in a vertical direction, the method including receiving a command and an address from a memory controller, determining a stack ID indicating a subset of the plurality of memory dies by decoding the address, and accessing at least two memory dies among the subset of memory dies corresponding to the stack ID such that the at least two memory dies are non-adjacent.

公开(公告)号：US09412636B2

公开(公告)日：2016-08-09

申请号：US14682231

申请日：2015-04-09

Applicant: Samsung Electronics Co., Ltd

Inventor： Chungsun Lee ,  Jung-Seok Ahn ,  Kwang-chul Choi ,  Un-Byoung Kang ,  Jung-Hwan Kim ,  Joonsik Sohn ,  Jeon Il Lee

IPC: H01L21/58 ,  H01L21/683 ,  H01L21/304 ,  B32B37/12 ,  B32B37/18 ,  B32B37/24 ,  B32B37/26 ,  B32B38/04 ,  B32B38/10 ,  B32B38/16 ,  H01L21/02 ,  H01L21/768 ,  H01L23/00

CPC classification number: H01L21/6835 ,  B32B37/1284 ,  B32B37/18 ,  B32B37/24 ,  B32B37/26 ,  B32B38/04 ,  B32B38/10 ,  B32B38/162 ,  B32B2037/268 ,  B32B2315/08 ,  B32B2457/14 ,  H01L21/02057 ,  H01L21/02126 ,  H01L21/304 ,  H01L21/6836 ,  H01L21/76898 ,  H01L24/03 ,  H01L24/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/13023 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10S438/977 ,  H01L2924/00

Abstract: A method for processing substrates includes providing a bonding layer between a substrate and a carrier to bond the substrate to the carrier, processing the substrate while the substrate is supported by the carrier, and removing the bonding layer to separate the substrate from the carrier. The bonding layer may include a thermosetting release layer and thermosetting glue layers, wherein at least one of the thermosetting glue layers is provided on each side of the thermosetting release layer.