公开(公告)号：US10887845B2

公开(公告)日：2021-01-05

申请号：US16502937

申请日：2019-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Hyuk Jang ,  Jung-Woo Kim ,  Chul-Ho Kim ,  Joon-Hee Lee ,  Sang-Wook Han

IPC: H03B27/00 ,  H04W52/24 ,  H04B1/40

Abstract: In an operating method of a radio frequency integrated circuit (RFIC) including a transmission circuit and a reception circuit, the operating method includes receiving, from a modem, first information for setting transmission power of the transmission circuit or second information about a blocker which is a frequency signal unused by the RFIC, obtaining an allowable value of phase noise of a local oscillator included in the transmission circuit, using the first information, obtaining an allowable value of phase noise of a local oscillator included in the reception circuit, using the second information, determining a level of a driving voltage, using the obtained allowable values of the phase noises, and providing the driving voltage to the local oscillators.

公开(公告)号：US08829686B2

公开(公告)日：2014-09-09

申请号：US13678205

申请日：2012-11-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Sun Hong ,  Young-Min Kim ,  Jung-Woo Kim ,  Min-Ok Na ,  Hyo-Chang Ryu ,  Jong-Bo Shim

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/29 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L23/498 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A package-on-package assembly includes first and second packages and an adhesion member positioned between the first and second packages and adhering the first and second packages to one another. The first package may include a first substrate having a first surface and a second surface facing each other and including a land pad formed on the first surface, a first semiconductor chip formed on the first surface, and a first encapsulant member encapsulating the first surface and the first semiconductor chip and including a through-via spaced apart from the first semiconductor chip and exposing the land pad and a trench formed between the first semiconductor chip and the through-via, and wherein at least a portion of the trench is filled with adhesion member material.

Abstract translation: 包装包装组件包括第一和第二包装以及定位在第一和第二包装之间并将第一和第二包装彼此粘合的粘合部件。 第一封装可以包括具有第一表面和第二表面的第一衬底，第一表面和第二表面彼此面对并且包括形成在第一表面上的焊盘焊盘，形成在第一表面上的第一半导体芯片和封装第一表面的第一密封剂构件， 所述第一半导体芯片并且包括与所述第一半导体芯片间隔开的通孔，并且暴露所述焊盘焊盘和形成在所述第一半导体芯片和所述通孔之间的沟槽，并且其中所述沟槽的至少一部分填充有粘附 会员资料

公开(公告)号：US20130187288A1

公开(公告)日：2013-07-25

申请号：US13678205

申请日：2012-11-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji-Sun Hong ,  Young-Min Kim ,  Jung-Woo Kim ,  Min-Ok Na ,  Hyo-Chang Ryu ,  Jong-Bo Shim

IPC: H01L23/498

CPC classification number: H01L23/498 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A package-on-package assembly includes first and second packages and an adhesion member positioned between the first and second packages and adhering the first and second packages to one another. The first package may include a first substrate having a first surface and a second surface facing each other and including a land pad formed on the first surface, a first semiconductor chip formed on the first surface, and a first encapsulant member encapsulating the first surface and the first semiconductor chip and including a through-via spaced apart from the first semiconductor chip and exposing the land pad and a trench formed between the first semiconductor chip and the through-via, and wherein at least a portion of the trench is filled with adhesion member material.

Abstract translation: 包装包装组件包括第一和第二包装以及定位在第一和第二包装之间并将第一和第二包装彼此粘合的粘合部件。 第一封装可以包括具有第一表面和第二表面的第一衬底，第一表面和第二表面彼此面对并且包括形成在第一表面上的焊盘焊盘，形成在第一表面上的第一半导体芯片和封装第一表面的第一密封剂构件， 所述第一半导体芯片并且包括与所述第一半导体芯片间隔开的通孔，并且暴露所述焊盘焊盘和形成在所述第一半导体芯片和所述通孔之间的沟槽，并且其中所述沟槽的至少一部分填充有粘附 会员资料

公开(公告)号：US20200022091A1

公开(公告)日：2020-01-16

申请号：US16502937

申请日：2019-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Hyuk Jang ,  Jung-Woo Kim ,  Chul-Ho Kim ,  Joon-Hee Lee ,  Sang-Wook Han

IPC: H04W52/24 ,  H04B1/40

Abstract: In an operating method of a radio frequency integrated circuit (RFIC) including a transmission circuit and a reception circuit, the operating method includes receiving, from a modem, first information for setting transmission power of the transmission circuit or second information about a blocker which is a frequency signal unused by the RFIC, obtaining an allowable value of phase noise of a local oscillator included in the transmission circuit, using the first information, obtaining an allowable value of phase noise of a local oscillator included in the reception circuit, using the second information, determining a level of a driving voltage, using the obtained allowable values of the phase noises, and providing the driving voltage to the local oscillators.

公开(公告)号：US10355415B2

公开(公告)日：2019-07-16

申请号：US15916505

申请日：2018-03-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyung Joon Kim ,  Min-Seok Kim ,  Sigwan Kim ,  Jung-Woo Kim

IPC: H01R13/648 ,  H05K1/02 ,  H01R13/6471 ,  H01R13/6466 ,  H01R13/66 ,  H01R12/72

Abstract: An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.

公开(公告)号：US20180287302A1

公开(公告)日：2018-10-04

申请号：US15916505

申请日：2018-03-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyung Joon Kim ,  Min-Seok Kim ,  Sigwan Kim ,  Jung-Woo Kim

IPC: H01R13/6471 ,  H05K1/02 ,  H01R12/72 ,  H01R13/6466 ,  H01R13/66

CPC classification number: H01R13/6471 ,  H01R12/721 ,  H01R13/6466 ,  H01R13/6691 ,  H01R2201/16 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/095 ,  H05K2201/10189

Abstract: An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.

公开(公告)号：US09964349B2

公开(公告)日：2018-05-08

申请号：US14886709

申请日：2015-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myung-Hoon Cho ,  Young-Ki Kim ,  Jung-Woo Kim ,  Sung-Yun Jung ,  Won-Seop Choi

IPC: F25D17/08 ,  F25D17/06

CPC classification number: F25D17/067 ,  F25D17/065 ,  F25D2317/063 ,  F25D2317/067 ,  F25D2317/0682

Abstract: Provided is a refrigerator including: a body; a first storage compartment and a second storage compartment; a cold air generating unit; and a duct unit installed in front of the evaporator in the first storage compartment and including a first flow path on which the cold air is moved into the first storage compartment, a second flow path on which the cold air is moved into the second storage compartment, a first blower fan sending the cold air to the first flow path, a second blower fan sending the cold air to the second flow path, and a guide duct that partitions off the second flow path, wherein at least one cold air flowing portion is formed in the guide duct so that the first flow path and the second flow path are in communication with each other through the at least one cold air flowing portion.