公开(公告)号：US09355857B2

公开(公告)日：2016-05-31

申请号：US14678491

申请日：2015-04-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kangmin Jeon ,  Kyung-Sun Kim ,  Dougyong Sung ,  Tae-Hwa Kim ,  Heungsik Park ,  Jung Min Kim

IPC: H01L21/31 ,  H01L21/3065 ,  H01L21/02 ,  H01L21/311 ,  H01L21/67 ,  H01J37/32

CPC classification number: H01L21/3065 ,  H01J37/32449 ,  H01J37/32816 ,  H01J37/32834 ,  H01J37/32889 ,  H01J2237/332 ,  H01J2237/334 ,  H01L21/02118 ,  H01L21/02274 ,  H01L21/30655 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/32136 ,  H01L21/67069 ,  H01L27/11582

Abstract: Provided are a substrate manufacturing method and a substrate manufacturing apparatus used therefor. The substrate manufacturing method includes providing a substrate having a mask film into a chamber. A plasma reaction is induced in the chamber. A first gas and a second gas are alternately provided into the chamber to etch the substrate. Each of the first and second gases is provided into the chamber at a stabilized feed pressure including a pressure fluctuation profile comprising a square wave shape.

Abstract translation: 提供了一种基板制造方法和用于其的基板制造装置。 衬底制造方法包括将具有掩模膜的衬底提供到腔室中。 在室中诱导等离子体反应。 交替地将第一气体和第二气体提供到腔室中以蚀刻衬底。 第一和第二气体中的每一个以包括方波形状的压力波动分布的稳定的进料压力被提供到室中。

公开(公告)号：US11384433B2

公开(公告)日：2022-07-12

申请号：US17159244

申请日：2021-01-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minkyu Sung ,  Sung-Ki Lee ,  Dougyong Sung ,  Sang-Ho Lee ,  Kangmin Jeon

IPC: H01L21/67 ,  C23C16/455 ,  H01L21/683 ,  H01J37/32 ,  C23C16/509

Abstract: A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes.

公开(公告)号：US10934621B2

公开(公告)日：2021-03-02

申请号：US16509946

申请日：2019-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minkyu Sung ,  Sung-Ki Lee ,  Dougyong Sung ,  Sang-Ho Lee ,  Kangmin Jeon

IPC: C23C16/455 ,  H01L21/683 ,  H01J37/32 ,  C23C16/509

Abstract: A gas injection module includes a showerhead having first injection holes on a first region of the showerhead and second injection holes on a second region of the showerhead, the second region being outside the first region, a first distribution plate on the showerhead and having first and second upper passages respectively connected to the first and second injection holes, and a flow rate controller on the first and second upper passages of the first distribution plate. The flow rate controller reduces a difference in pressure within the first and second upper passages so that the gas may have similar flow rates within the first and second injection holes.

公开(公告)号：US11251022B2

公开(公告)日：2022-02-15

申请号：US16871427

申请日：2020-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kangmin Jeon ,  Dougyong Sung ,  Jongwoo Sun ,  Minkyu Sung ,  Kimoon Jung ,  Seongha Jeong ,  Ungyo Jung ,  Jewoo Han

IPC: C23C16/455 ,  H01J37/32 ,  H01L21/311 ,  H01L21/67

Abstract: A gas supply assembly for a substrate processing apparatus includes a gas introduction part, a gas distribution plate connected to the gas introduction part, the gas distribution plate including a plurality of through holes, and a shower head disposed under the gas distribution plate, the shower head including a plurality of distribution holes in fluid communication with the plurality of through holes. One through hole is in fluid communication with at least two distribution holes, and each of the plurality of distribution holes has a first diameter and a second diameter differing from each other in the shower head.