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    Semiconductor package
    1.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11626385B2

    公开(公告)日：2023-04-11

    申请号：US17178327

    申请日：2021-02-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Namhoon Kim ,  Chajea Jo ,  Ohguk Kwon ,  Hyoeun Kim ,  Seunghoon Yeon

    IPC: H01L25/065 ,  H01L23/00

    Abstract: A semiconductor package includes a first semiconductor chip comprising a semiconductor substrate and a redistribution pattern on a top surface of the semiconductor substrate, the redistribution pattern having a hole exposing an inner sidewall of the redistribution pattern, a second semiconductor chip on a top surface of the first semiconductor chip, and a bump structure disposed between the first semiconductor chip and the second semiconductor chip. The bump structure is disposed in the hole and is in contact with the inner sidewall of the redistribution pattern.

    Method and apparatus for performing power headroom report in wireless communication system
    4.
    发明授权
    Method and apparatus for performing power headroom report in wireless communication system 有权

    公开(公告)号：US11272462B2

    公开(公告)日：2022-03-08

    申请号：US16934462

    申请日：2020-07-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyoungmin Kim ,  Namhoon Kim ,  Myunghwan Kim ,  Yongsung Roh

    IPC: H04W52/36 ,  H04W72/12

    Abstract: A communication method and a system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The disclosure discloses a method for a terminal to generate all entry information of multiple power headroom reports (PHRs) as virtual PHs regardless of whether the terminal transmits an uplink to a serving cell in a wireless communication system supporting uplink carrier aggregation.

    Portable storage devices and methods of operating portable storage devices
    5.
    发明授权
    Portable storage devices and methods of operating portable storage devices 有权

    公开(公告)号：US11256650B2

    公开(公告)日：2022-02-22

    申请号：US16924428

    申请日：2020-07-09

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeayoung Kwon ,  Kyunghun Kim ,  Namhoon Kim

    IPC: G06F13/42 ,  G06F13/40 ,  G06F1/08 ,  G06F1/26 ,  G06F1/3215 ,  G06F13/38

    Abstract: A portable storage device includes nonvolatile memory devices to store data, a storage controller, and a bridge chipset. The bridge chipset is connected to a first connector of a host through a cable assembly, detects a resistance of the cable assembly, provides the storage controller with USB type information of the first connector based on the detected resistance, and after a USB connection is established with the host, provides the storage controller with USB version information associated with the established USB connection. The storage controller selects one of a plurality of initializing modes based on the USB type information and the USB version information, selects clock signals having frequencies in a range within a maximum power level, and performs an initializing operation based on the selected clock signals within an internal reference time interval.

    Semiconductor package
    7.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11862596B2

    公开(公告)日：2024-01-02

    申请号：US18094794

    申请日：2023-01-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Namhoon Kim ,  Seunghoon Yeon ,  Yonghoe Cho

    IPC: H01L23/00

    CPC classification number: H01L24/20 ,  H01L24/13 ,  H01L2224/2101 ,  H01L2224/214

    Abstract: Disclosed is a semiconductor package comprising a redistribution substrate, a semiconductor chip on the redistribution substrate and including a chip pad electrically connected to the redistribution substrate, and a conductive terminal on the redistribution substrate. The redistribution substrate includes a first dielectric layer, a first redistribution pattern, a second dielectric layer, a second redistribution pattern, and a first insulative pattern. The first redistribution pattern electrically connects the chip pad and the second redistribution pattern. The first insulative pattern has a first surface in contact with the first redistribution pattern and a second surface in contact with the second redistribution pattern. The second surface is opposite to the first surface. A width at the first surface of the first insulative pattern is the same as or greater than a width at the second surface of the first insulative pattern.

    Semiconductor package
    8.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11735566B2

    公开(公告)日：2023-08-22

    申请号：US17375511

    申请日：2021-07-14

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ohguk Kwon ,  Namhoon Kim ,  Hyoeun Kim ,  Sunkyoung Seo

    IPC: H01L25/065 ,  H01L23/538

    CPC classification number: H01L25/0657 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386

    Abstract: A semiconductor package including a substrate; a first semiconductor chip on the substrate; a second semiconductor chip on the first semiconductor chip; and at least one connection terminal between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip includes a first semiconductor chip body; and at least one upper pad on a top surface of the first semiconductor chip body and in contact with the at least one connection terminal, the at least one upper pad includes a recess that is downwardly recessed from a top surface thereof, and a depth of the recess is less than a thickness of the at least one upper pad.

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