公开(公告)号：US20190287525A1

公开(公告)日：2019-09-19

申请号：US16299814

申请日：2019-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taegu KIM ,  Sangyong PARK ,  Jungwook PARK ,  Dale NOH ,  Dongho JANG

IPC: G10L15/22 ,  G10L15/18 ,  G10L25/84 ,  G10L15/30 ,  G10L15/06

Abstract: A system, a user terminal, a method of the system, a method of the user terminal, and a computer program product are provided. The system includes a communication interface, at least one processor operatively coupled to the communication interface, and at least one piece of memory operatively coupled to the at least one processor, wherein the at least one piece of memory is configured to store instructions configured for the at least one processor to receive sound data from a first external device through the communication interface, obtain a voice signal and a noise signal from the sound data using at least some of an automatic voice recognition module, change the voice signal into text data, determine a noise pattern based on at least some of the noise signal, and determine a domain using the text data and the noise pattern when the memory operates.

公开(公告)号：US20210043649A1

公开(公告)日：2021-02-11

申请号：US16936888

申请日：2020-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangyong PARK ,  Hyunseok NA ,  Jaeduk LEE

IPC: H01L27/11582 ,  H01L27/11556

Abstract: An integrated circuit device includes a plurality of conductive lines extending in a horizontal direction parallel to a main surface of a substrate and overlapping one another in a vertical direction vertical to the main surface, on the substrate, a plurality of insulation layers each between two adjacent conductive lines of the plurality of conductive lines to extend in the horizontal direction, a channel layer extending in the vertical direction in a channel hole passing through the plurality of conductive lines and the plurality of insulation layers, and a plurality of outer blocking dielectric layers between the plurality of conductive lines and the channel layer, in at least some of the plurality of conductive lines, wherein a width of each of the plurality of outer blocking dielectric layers in the horizontal direction increases toward the main surface.

公开(公告)号：US20240006391A1

公开(公告)日：2024-01-04

申请号：US18467062

申请日：2023-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangho LEE ,  Kihyun KIM ,  Sangyong PARK ,  Kwanghyun BAEK ,  Seungjae BAEK

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L23/13 ,  H05K1/18

CPC classification number: H01L25/16 ,  H01L23/49833 ,  H01L24/16 ,  H01L23/13 ,  H01L23/49816 ,  H05K1/181 ,  H01L2224/16227 ,  H01L2924/19106 ,  H05K2201/10098 ,  H05K2201/10378 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/10962 ,  H05K2201/10704

Abstract: A package device is provided. The package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a die connected to the plurality of upper solder balls, a plurality of lower lands disposed on the other surface of the substrate, a plurality of lower solder balls disposed on some of the plurality of lower lands, and a capacitor connected to the lower lands on which the plurality of lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and including a height greater than the height of the plurality of lower solder balls.

公开(公告)号：US20220293632A1

公开(公告)日：2022-09-15

申请号：US17824821

申请日：2022-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangyong PARK ,  Hyunseok NA ,  Jaeduk LEE

IPC: H01L27/11582 ,  H01L27/11556

Abstract: An integrated circuit device includes a plurality of conductive lines extending in a horizontal direction parallel to a main surface of a substrate and overlapping one another in a vertical direction vertical to the main surface, on the substrate, a plurality of insulation layers each between two adjacent conductive lines of the plurality of conductive lines to extend in the horizontal direction, a channel layer extending in the vertical direction in a channel hole passing through the plurality of conductive lines and the plurality of insulation layers, and a plurality of outer blocking dielectric layers between the plurality of conductive lines and the channel layer, in at least some of the plurality of conductive lines, wherein a width of each of the plurality of outer blocking dielectric layers in the horizontal direction increases toward the main surface.

公开(公告)号：US20210295838A1

公开(公告)日：2021-09-23

申请号：US17260294

申请日：2019-05-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wooup KWON ,  Kyounggu WOO ,  Sangyong PARK ,  Jongbeom LEE

IPC: G10L15/22 ,  G10L15/04 ,  G10L15/30 ,  G10L17/12

Abstract: Various embodiments of the present disclosure relate to a method for providing an intelligent assistance service and an electronic device for performing the same. According to an embodiment, an electronic device comprises at least one communication circuit, at least one microphone, at least one speaker, at least one processor operatively connected to the communication circuit, the microphone, and the speaker, and at least one memory electrically connected to the processor, wherein the memory has instructions stored therein which, when executed, cause the processor to receive a wake-up utterance calling a voice-based intelligent assistance service, in response to the wake-up utterance, to identify a session which is in progress by the voice-based intelligent assistance service, and, upon receiving a control command, to provide the control command to an external device through the session on the basis of the session. Other embodiments are also possible.