公开(公告)号：US20240429885A1

公开(公告)日：2024-12-26

申请号：US18827264

申请日：2024-09-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonho JUNG ,  Hyunchul PARK ,  Seungjae BAEK ,  Jooseok LEE

IPC: H03F3/24

Abstract: An electronic device, according to various embodiments, may comprise: a power amplifier configured to amplify an input signal; an antenna module including at least one antenna and configured to transmit an RF signal amplified in a circuit of the power amplifier; and a communication processor including at least one processor, comprising processing circuitry, individually and/or collectively configured to control the power amplifier and the antenna module.

公开(公告)号：US20240006391A1

公开(公告)日：2024-01-04

申请号：US18467062

申请日：2023-09-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangho LEE ,  Kihyun KIM ,  Sangyong PARK ,  Kwanghyun BAEK ,  Seungjae BAEK

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/00 ,  H01L23/13 ,  H05K1/18

CPC classification number: H01L25/16 ,  H01L23/49833 ,  H01L24/16 ,  H01L23/13 ,  H01L23/49816 ,  H05K1/181 ,  H01L2224/16227 ,  H01L2924/19106 ,  H05K2201/10098 ,  H05K2201/10378 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/10962 ,  H05K2201/10704

Abstract: A package device is provided. The package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a die connected to the plurality of upper solder balls, a plurality of lower lands disposed on the other surface of the substrate, a plurality of lower solder balls disposed on some of the plurality of lower lands, and a capacitor connected to the lower lands on which the plurality of lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and including a height greater than the height of the plurality of lower solder balls.