公开(公告)号：US20240310739A1

公开(公告)日：2024-09-19

申请号：US18436127

申请日：2024-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungwhan OH ,  Ho Young KIM ,  Sunghwan KIM ,  Jaekyung PARK ,  Jaehong LEE ,  Yohan CHOE

IPC: G03F7/00 ,  G03F7/20

CPC classification number: G03F7/70725 ,  G03F7/2043 ,  G03F7/70808

Abstract: A substrate processing apparatus includes a substrate stage configured to support a semiconductor substrate, the substrate stage being rotatable at a predetermined angular velocity, and a discharge device above the substrate stage, the discharge device being configured to discharge a chemical solution onto the semiconductor substrate, and the discharge device including a nozzle arm movable along a radial direction from a central region of the substrate stage to a peripheral region surrounding the central region, a nozzle on the nozzle arm, the nozzle facing the substrate stage, and the nozzle being configured to discharge the chemical solution onto the semiconductor substrate at a predetermined angle relative to a surface of the semiconductor substrate, and an angle changer configured to change the predetermined angle such that the predetermined angle gradually decreases as the nozzle arm moves from the central region to the peripheral region.

公开(公告)号：US20240250000A1

公开(公告)日：2024-07-25

申请号：US18468317

申请日：2023-09-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonghyuk YIM ,  Wandon KIM ,  Hyunbae LEE ,  Hyoseok CHOI ,  Sunghwan KIM ,  Junki PARK

IPC: H01L23/48 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/49 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L23/481 ,  H01L29/0673 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/495 ,  H01L29/775 ,  H01L29/78696

Abstract: A semiconductor device may include a substrate including an active pattern, a source/drain pattern on the active pattern, an active contact on the source/drain pattern; a lower power line in the substrate, a lower contact that vertically connects the active contact to the lower power line, a conductive layer between the lower contact and the lower power line, and a power delivery network layer on a bottom surface of the substrate. The conductive layer may include silicon (Si) and a first element. The first element may include a transition metal or a metalloid. A concentration of the first element may decrease in a direction from the lower contact toward the lower power line.

公开(公告)号：US20240223507A1

公开(公告)日：2024-07-04

申请号：US18397337

申请日：2023-12-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonseon HAN ,  Dongmyung KIM ,  Sunghwan KIM ,  Younggyoun MOON

IPC: H04L47/62 ,  H04L47/32

CPC classification number: H04L47/6205 ,  H04L47/32

Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. A method performed by a first network entity in a wireless communication system is provided. The method includes receiving, from a second network entity, a first message including information on at least one of a type, a size, or an identifier of an action buffer, which is for creating of the action buffer, receiving, from the second network entity, a second message including the identifier for adding of at least one action to multiple memories assigned to the action buffer created based on the first message, and performing an arbitrary action for an input packet based on an address of memory in which the arbitrary action among the at least one action is stored.

公开(公告)号：US20230333467A1

公开(公告)日：2023-10-19

申请号：US17964376

申请日：2022-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghwan KIM ,  Kyungwon KANG ,  Dongwook KIM ,  Seungjoon SONG ,  Seok HEO ,  Younseon WANG ,  Dasom LEE

IPC: G03F7/00 ,  G03F7/30

CPC classification number: G03F7/0025 ,  G03F7/3021

Abstract: A spin coater may include a spin chuck, a nozzle, a first temperature controller and a second temperature controller. The spin chuck may be configured make contact with a central portion of a lower surface of a substrate and may be configured to rotate the substrate when photoresist is on the substrate. The nozzle may be arranged over a central portion of the spin chuck and configured to provide a central portion of an upper surface of the substrate with photoresist. The first temperature controller may be configured to control a temperature in a first region of the spin chuck. The second temperature controller may be configured to control a temperature in a second region of the spin chuck.

公开(公告)号：US20230126559A1

公开(公告)日：2023-04-27

申请号：US18071927

申请日：2022-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsu CHOI ,  Hyeonu CHOI ,  Sunghwan KIM ,  Hyunkee MIN ,  Junhak LIM ,  Kiyeong JEONG

IPC: H04M1/72454 ,  H04M1/02

Abstract: An electronic device includes: a hinge structure; a foldable housing including a first housing structure and a second housing structure that are configured to be foldable relative to each other around the hinge structure; a first antenna provided in the first housing structure; a second antenna provided in the second housing structure; a communication circuit electrically connected to the first antenna and the second antenna, and configured to transmit and receive data through a first link and a second link established between an external electronic device and the electronic device; and a processor operatively connected to the communication circuit, wherein the processor is configured to: identify whether an angle between the first housing structure and the second housing structure satisfies a specified condition; and control the communication circuit to transmit, through at least one of the first link and the second link, a signal related to a change in an operation of short-range wireless communication, based on whether the angle satisfies the specified condition.

公开(公告)号：US20240128335A1

公开(公告)日：2024-04-18

申请号：US18369236

申请日：2023-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junggun YOU ,  Junki PARK ,  Sunghwan KIM ,  Wandon KIM ,  Sughyun SUNG ,  Hyunbae LEE

IPC: H01L29/417 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L29/41733 ,  H01L29/0673 ,  H01L29/42392 ,  H01L29/66545 ,  H01L29/775 ,  H01L29/78696

Abstract: A semiconductor device includes an active region on a substrate, a plurality of channel layers spaced apart from each other, a gate structure on the substrate, a source/drain region on at least one side of the gate structure, and a contact plug connected to the source/drain region. The contact plug includes a metal-semiconductor compound layer and a barrier layer on the metal-semiconductor compound layer. The contact plug includes a first inclined surface and a second inclined surface positioned where the metal-semiconductor compound layer and the barrier layer directly contact each other. The barrier layer includes first and second ends protruding towards the gate structure. The first and second ends are positioned at a level higher than an upper surface of an uppermost channel layer. An uppermost portion of the metal-semiconductor compound layer is positioned at a level higher than an upper surface of the source/drain region.

公开(公告)号：US20240073733A1

公开(公告)日：2024-02-29

申请号：US18095622

申请日：2023-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younggyoun MOON ,  Dongmyung KIM ,  Sunghwan KIM ,  Yoonseon HAN

IPC: H04W28/02 ,  H04W24/08

CPC classification number: H04W28/0236 ,  H04W24/08

Abstract: Disclosed is a 5G or 6G communication system to be provided for supporting higher data rates beyond a 4G communication system such as LTE. In particular, a method performed by a first device in a communication system is disclosed, and includes detecting a need to update a traffic processing rule in a second device processing traffic together with the first device; determining whether to update the traffic processing rule to be used in the second device based on performance information of the first device and performance profile information of the second device; and delivering information related to the update of the traffic processing rule to the second device based on the determination.

公开(公告)号：US20240073300A1

公开(公告)日：2024-02-29

申请号：US18365557

申请日：2023-08-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunhyun KIM ,  Dongmyung KIM ,  Sunghwan KIM

IPC: H04L69/22

CPC classification number: H04L69/22

Abstract: A data transmission method and apparatuses in a wireless communication system are provided. More particularly, a method performed by a first node in a wireless communication system is provided. The method includes receiving header configuration information from a second node, if header configuration information indicates to contain first data including one or more of network management information and user service provision information into a header, transmitting a packet including the first data and additional information for parsing the first data to the second node, and receiving a response to the first data from the second node which receives the packet.

公开(公告)号：US20230178476A1

公开(公告)日：2023-06-08

申请号：US17864716

申请日：2022-07-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunwoo KANG ,  Yoontae HWANG ,  Geunwoo KIM ,  Sunghwan KIM ,  Junki PARK

IPC: H01L23/522 ,  H01L21/768

CPC classification number: H01L23/5226 ,  H01L21/76805 ,  H01L21/76831 ,  H01L23/53266

Abstract: An integrated circuit device includes a conductive region disposed on a substrate, an insulating structure including a contact hole disposed in the conductive region and extending from the conductive region in a vertical direction, a local capping pattern having an outer sidewall in contact with an upper portion of an inner wall of the contact hole and an inner sidewall facing an inside of the contact hole and having a width gradually increasing in a horizontal direction away from the substrate, and a conductive plug passing through the insulating structure through the contact hole in the vertical direction, having a lower sidewall in contact with the insulating structure and an upper sidewall in contact with the local capping pattern, and including a first metal.

公开(公告)号：US20230156841A1

公开(公告)日：2023-05-18

申请号：US18081233

申请日：2022-12-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunghwan KIM ,  Junhak Lim ,  Hyunkee Min ,  Kiyeong Jeong ,  Junsu Chol ,  Hyeonu Chol

IPC: H04W76/15 ,  H04W72/512 ,  H04W28/02

CPC classification number: H04W76/15 ,  H04W72/512 ,  H04W28/0263

Abstract: Methods and apparatuses for scanning a link are provided. An electronic device includes a communication circuit configured to perform data communications with an external electronic device through a plurality of links, and a processor configured to: determine whether to simultaneously perform or sequentially perform a first scan of the first link and a second scan of the second link, based on first characteristics of the first link and second characteristics of the second link; stop data communications through the first link and perform at least one data communication through the second link, before performing the first scan of the first link, in response to a determination to sequentially perform the first scan of the first link and the second scan of the second link; and control the communication circuit to perform data communications through the second link while performing the first scan of the first link.