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1.发明申请公开(公告)号：US20140104452A1
公开(公告)日：2014-04-17
申请号：US13828591
申请日：2013-03-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Tae Chan KIM , Min Ho KIM , Dong Ki MIN , Sang Chul SUL , Tae Seok OH , Kwang Hyun LEE , Tae Yon LEE , Jae Jin JUNG , Young Gu JIN
IPC: H01L31/02 , H01L27/146 , H04N5/232
CPC classification number: H01L31/02016 , H01L27/14609 , H04N5/23229 , H04N5/378
Abstract: A sub pixel includes a photodetector and a column line output circuit. The photodetector is configured to output an electrical signal based on a detected amount of photons. The column line output circuit is configured to generate an output signal based on the electrical signal. The output signal is one of a current from a current source and a comparison signal indicative of binary output data.
Abstract translation: 子像素包括光电检测器和列线输出电路。 光电检测器被配置为基于检测到的光子量输出电信号。 列线输出电路被配置为基于电信号产生输出信号。 输出信号是来自电流源的电流和表示二进制输出数据的比较信号之一。
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公开(公告)号：US20130123015A1
公开(公告)日：2013-05-16
申请号：US13672042
申请日：2012-11-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung Kyu JUNG , Yoon Dong PARK , Tae Yon LEE , Chil Hee CHUNG , Young Gu JIN , Hyun Seok LEE , Seung Hyuk CHANG
CPC classification number: G06K9/78 , G01S7/4863 , G01S17/023 , G01S17/89 , G06K9/209 , H04N5/335 , H04N5/3696
Abstract: An operation method of an image sensor includes determining a distance between the image sensor and an object, and activating at least one of a color pixel, a depth pixel and a thermal pixel included in a pixel array of the image sensor based on a determined distance and a reference distance.
Abstract translation: 图像传感器的操作方法包括：确定图像传感器和对象之间的距离，以及基于确定的距离来激活包括在图像传感器的像素阵列中的彩色像素，深度像素和热像素中的至少一个 和参考距离。
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公开(公告)号：US20240186349A1
公开(公告)日：2024-06-06
申请号：US18364701
申请日：2023-08-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Tae Yon LEE , Ji Hyun KWAK , Gyu Seok LEE , Su Rim LEE
IPC: H01L27/146 , H04N25/13
CPC classification number: H01L27/14627 , H01L27/14621 , H04N25/134
Abstract: An image sensing device and a method of image signal processing are provided. The image sensing device includes a lens module, a microlens below the lens module, an image sensor below the microlens and which includes a first pixel having a cyan color filter, and which outputs a first image signal, a second pixel having a magenta color filter, and which outputs a second image signal, a third pixel having a yellow color filter, and which outputs a third image signal, and a fourth pixel which outputs a fourth image signal, and an image signal processor which receives image signals of the image sensor, and extracts a red (R) data component, green (G) data component, blue (B) data component, and near-infrared (IR) data component of the light from the image signals.
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公开(公告)号：US20180301487A1
公开(公告)日：2018-10-18
申请号：US15804183
申请日：2017-11-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Gwi-Deok Ryan LEE , Tae Yon LEE , Kwang Min LEE , Masaru ISHII
IPC: H01L27/146 , H04N5/378 , H04N5/3745
Abstract: An image sensor includes first photoelectric elements, second photoelectric elements under the first photoelectric elements, and a pixel circuit including first semiconductor devices and second semiconductor devices under second photoelectric elements. The first semiconductor devices are connected to at least one of the first photoelectric elements. The second semiconductor devices are connected to at least one of the second photoelectric elements. The first semiconductor devices are connected to different first photoelectric elements and are in one of a plurality of pixel regions.
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公开(公告)号：US20180197919A1
公开(公告)日：2018-07-12
申请号：US15659343
申请日：2017-07-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Beom Suk LEE , Kwang-Min LEE , Gwideok Ryan LEE , Masaru ISHll , Tae Yon LEE
CPC classification number: H01L27/307 , H01L27/281 , H01L27/286 , H01L51/442 , Y02E10/549
Abstract: Image sensors according to some embodiments of the inventive concepts may include a pixel array are including a plurality of pixels, a peripheral area adjacent the pixel array unit, and an organic photoelectric converting layer including a first portion positioned on the pixel area and a second portion positioned on the peripheral area. The second portion may be separated from the first portion.
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Patent Agency Ranking
公开(公告)号：US20220059621A1
公开(公告)日：2022-02-24
申请号：US17520626
申请日：2021-11-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gwi-Deok Ryan LEE , Jung Hun KIM , Chang Hwa KIM , Sang Su PARK , Sang Hoon UHM , Beom Suk LEE , Tae Yon LEE , Dong Mo IM
IPC: H01L27/30 , H01L27/28 , H01L51/44 , H01L51/42 , H01L27/146
Abstract: A color filter is disposed on a substrate. An organic photodiode is disposed on the color filter. The organic photodiode includes an electrode insulating layer having a recess region on the substrate, a first electrode on the color filter, the first electrode filling the recess region of the electrode insulating layer, a second electrode on the first electrode, and an organic photoelectric conversion layer interposed between the first electrode and the second electrode. The first electrode includes a seam extending at a first angle from a side surface of the recess region of the electrode insulating layer.
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公开(公告)号：US20190120689A1
公开(公告)日：2019-04-25
申请号：US16165014
申请日：2018-10-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dong-Seok LEEM , Gae Hwang LEE , Yong Wan JIN , Tae Yon LEE
Abstract: A combination sensor may include a first infrared light sensor and a second infrared light sensor. The first infrared light sensor may be configured to sense light in a first wavelength within an infrared wavelength spectrum. The second infrared light sensor may be configured to sense light in a second wavelength that is different from the first wavelength within the infrared wavelength spectrum. The first infrared light sensor and the second infrared light sensor may be stacked in relation to each other.
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公开(公告)号：US20140104473A1
公开(公告)日：2014-04-17
申请号：US14051993
申请日：2013-10-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae Chan KIM , Min Ho KIM , Dong Ki MIN , Sang Chul SUL , Tae Seok OH , Kwang Hyun LEE , Tae Yon LEE , Jung Hoon JUNG , Young Gu JIN
IPC: H04N5/374
CPC classification number: H04N5/374 , H01L27/14627 , H01L27/14634
Abstract: An image sensor chip includes a first wafer and a second wafer. The first wafer includes an image sensor having a plurality of sub-pixels, each of which is configured to detect at least one photon and output a sub-pixel signal according to a result of the detection. The image processor is configured to process sub-pixel signals for each sub-pixel and generate image data. The first wafer and the second wafer are formed in a wafer stack structure.
Abstract translation: 图像传感器芯片包括第一晶片和第二晶片。 第一晶片包括具有多个子像素的图像传感器，每个子像素被配置为检测至少一个光子并根据检测结果输出子像素信号。 图像处理器被配置为处理每个子像素的子像素信号并生成图像数据。 第一晶片和第二晶片形成为晶片堆叠结构。
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公开(公告)号：US20210231491A1
公开(公告)日：2021-07-29
申请号：US17227926
申请日：2021-04-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dong-Seok LEEM , Gae Hwang LEE , Yong Wan JIN , Tae Yon LEE
Abstract: A combination sensor may include a first infrared light sensor and a second infrared light sensor. The first infrared light sensor may be configured to sense light in a first wavelength within an infrared wavelength spectrum. The second infrared light sensor may be configured to sense light in a second wavelength that is different from the first wavelength within the infrared wavelength spectrum. The first infrared light sensor and the second infrared light sensor may be stacked in relation to each other.
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公开(公告)号：US20200052041A1
公开(公告)日：2020-02-13
申请号：US16660799
申请日：2019-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gwi-Deok Ryan LEE , Jung Hun KIM , Chang Hwa KIM , Sang Su PARK , Sang Hoon UHM , Beom Suk LEE , Tae Yon LEE , Dong Mo IM
IPC: H01L27/30 , H01L51/42 , H01L51/44 , H01L27/28 , H01L27/146
Abstract: A color filter is disposed on a substrate. An organic photodiode is disposed on the color filter. The organic photodiode includes an electrode insulating layer having a recess region on the substrate, a first electrode on the color filter, the first electrode filling the recess region of the electrode insulating layer, a second electrode on the first electrode, and an organic photoelectric conversion layer interposed between the first electrode and the second electrode. The first electrode includes a seam extending at a first angle from a side surface of the recess region of the electrode insulating layer.
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