公开(公告)号：US20180087751A1

公开(公告)日：2018-03-29

申请号：US15713072

申请日：2017-09-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-gyun JUNG ,  Won-soo JI ,  Jong-sup SONG ,  Sang-woo HA

IPC: F21V15/01 ,  F21K9/68 ,  F21V7/00 ,  G02B3/00

Abstract: There are provided a lighting lens, a lighting lens array, and a lighting apparatus. The lighting lens may include an incidence part to receive light from a light source and an emission part to emit light provided from the incidence part. The incidence part may have a concave region that contains a light source and a first protrusion at a rear side of the light source that protrudes downwards from a top surface of the concave region. The emission part may include a dome-shaped part that encloses the incidence part and a second protrusion at the rear side of the light source that protrudes upwards from a top surface of the dome-shaped part. A lowermost portion of the emission part may be formed at a first plane, and an angle between an outer surface of the emission part and the first plane is an obtuse angle.

公开(公告)号：US20130183836A1

公开(公告)日：2013-07-18

申请号：US13693795

申请日：2012-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eui-seok KIM ,  Sang-kyu BANG ,  Soo-hyun CHO ,  Choo-ho KIM ,  Won-soo JI

IPC: H01L21/263

CPC classification number: H01L21/2633 ,  H01L21/76898 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Methods of forming through-silicon vias by using laser ablation. A method includes, laser drilling to form a plurality of grooves by irradiating a laser beam onto an upper surface of a silicon wafer, and grinding a lower surface of the silicon wafer to form a plurality of through-silicon vias by exposing the grooves on the lower surface of the silicon wafer.

Abstract translation: 通过使用激光烧蚀形成穿硅通孔的方法。 一种方法包括：激光钻孔以通过将激光束照射到硅晶片的上表面上来形成多个凹槽，以及研磨硅晶片的下表面以形成多个穿硅通孔，以通过使 硅晶片的下表面。

公开(公告)号：US20130193131A1

公开(公告)日：2013-08-01

申请号：US13706146

申请日：2012-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： In-hoe HUR ,  Dong-myung SHIN ,  Jong-pa HONG ,  Choo-ho KIM ,  Won-soo JI ,  Jun-woo KIM

IPC: G01J5/00 ,  H05B1/00

CPC classification number: G01J5/00 ,  G01J5/0007 ,  G01J5/029 ,  G01J5/048 ,  G01J5/0818 ,  H05B1/00

Abstract: An optical pyrometer includes a receiving part having a receiving end for receiving light radiation of a heating unit, and a case part covering the receiving part, except for the receiving end of the receiving part, wherein a cross-sectional area of the receiving end of the receiving part perpendicular to a lengthwise direction of the receiving end of the receiving part decreases toward an end portion of the receiving end of the receiving part.

Abstract translation: 光学高温计包括具有用于接收加热单元的光辐射的接收端的接收部分和覆盖接收部分的外壳部分，除了接收部分的接收端之外，其中接收端的接收端的横截面积 与接收部的接收端的长度方向垂直的接收部朝向接收部的接收端的端部而减小。

公开(公告)号：US20160020366A1

公开(公告)日：2016-01-21

申请号：US14708047

申请日：2015-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun-jun HWANG ,  Won-soo JI ,  Do-hyuk KIM

IPC: H01L33/50 ,  H01L21/66 ,  H01L33/58

CPC classification number: H01L22/10 ,  G01J1/0414 ,  G01J1/42 ,  G01J2001/4252 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method of manufacturing a light-emitting device package may include steps of preparing a light-emitting device package; holding the light-emitting device package on an inspection table; reflecting, by a reflection member, leaking blue light emitted by the light-emitting device package; capturing, by using a photographing unit, the light emitted by the light-emitting device package and the leaking blue light and generating an optical image; detecting, by a controller, the blue light from the optical image; determining a presence or absence of a defect of the light-emitting device package according to the detected blue light; and displaying the presence or absence of the defect of the light-emitting device package on a display unit.

Abstract translation: 制造发光器件封装的方法可以包括制备发光器件封装的步骤; 将发光装置封装在检查台上; 通过反射构件反射由发光装置封装发出的蓝色光; 通过使用拍摄单元捕获由发光装置包装发出的光和泄漏的蓝光并产生光学图像; 由控制器检测来自光学图像的蓝色光; 根据检测到的蓝光确定发光器件封装的缺陷的存在或不存在; 并且在显示单元上显示发光器件封装的缺陷的存在或不存在。