公开(公告)号：US08974393B2

公开(公告)日：2015-03-10

申请号：US13873342

申请日：2013-04-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Il Cho ,  Seung Heun Lee ,  Bae Hyung Kim ,  Young Il Kim ,  Jong Keun Song

IPC: A61B8/00 ,  G01N29/24 ,  H05K1/02 ,  G01N29/32 ,  H05K7/20 ,  B06B1/02

CPC classification number: H05K7/20336 ,  B06B1/0292 ,  G01N29/2406 ,  G01N29/326 ,  H05K1/0204 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/10598

Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

Abstract translation: 提供了一种超声波探头，其中释放了结合到cMUT的集成电路中产生的热量。 超声波探头包括被配置为产生超声波的换能器，安装在换能器的后表面上的集成电路，安装在集成电路的后表面上的印刷电路板，并且具有开口， 集成电路的后表面至少部分地露出，散热器具有插入印刷电路板的开口中的突起，并且被构造成吸收集成电路中产生的热量，散热模块被配置为释放 散热器吸收的热量到外面。

公开(公告)号：US10327735B2

公开(公告)日：2019-06-25

申请号：US14301540

申请日：2014-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Il Cho ,  Jong Keun Song ,  Bae Hyung Kim ,  Young Il Kim ,  Seung Heun Lee

IPC: A61B8/00

Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.

公开(公告)号：US09136139B2

公开(公告)日：2015-09-15

申请号：US14607265

申请日：2015-01-28

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Kyungpook National University Industry-Academic Cooperation Foundation

Inventor： Young Il Kim ,  Bae Hyung Kim ,  Jong Keun Song ,  Seung Heun Lee ,  Kyung Il Cho ,  Yong Rae Roh ,  Won Seok Lee

IPC: H01L21/3065 ,  H01L21/308 ,  H01L23/00 ,  H01L21/66

CPC classification number: H01L21/3065 ,  A61B8/4411 ,  B06B1/0292 ,  H01L21/308 ,  H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/1461 ,  Y10T156/1702 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract translation: 夹具包括晶片，其包括配置为在进行倒装芯片接合时容纳电容微机械超声换能器（cMUT）的容纳凹槽和形成在容纳槽的底表面中的分离槽，分离槽具有底表面， 当cMUT位于容纳槽的底部表面的部分上时，与位于分离槽的底表面的cMUT的薄膜间隔开。

公开(公告)号：US08975096B2

公开(公告)日：2015-03-10

申请号：US13926278

申请日：2013-06-25

Applicant: Samsung Electronics Co., Ltd. ,  Kyungpook National University Industry-Academic Cooperation Foundation

Inventor： Young Il Kim ,  Bae Hyung Kim ,  Jong Keun Song ,  Seung Heun Lee ,  Kyung Il Cho ,  Yong Rae Roh ,  Won Seok Lee

IPC: G01R31/26 ,  H01L21/66 ,  A61B8/00 ,  B06B1/02 ,  H01L23/00

CPC classification number: H01L21/3065 ,  A61B8/4411 ,  B06B1/0292 ,  H01L21/308 ,  H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/75983 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2924/1461 ,  Y10T156/1702 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

公开(公告)号：US09675324B2

公开(公告)日：2017-06-13

申请号：US14301751

申请日：2014-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyung Il Cho ,  Bae Hyung Kim ,  Young Il Kim ,  Jong Keun Song ,  Seung Heun Lee

IPC: G01N29/24 ,  A61B8/00 ,  G01N29/06

CPC classification number: A61B8/4427 ,  A61B8/4444 ,  A61B8/546 ,  G01N29/0654 ,  G01N29/2431

Abstract: A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module.

公开(公告)号：US09641149B2

公开(公告)日：2017-05-02

申请号：US14605044

申请日：2015-01-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Duck Hwan Kim ,  In Sang Song ,  Chul Soo Kim ,  Young Il Kim ,  Jea Shik Shin

IPC: H03H7/38 ,  H03H9/54

CPC classification number: H03H7/38 ,  H03H9/54 ,  H03H2007/386

Abstract: Provided are a matching segment circuit, to which a radio frequency (RF) is applied, and an RF integrated device using the matching segment circuit. The matching segment circuit to which an RF is applied may include an input end connected to a first RF device, a parallel segment having a first capacitor and a first inductor connected in parallel, a second inductor connected to the parallel segment in series, and an output end connected to a second RF device. The first capacitor, the first inductor, and the second inductor may be configured so that an impedance of the first RF device and an impedance of the second RF device may match.