公开(公告)号：US10325882B2

公开(公告)日：2019-06-18

申请号：US15651933

申请日：2017-07-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-woo Kang ,  Byung-lyul Park ,  Kyoung-hwan Kim ,  Kun-sang Park ,  Young-gyu Ahn

IPC: H01L23/02 ,  H01L25/065 ,  H01L21/02 ,  H01L21/027 ,  H01L21/311 ,  H01L21/56 ,  H01L21/768 ,  H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498

Abstract: A method of manufacturing a semiconductor package includes providing a substrate including a mounting region having a recess space for accommodating a semiconductor chip and a connection region surrounding the mounting region, providing a semiconductor chip in the mounting region, the semiconductor chip including a connection pad provided on a top surface of the semiconductor chip, forming a protective layer covering a top surface of the substrate and the top surface of the semiconductor chip, forming a photosensitive insulating layer on the protective layer after forming the protective layer, patterning the photosensitive insulating layer thereby exposing the protective layer, removing the exposed protective layer, and forming a redistribution line to be electrically connected to the connection pad.

公开(公告)号：US20180108639A1

公开(公告)日：2018-04-19

申请号：US15651933

申请日：2017-07-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae-woo Kang ,  Byung-lyul Park ,  Kyoung-hwan Kim ,  Kun-sang Park ,  Young-gyu Ahn

IPC: H01L25/065 ,  H01L21/768 ,  H01L25/00 ,  H01L21/56 ,  H01L21/311 ,  H01L23/13 ,  H01L23/00 ,  H01L21/02 ,  H01L21/027 ,  H01L23/31

CPC classification number: H01L25/0657 ,  H01L21/02063 ,  H01L21/0274 ,  H01L21/31111 ,  H01L21/31144 ,  H01L21/563 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/13 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/498 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/08145 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/13099

Abstract: A method of manufacturing a semiconductor package includes providing a substrate including a mounting region having a recess space for accommodating a semiconductor chip and a connection region surrounding the mounting region, providing a semiconductor chip in the mounting region, the semiconductor chip including a connection pad provided on a top surface of the semiconductor chip, forming a protective layer covering a top surface of the substrate and the top surface of the semiconductor chip, forming a photosensitive insulating layer on the protective layer after forming the protective layer, patterning the photosensitive insulating layer thereby exposing the protective layer, removing the exposed protective layer, and forming a redistribution line to be electrically connected to the connection pad.