Electromagnetic interference reduction for electronic line printers
    1.
    发明授权
    Electromagnetic interference reduction for electronic line printers 失效
    电子线路打印机的电磁干扰减少

    公开(公告)号:US4290705A

    公开(公告)日:1981-09-22

    申请号:US55658

    申请日:1979-07-09

    CPC分类号: G01D15/28 B41J29/00 G01D15/06

    摘要: An electronic line printer characterized by reduced electromagnetic interference, comprising a printer chassis including record medium storage means; a platen mounted on said chassis and adapted to be in contact with the record medium; electronic printing means for contacting said record medium for printing visible symbols on said record medium; and record medium tensioning means for increasing the tension of said record medium in the vicinity of said platen.

    摘要翻译: 一种特征在于减少电磁干扰的电子线路打印机,包括一个包括记录介质存储装置的打印机机架; 安装在所述底盘上并适于与所述记录介质接触的压板; 用于接触所述记录介质以在所述记录介质上打印可见符号的电子打印装置; 并记录介质张紧装置,用于增加所述记录介质在所述压板附近的张力。

    Electronic component package with multiconductive base forms for
multichannel mounting
    2.
    发明授权
    Electronic component package with multiconductive base forms for multichannel mounting 失效
    具有多通道安装多电极底座形式的电子元件封装

    公开(公告)号:US4654472A

    公开(公告)日:1987-03-31

    申请号:US682558

    申请日:1984-12-17

    申请人: Samuel Goldfarb

    发明人: Samuel Goldfarb

    摘要: An improved electronic component or integrated circuit (IC) package characterized by an extraordinary small size for the number of input-output (I/O) leads which are available and capable of use on surface mounted, Flat Pack, hybrid, or through hole (DIP) printed circuit boards. The package has one or more cylindrical or shaped forms at the base, with a flange to provide a stop in order to limit the insertion travel in those circuit boards having through holes, and a top body which is used to house the electronic device. The forms, which protrude down from the upper body (housing), have one or more conductive lead segments, either pins or printed circuit types, running longitudinally and continuing through the housing to the upper body.Each lead segment is connected directly to the electronic device or attached via an additonal lead to a pad on the electronic device, mounted on the upper body. A cover to seal the device is provided. Grooves in the body or on the cover aid in handling the device, either manually or by automatic machinery, are provided. These grooves also provide gripping areas for top hat heat sinks.

    摘要翻译: 一种改进的电子部件或集成电路(IC)封装,其特征在于具有非常小的尺寸,用于输入输出(I / O)引线的数量,其可用并且能够用于表面安装,平板封装,混合或通孔( DIP)印刷电路板。 该包装在基座处具有一个或多个圆柱形或成形形状,具有凸缘以提供止挡件,以限制具有通孔的那些电路板中的插入行程,以及用于容纳电子装置的顶体。 从上体(壳体)向下突出的形式具有一个或多个导电引线段,即引脚或印刷电路类型,其纵向延伸并且通过外壳继续到上体。 每个引线段直接连接到电子设备,或者通过附加引线连接到安装在上部主体上的电子设备上的焊盘。 提供密封装置的盖子。 提供身体或护罩上的沟槽,手动或自动机械处理设备。 这些凹槽还为顶帽散热片提供抓握区域。

    Mechanically steerable modular planar patch array antenna
    3.
    发明授权
    Mechanically steerable modular planar patch array antenna 失效
    机械导向模块式平面贴片阵列天线

    公开(公告)号:US5453753A

    公开(公告)日:1995-09-26

    申请号:US117624

    申请日:1993-09-08

    IPC分类号: H01Q3/08

    CPC分类号: H01Q3/08

    摘要: A planar patch array antenna for satellite communications. The antenna includes a planar patch array and a dual axis positioner for rotating the array about azimuth and elevation axes. The dual axis positioner is unique in that it consists of a plurality of individual modules which can be easily assembled and disassembled. The positioner consists of the following modules: a fixed pedestal, an azimuth drive module, an azimuth rotary module, an RF/slip ring module, an elevation drive module, an antenna support and an electronic module. According to the invention, the pedestal remains fixed and the azimuth drive module is received in a recess defined by the pedestal. The azimuth rotary module is rotatably supported on the pedestal and is driven by the azimuth drive module so that it rotates about the vertical or azimuth axis. The elevation drive module is fixed to the rotary drive module and rotatably supports the antenna support module. The elevation drive module includes a drive mechanism for causing the antenna support module and, attendantly, the antenna array secured thereto, to rotate about the elevation axis. Finally, the RF/slip ring module is provided within the elevation drive module for supplying RF power to the antenna array and for supplying DC power to the elevation drive module.

    摘要翻译: 用于卫星通信的平面贴片阵列天线。 天线包括平面贴片阵列和用于围绕方位角和仰角旋转阵列的双轴定位器。 双轴定位器是独特的,它由多个单独的模块组成,可以方便地组装和拆卸。 定位器包括以下模块:固定基座,方位驱动模块,方位旋转模块,RF /滑环模块,升降驱动模块,天线支架和电子模块。 根据本发明,基座保持固定,并且方位驱动模块被容纳在由基座限定的凹部中。 方位旋转模块可旋转地支撑在基座上,由方位驱动模块驱动,使其绕垂直或方位轴线旋转。 升降驱动模块固定在旋转驱动模块上,可旋转地支撑天线支撑模块。 升降驱动模块包括驱动机构,用于使天线支撑模块和伴随地固定到其上的天线阵列围绕仰角旋转。 最后,RF /滑环模块设置在升降驱动模块内,用于向天线阵列提供RF功率,并向升降驱动模块提供直流电力。

    Multichip imager with improved optical performance near the butt region
    4.
    发明授权
    Multichip imager with improved optical performance near the butt region 失效
    多芯片成像仪在对接区域附近具有改善的光学性能

    公开(公告)号:US4987295A

    公开(公告)日:1991-01-22

    申请号:US331137

    申请日:1989-03-31

    摘要: A compound imager consists of two or more individual chips, each with at least one line array of sensors thereupon. Each chip has a glass support plate attached to the side from which light reaches the line arrays. The chips are butted together end-to-end to make large line arrays of sensors. Because of imperfections in cutting, the butted surfaces define a gap. Light entering in the region of the gap is either lost or falls on an individual imager other than the one for which it is intended. This results in vignetting and/or crosstalk near the butted region. The gap is filled with an epoxy resin or other similar material which, when hardened, has an index of referaction near that of the glass support plate.

    摘要翻译: 复合成像器由两个或更多个单独的芯片组成,每个芯片具有至少一个线阵列的传感器。 每个芯片具有附接到光到达线阵列的一侧的玻璃支撑板。 芯片端对端对接,制成大型传感器阵列。 由于切割缺陷,对接面限定了间隙。 进入差距区域的光线或者丢失或落在单独的成像器上,而不是预期的那个。 这导致对接区域附近的渐晕和/或串扰。 间隙填充有环氧树脂或其它类似的材料,当硬化时,其具有接近玻璃支撑板的参考指数。

    Managing and organizing electronic mail messages via a cross tabulation summary or a histogram
    5.
    发明申请
    Managing and organizing electronic mail messages via a cross tabulation summary or a histogram 审中-公开
    通过交叉表汇总或直方图管理和组织电子邮件

    公开(公告)号:US20060277258A1

    公开(公告)日:2006-12-07

    申请号:US11145634

    申请日:2005-06-06

    申请人: Samuel Goldfarb

    发明人: Samuel Goldfarb

    IPC分类号: G06F15/16

    CPC分类号: G06Q10/107

    摘要: A method, computer program product and system for managing and organizing electronic mail messages. A computer system, referred to as a client, may receive input as to a period of time to organize electronic mail messages. The client may further receive sort criteria which is used to sort incoming electronic mail messages over the designated period of time. The client may then generate either a tabulation summary or a histogram, selected by the user, illustrating the electronic mail messages over the period of time that are sorted according to the received criteria. By displaying relevant information regarding e-mail messages received over a designated period of time in either a tabulation summary or a histogram, the user saves time from digesting and sorting out large volumes of electronic mail messages.

    摘要翻译: 一种用于管理和组织电子邮件消息的方法,计算机程序产品和系统。 称为客户端的计算机系统可以接收一段时间的输入以组织电子邮件消息。 客户端还可以接收用于在指定的时间段内分类进入的电子邮件消息的排序标准。 然后,客户端可以生成由用户选择的列表摘要或直方图,示出根据接收的标准对按时间段分类的电子邮件消息。 通过在列表总结或直方图中显示在指定时间段内接收到的电子邮件的相关信息,用户节省了消化和分类大量电子邮件消息的时间。

    Package for solid state image sensors
    6.
    发明授权
    Package for solid state image sensors 失效
    固态图像传感器封装

    公开(公告)号:US4760440A

    公开(公告)日:1988-07-26

    申请号:US547217

    申请日:1983-10-31

    IPC分类号: H01L23/06 H01L23/02 H01L23/12

    摘要: A package for solid state image sensor devices, such as CCD image sensors, includes a base plate on which a plurality of the image sensor devices are mounted in end-to-end abutting relation with the detector arrays of the image sensors being over an opening in the base plate, and a cover mounted on the base plate and extending over the image sensor devices to enclose the image sensor devices between the cover and the base plate. The base plate and cover are of polycrystalline silicon so as to have a coefficient of thermal expansion which matches that of the image sensor devices.

    摘要翻译: 用于诸如CCD图像传感器的固态图像传感器装置的封装包括基板,多个图像传感器装置与图像传感器的检测器阵列以端对端邻接的方式安装在其上, 在基板上,以及安装在基板上并延伸到图像传感器装置上的盖,以将图像传感器装置封闭在盖和基板之间。 基板和盖是多晶硅,以便具有与图像传感器装置的热膨胀系数匹配的热膨胀系数。