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1.发明申请公开(公告)号：US20060236027A1
公开(公告)日：2006-10-19
申请号：US11093706
申请日：2005-03-30
申请人： Sandeep Jain , Jun Shi , Animesh Mishra , David Wyatt , Paul Diefenbaugh , Pochang Hsu
发明人： Sandeep Jain , Jun Shi , Animesh Mishra , David Wyatt , Paul Diefenbaugh , Pochang Hsu
IPC分类号： G06F13/28
CPC分类号： G11C11/40626 , G11C7/04 , G11C11/406 , G11C11/40615 , G11C2211/4061 , G11C2211/4067
摘要： Self-refresh rates of a memory unit may be managed based on temperature. In one embodiment of the invention, the invention may include measuring the temperature of a memory unit, the memory unit having a self-refresh rate to maintain data integrity, comparing the measured temperature to a threshold, and adjusting the self-refresh rate of the memory unit based on the comparison.
摘要翻译： 可以基于温度来管理存储器单元的自刷新率。 在本发明的一个实施例中，本发明可以包括测量存储器单元的温度，存储器单元具有自刷新率以维持数据完整性，将测量的温度与阈值进行比较，并且调整自刷新率 记忆单元基于比较。
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公开(公告)号：US07356426B2
公开(公告)日：2008-04-08
申请号：US10955154
申请日：2004-09-30
申请人： Sandeep Jain , Animesh Mishra , Jun Shi , Pochang Hsu , David Wyatt
发明人： Sandeep Jain , Animesh Mishra , Jun Shi , Pochang Hsu , David Wyatt
CPC分类号： G11C29/028 , G01K3/005 , G01K7/42 , G01K15/00 , G11C29/02 , G11C2029/5002
摘要： A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.
摘要翻译： 描述了可以在半导体管芯上实现的热管理系统。 该系统可以包括热耦合到管芯的热传感器，以感测管芯的温度并产生表示感测温度的输出，以及耦合到热传感器以补偿热传感器输出的可调补偿电路。 可调补偿电路可以应用于热传感器或阈值。
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公开(公告)号：US20060066384A1
公开(公告)日：2006-03-30
申请号：US10955154
申请日：2004-09-30
申请人： Sandeep Jain , Animesh Mishra , Jun Shi , Pochang Hsu , David Wyatt
发明人： Sandeep Jain , Animesh Mishra , Jun Shi , Pochang Hsu , David Wyatt
IPC分类号： H03K17/14
CPC分类号： G11C29/028 , G01K3/005 , G01K7/42 , G01K15/00 , G11C29/02 , G11C2029/5002
摘要： A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.
摘要翻译： 描述了可以在半导体管芯上实现的热管理系统。 该系统可以包括热耦合到管芯的热传感器，以感测管芯的温度并产生表示感测温度的输出，以及耦合到热传感器以补偿热传感器输出的可调补偿电路。 可调补偿电路可以应用于热传感器或阈值。
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4.发明申请公开(公告)号：US20140112370A1
公开(公告)日：2014-04-24
申请号：US14142466
申请日：2013-12-27
申请人： Pochang Hsu , Animesh Mishra , Jun Shi
发明人： Pochang Hsu , Animesh Mishra , Jun Shi
IPC分类号： G01K13/00
CPC分类号： G01K13/00 , G06F1/206 , G06F1/3203 , G06F13/16 , G11C5/04 , G11C5/143 , G11C7/04 , Y02D10/16
摘要： Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.
摘要翻译： 管理存储器件的系统和方法通过增强的存储器节流来提供降低的功耗和更好的热管理。 在一个实施例中，存储器单元包括耦合到存储器件的存储器件和温度测量模块。 温度测量装置测量存储器件的内部温度。 因此，可以基于更准确的测量并且具有短得多的响应时间来实现内存限制。
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公开(公告)号：US20090262783A1
公开(公告)日：2009-10-22
申请号：US12495510
申请日：2009-06-30
申请人： Pochang Hsu , Animesh Mishra , Jun Shi
发明人： Pochang Hsu , Animesh Mishra , Jun Shi
IPC分类号： G01K13/00
CPC分类号： G01K13/00 , G06F1/206 , G06F1/3203 , G06F13/16 , G11C5/04 , G11C5/143 , G11C7/04 , Y02D10/16
摘要： Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.
摘要翻译： 管理存储器件的系统和方法通过增强的存储器节流来提供降低的功耗和更好的热管理。 在一个实施例中，存储器单元包括耦合到存储器件的存储器件和温度测量模块。 温度测量装置测量存储器件的内部温度。 因此，可以基于更准确的测量并且具有短得多的响应时间来实现内存限制。
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公开(公告)号：US20080043808A1
公开(公告)日：2008-02-21
申请号：US11924754
申请日：2007-10-26
申请人： Pochang Hsu , Animesh Mishra , Jun Shi
发明人： Pochang Hsu , Animesh Mishra , Jun Shi
CPC分类号： G01K13/00 , G06F1/206 , G06F1/3203 , G06F13/16 , G11C5/04 , G11C5/143 , G11C7/04 , Y02D10/16
摘要： Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.
摘要翻译： 管理存储器件的系统和方法通过增强的存储器节流来提供降低的功耗和更好的热管理。 在一个实施例中，存储器单元包括耦合到存储器件的存储器件和温度测量模块。 温度测量装置测量存储器件的内部温度。 因此，可以基于更准确的测量并且具有短得多的响应时间来实现内存限制。
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公开(公告)号：US09046424B2
公开(公告)日：2015-06-02
申请号：US12495510
申请日：2009-06-30
申请人： Pochang Hsu , Animesh Mishra , Jun Shi
发明人： Pochang Hsu , Animesh Mishra , Jun Shi
CPC分类号： G01K13/00 , G06F1/206 , G06F1/3203 , G06F13/16 , G11C5/04 , G11C5/143 , G11C7/04 , Y02D10/16
摘要： Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.
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公开(公告)号：US07553075B2
公开(公告)日：2009-06-30
申请号：US11924754
申请日：2007-10-26
申请人： Pochang Hsu , Animesh Mishra , Jun Shi
发明人： Pochang Hsu , Animesh Mishra , Jun Shi
CPC分类号： G01K13/00 , G06F1/206 , G06F1/3203 , G06F13/16 , G11C5/04 , G11C5/143 , G11C7/04 , Y02D10/16
摘要： Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.
摘要翻译： 管理存储器件的系统和方法通过增强的存储器节流来提供降低的功耗和更好的热管理。 在一个实施例中，存储器单元包括耦合到存储器件的存储器件和温度测量模块。 温度测量装置测量存储器件的内部温度。 因此，可以基于更准确的测量并且具有短得多的响应时间来实现内存限制。
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9.发明授权公开(公告)号：US07304905B2
公开(公告)日：2007-12-04
申请号：US10852923
申请日：2004-05-24
申请人： Pochang Hsu , Animesh Mishra , Jun Shi
发明人： Pochang Hsu , Animesh Mishra , Jun Shi
IPC分类号： G11C7/04
CPC分类号： G01K13/00 , G06F1/206 , G06F1/3203 , G06F13/16 , G11C5/04 , G11C5/143 , G11C7/04 , Y02D10/16
摘要： Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.
摘要翻译： 管理存储器件的系统和方法通过增强的存储器节流来提供降低的功耗和更好的热管理。 在一个实施例中，存储器单元包括耦合到存储器件的存储器件和温度测量模块。 温度测量装置测量存储器件的内部温度。 因此，可以基于更准确的测量并且具有短得多的响应时间来实现内存限制。
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公开(公告)号：US20050259496A1
公开(公告)日：2005-11-24
申请号：US10852923
申请日：2004-05-24
申请人： Pochang Hsu , Animesh Mishra , Jun Shi
发明人： Pochang Hsu , Animesh Mishra , Jun Shi
CPC分类号： G01K13/00 , G06F1/206 , G06F1/3203 , G06F13/16 , G11C5/04 , G11C5/143 , G11C7/04 , Y02D10/16
摘要： Systems and methods of managing memory devices provide for reduced power consumption and better thermal management through enhanced memory throttling. In one embodiment a memory unit includes a memory device and a temperature measurement module coupled to the memory device. The temperature measurement device measures the internal temperature of the memory device. Memory throttling can therefore be implemented based on more accurate measurements and with a much shorter response time.
摘要翻译： 管理存储器件的系统和方法通过增强的存储器节流来提供降低的功耗和更好的热管理。 在一个实施例中，存储器单元包括耦合到存储器件的存储器件和温度测量模块。 温度测量装置测量存储器件的内部温度。 因此，可以基于更准确的测量并且具有短得多的响应时间来实现内存限制。
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