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公开(公告)号：US20060089465A1
公开(公告)日：2006-04-27
申请号：US11107894
申请日：2005-04-18
申请人： Sang-Pil Kim , Hae-Sang Jun , Woo-Seok Kim , Se-Young Cha
发明人： Sang-Pil Kim , Hae-Sang Jun , Woo-Seok Kim , Se-Young Cha
CPC分类号： C08L13/00 , C08L61/06 , C08L63/00 , C08L2666/04 , C09J163/00 , Y10T428/1476 , Y10T428/266 , Y10T428/31721 , Y10T428/31938 , C08L2666/02
摘要： The present invention pertains to an adhesive tape composition for electronic components used for bonding electronic components used in semiconductor devices, e.g., leads, PRH, semiconductor chips, die pads, etc. In particular, the present invention concerns an adhesive tape composition excellent in electric reliability, adhesive strength and taping workability. The adhesive tape composition according to the present invention is characterized in that it contains acrylonitrile butadiene rubber (NBR) containing the carboxyl functional group at the end thereof, epoxy resin, phenol resin and one or more sorts of hardener selected from amine and acid anhydride hardeners.
摘要翻译： 本发明涉及用于接合半导体器件（例如引线，PRH，半导体芯片，芯片焊盘等）的电子部件的电子部件用胶粘剂组合物。特别地，本发明涉及电气性优异的胶带组合物 可靠性，粘合强度和胶带加工性。 根据本发明的胶带组合物的特征在于它含有末端含有羧基官能团的丙烯腈丁二烯橡胶（NBR），环氧树脂，酚醛树脂和一种或多种选自胺和酸酐硬化剂的硬化剂 。
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公开(公告)号：US20090011166A1
公开(公告)日：2009-01-08
申请号：US12190241
申请日：2008-08-12
申请人： Sang-Pil KIM , Hae-Sang Jun , Woo-Seok Kim , Se-Young Cha
发明人： Sang-Pil KIM , Hae-Sang Jun , Woo-Seok Kim , Se-Young Cha
CPC分类号： C08L13/00 , C08L61/06 , C08L63/00 , C08L2666/04 , C09J163/00 , Y10T428/1476 , Y10T428/266 , Y10T428/31721 , Y10T428/31938 , C08L2666/02
摘要： The present invention pertains to an adhesive tape composition for electronic components used for bonding electronic components used in semiconductor devices, e.g., leads, PRH, semiconductor chips, die pads, etc. In particular, the present invention concerns an adhesive tape composition excellent in electric reliability, adhesive strength and taping workability.The adhesive tape composition according to the present invention is characterized in that it contains acrylonitrile butadiene rubber (NBR) containing the carboxyl functional group at the end thereof, epoxy resin, phenol resin and one or more sorts of hardener selected from amine and acid anhydride hardeners.
摘要翻译： 本发明涉及用于接合半导体器件（例如引线，PRH，半导体芯片，芯片焊盘等）的电子部件的电子部件用胶粘剂组合物。特别地，本发明涉及电气性优异的胶带组合物 可靠性，粘合强度和胶带加工性。 根据本发明的胶带组合物的特征在于它含有末端含有羧基官能团的丙烯腈丁二烯橡胶（NBR），环氧树脂，酚醛树脂和一种或多种选自胺和酸酐硬化剂的硬化剂 。
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3.发明授权公开(公告)号：US08524833B2
公开(公告)日：2013-09-03
申请号：US12496768
申请日：2009-07-02
申请人： Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jun
发明人： Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jun
CPC分类号： G02B1/04 , C08J5/18 , C08J2323/06 , C08J2371/12 , G02B5/0242 , G02B5/0278
摘要： A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.
摘要翻译： 高效光扩散聚合物膜包括第一聚合物，其是透光介质，和形成光散射颗粒的第二聚合物，其中所述聚合物是不混溶的，折射率差为约0.001至约0.5，聚合物 相对于100重量份的第一聚合物，膜包含约30至约70重量份的第二聚合物。 进行制造高效聚合物膜的方法，使得第一聚合物形成连续相，第二聚合物通过涂布或挤出形成分散相。
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公开(公告)号：US07960023B2
公开(公告)日：2011-06-14
申请号：US11950470
申请日：2007-12-05
申请人： Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jun , Jun-Ho Lee , Yun-Min Park
发明人： Chang-Hoon Sim , Ki-Jeong Moon , Hae-Sang Jun , Jun-Ho Lee , Yun-Min Park
CPC分类号： H01L24/83 , C09J7/10 , C09J2201/36 , C09J2461/00 , C09J2463/00 , H01L25/0657 , H01L2224/26135 , H01L2224/29083 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2224/83101 , H01L2224/83856 , H01L2225/0651 , H01L2225/06575 , H01L2924/01012 , H01L2924/01077 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/351 , Y10T428/24975 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/31511 , H01L2924/00014 , H01L2924/3512 , H01L2924/00
摘要： There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.
摘要翻译： 提供了一种用于堆叠芯片的半导体层的粘合膜，包括：包含苯氧基树脂，环氧树脂和酚醛树脂的第一粘合剂层; 第二粘合剂层，其包含苯氧基树脂和紫外线固化性化合物; 以及包含苯氧基树脂，环氧树脂和酚醛树脂的第三粘合剂层，其中所述第二粘合剂层设置在所述第一粘合剂层和所述第三粘合剂层之间。
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5.发明申请公开(公告)号：US20100295001A1
公开(公告)日：2010-11-25
申请号：US12496768
申请日：2009-07-02
申请人： Chang-Hoon SIM , Ki-Jeong Moon , Hae-Sang Jun
发明人： Chang-Hoon SIM , Ki-Jeong Moon , Hae-Sang Jun
IPC分类号： G02F1/361
CPC分类号： G02B1/04 , C08J5/18 , C08J2323/06 , C08J2371/12 , G02B5/0242 , G02B5/0278
摘要： A high-efficiency light diffusing polymeric film comprises a first polymer which is a light transmissible medium, and a second polymer which forms light scattering particles, wherein the polymers are immiscible and have a refractive index difference of about 0.001 to about 0.5, and the polymeric film comprises about 30 about to 70 parts by weight of the second polymer with respect to 100 parts by weight of the first polymer. A method for manufacturing a high-efficiency polymeric film is carried out such that a first polymer forms a continuous phase and a second polymer forms a dispersed phase through coating or extrusion.
摘要翻译： 高效光扩散聚合物膜包括第一聚合物，其是透光介质，和形成光散射颗粒的第二聚合物，其中所述聚合物是不混溶的并且折射率差为约0.001至约0.5，聚合物 相对于100重量份的第一聚合物，膜包含约30至约70重量份的第二聚合物。 进行制造高效聚合物膜的方法，使得第一聚合物形成连续相，第二聚合物通过涂布或挤出形成分散相。
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公开(公告)号：US20090294046A1
公开(公告)日：2009-12-03
申请号：US11950454
申请日：2007-12-05
申请人： Chang-Hoon SIM , Ki-Jeong Moon , Hae-Sang Jun
发明人： Chang-Hoon SIM , Ki-Jeong Moon , Hae-Sang Jun
CPC分类号： H01B1/22 , H05K3/323 , H05K2201/083 , H05K2203/104
摘要： The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.
摘要翻译： 本发明涉及用于粘附IC的各向异性导电膜，例如LCD显示器等。导电膜的特征在于包括热固性粘合剂，超顺磁性金属氧化物纳米颗粒和导电颗粒，超顺磁性金属氧化物纳米 颗粒和导电颗粒分散在热固性组合物中。 通过本发明的这样的结构，通过高频实现低温固化是有利的，并且可以通过粘附IC（例如LCD显示器）中的磁场来控制颗粒的位置，使得高连接可靠性 实现了细间距连接电极。
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公开(公告)号：US20080226884A1
公开(公告)日：2008-09-18
申请号：US11950470
申请日：2007-12-05
申请人： Chang-Hoon SIM , Ki-Jeong Moon , Hae-Sang Jun , Jun-Ho Lee , Yun-Min Park
发明人： Chang-Hoon SIM , Ki-Jeong Moon , Hae-Sang Jun , Jun-Ho Lee , Yun-Min Park
CPC分类号： H01L24/83 , C09J7/10 , C09J2201/36 , C09J2461/00 , C09J2463/00 , H01L25/0657 , H01L2224/26135 , H01L2224/29083 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2224/83101 , H01L2224/83856 , H01L2225/0651 , H01L2225/06575 , H01L2924/01012 , H01L2924/01077 , H01L2924/01078 , H01L2924/01087 , H01L2924/10253 , H01L2924/351 , Y10T428/24975 , Y10T428/28 , Y10T428/2848 , Y10T428/2852 , Y10T428/287 , Y10T428/31511 , H01L2924/00014 , H01L2924/3512 , H01L2924/00
摘要： The invention concerns an adhesive film for stacking chips which enables chips to be stacked in layers without using a separate spacer usually provided to keep a given distance between wires of an upper chip and a lower chip to have the same area. The adhesive film of the invention has an intermediate adhesive layer of thermoplastic phenoxy resin on both side of which a thermosetting adhesive layer of epoxy resin is placed, respectively, to make a three-layer structure, the thermoplastic phenoxy resin comprising UV curable small molecule compounds. The adhesive film of the invention is a multi-layered adhesive film produced by a method of comprising the steps of achieving compatibility on an interface between the thermosetting epoxy resin and thermoplastic phenoxy resin and then directly forming a phenoxy film of a high elastic modulus through UV curing in an adhesive film. With such a configuration, the adhesive film for stacking semiconductor chips according to the invention enables the semiconductor silicone chips to be stacked in 3 or more layers without using a separate spacer between chips in order to keep a wire distance between upper and lower chips in stacking the chips. With the configuration, it is advantageous that reliability of semiconductors is not lowered because adhesiveness is kept despite of a repeated process of stacking chips subject to high temperature.
摘要翻译： 本发明涉及一种用于堆叠芯片的粘合膜，其使得芯片能够层叠而不使用通常设置用于保持上芯片和下芯片的导线之间的给定距离的单独间隔件具有相同的面积。 本发明的粘合膜具有热塑性苯氧基树脂的中间粘合剂层，其两侧分别放置环氧树脂的热固性粘合剂层以制成三层结构，所述热塑性苯氧基树脂包含可UV固化的小分子化合物 。 本发明的粘合膜是通过以下方法制造的多层粘合膜，该粘合膜包括以下步骤：在热固性环氧树脂和热塑性苯氧基树脂之间的界面上实现相容性，然后通过UV直接形成具有高弹性模量的苯氧基膜 在粘合膜中固化。 通过这样的结构，根据本发明的用于堆叠半导体芯片的粘合膜能够使半导体硅芯片层叠成3层以上，而不需要在芯片之间使用单独的间隔物，以便在堆叠中保持上下芯片之间的线间距 芯片。 通过该结构，由于尽管重叠堆叠处于高温的芯片的过程，因此保持了粘附性，因此有利的是半导体的可靠性不降低。
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