Nonvolatile memory element, nonvolatile memory device, nonvolatile semiconductor device, and method of manufacturing nonvolatile memory element
    1.
    发明授权
    Nonvolatile memory element, nonvolatile memory device, nonvolatile semiconductor device, and method of manufacturing nonvolatile memory element 有权
    非易失性存储元件,非易失性存储器件,非易失性半导体器件以及制造非易失性存储元件的方法

    公开(公告)号:US08445886B2

    公开(公告)日:2013-05-21

    申请号:US13147321

    申请日:2010-02-02

    IPC分类号: H01L29/02

    摘要: A nonvolatile memory element comprises a first electrode (103); a second electrode (105); and a resistance variable layer (104) disposed between the first electrode (103) and the second electrode (105), resistance values of the resistance variable layer reversibly changing in response to electric signals applied between the electrodes (103, 105); the resistance variable layer (104) including a first tantalum oxide layer (107) comprising a first tantalum oxide and a second tantalum oxide layer (108) comprising a second tantalum oxide which is different in oxygen content from the first tantalum oxide, the first tantalum oxide layer and the second tantalum oxide layer being stacked together, and being configured such that 0

    摘要翻译: 非易失性存储元件包括第一电极(103); 第二电极(105); 以及设置在所述第一电极(103)和所述第二电极(105)之间的电阻变化层(104),所述电阻变化层的电阻值响应于施加在所述电极(103,105)之间的电信号而可逆地变化; 电阻变化层(104)包括包含第一钽氧化物的第一钽氧化物层(107)和包含与第一钽氧化物不同氧含量的第二氧化钽的第二钽氧化物层(108),第一钽 氧化物层和第二钽氧化物层堆叠在一起,并且被配置为当第一钽氧化物表示为TaO x时满足0

    NONVOLATILE MEMORY ELEMENT, NONVOLATILE MEMORY DEVICE, NONVOLATILE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING NONVOLATILE MEMORY ELEMENT
    2.
    发明申请
    NONVOLATILE MEMORY ELEMENT, NONVOLATILE MEMORY DEVICE, NONVOLATILE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING NONVOLATILE MEMORY ELEMENT 有权
    非易失性存储器元件,非易失性存储器件,非易失性半导体器件以及制造非易失性存储器元件的方法

    公开(公告)号:US20110284816A1

    公开(公告)日:2011-11-24

    申请号:US13147321

    申请日:2010-02-02

    IPC分类号: H01L45/00

    摘要: A nonvolatile memory element comprises a first electrode (103); a second electrode (105); and a resistance variable layer (104) disposed between the first electrode (103) and the second electrode (105), resistance values of the resistance variable layer reversibly changing in response to electric signals applied between the electrodes (103, 105); the resistance variable layer (104) including a first tantalum oxide layer (107) comprising a first tantalum oxide and a second tantalum oxide layer (108) comprising a second tantalum oxide which is different in oxygen content from the first tantalum oxide, the first tantalum oxide layer and the second tantalum oxide layer being stacked together, and being configured such that 0

    摘要翻译: 非易失性存储元件包括第一电极(103); 第二电极(105); 以及设置在所述第一电极(103)和所述第二电极(105)之间的电阻变化层(104),所述电阻变化层的电阻值响应于施加在所述电极(103,105)之间的电信号而可逆地变化; 电阻变化层(104)包括包含第一钽氧化物的第一钽氧化物层(107)和包含与第一钽氧化物不同氧含量的第二氧化钽的第二钽氧化物层(108),第一钽 氧化物层和第二钽氧化物层堆叠在一起,并且被配置为当第一钽氧化物表示为TaO x并且x

    NONVOLATILE MEMORY ELEMENT AND NONVOLATILE MEMORY DEVICE INCORPORATING NONVOLATILE MEMORY ELEMENT
    3.
    发明申请
    NONVOLATILE MEMORY ELEMENT AND NONVOLATILE MEMORY DEVICE INCORPORATING NONVOLATILE MEMORY ELEMENT 有权
    非易失性存储器元件和非易失性存储器件,并入非易失性存储元件

    公开(公告)号:US20100308298A1

    公开(公告)日:2010-12-09

    申请号:US12745599

    申请日:2009-09-29

    IPC分类号: H01L45/00 H01L21/16

    摘要: A nonvolatile memory element includes a first electrode (103) formed on a substrate (101), a resistance variable layer (108) and a second electrode (107), wherein the resistance variable layer has a multi-layer structure including at least three layers which are a first transition metal oxide layer (104), a second transition metal oxide layer (106) which is higher in oxygen concentration than the first transition metal oxide layer (104), and a transition metal oxynitride layer (105). The second transition metal oxide layer (106) is in contact with either one of the first electrode (103) and the second electrode (107). The transition metal oxynitride layer (105) is provided between the first transition metal oxide layer (104) and the second transition metal oxide layer (106).

    摘要翻译: 非易失性存储元件包括形成在基板(101)上的第一电极(103),电阻变化层(108)和第二电极(107),其中电阻变化层具有至少三层的多层结构 其是第一过渡金属氧化物层(104),氧浓度高于第一过渡金属氧化物层(104)的第二过渡金属氧化物层(106)和过渡金属氮氧化物层(105)。 第二过渡金属氧化物层(106)与第一电极(103)和第二电极(107)中的任一个接触。 过渡金属氧氮化物层(105)设置在第一过渡金属氧化物层(104)和第二过渡金属氧化物层(106)之间。

    Nonvolatile memory element and nonvolatile memory device incorporating nonvolatile memory element
    4.
    发明授权
    Nonvolatile memory element and nonvolatile memory device incorporating nonvolatile memory element 有权
    非易失性存储器元件和非易失性存储器件结合非易失性存储元件

    公开(公告)号:US08441060B2

    公开(公告)日:2013-05-14

    申请号:US12745599

    申请日:2009-09-29

    IPC分类号: H01L29/792

    摘要: A nonvolatile memory element includes a first electrode (103) formed on a substrate (101), a resistance variable layer (108) and a second electrode (107), wherein the resistance variable layer has a multi-layer structure including at least three layers which are a first transition metal oxide layer (104), a second transition metal oxide layer (106) which is higher in oxygen concentration than the first transition metal oxide layer (104), and a transition metal oxynitride layer (105). The second transition metal oxide layer (106) is in contact with either one of the first electrode (103) and the second electrode (107). The transition metal oxynitride layer (105) is provided between the first transition metal oxide layer (104) and the second transition metal oxide layer (106).

    摘要翻译: 非易失性存储元件包括形成在基板(101)上的第一电极(103),电阻变化层(108)和第二电极(107),其中电阻变化层具有至少三层的多层结构 其是第一过渡金属氧化物层(104),氧浓度高于第一过渡金属氧化物层(104)的第二过渡金属氧化物层(106)和过渡金属氮氧化物层(105)。 第二过渡金属氧化物层(106)与第一电极(103)和第二电极(107)中的任一个接触。 过渡金属氧氮化物层(105)设置在第一过渡金属氧化物层(104)和第二过渡金属氧化物层(106)之间。

    NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT, NONVOLATILE SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    6.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT, NONVOLATILE SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 有权
    非易失性半导体存储器元件,非易失性半导体存储器件及其制造非易失性半导体存储器件的方法

    公开(公告)号:US20130270510A1

    公开(公告)日:2013-10-17

    申请号:US13996203

    申请日:2012-06-18

    IPC分类号: H01L27/24 H01L45/00

    摘要: A nonvolatile semiconductor memory element includes: a variable resistance element including a first electrode, a variable resistance layer, and a second electrode, and having a resistance value which changes according to a polarity of an electric pulse applied between the first electrode and the second electrode; and a current steering element which is electrically connected to the variable resistance element, allows a current to flow bidirectionally, and has a nonlinear current-voltage characteristic. The current steering element (i) has a structure in which a first current steering element electrode, a first semiconductor layer, and a second current steering element electrode are stacked in this order, and (ii) includes a second semiconductor layer which covers side surfaces of the first current steering element electrode, the first semiconductor layer, and the second current steering element electrode.

    摘要翻译: 非易失性半导体存储元件包括:可变电阻元件,包括第一电极,可变电阻层和第二电极,并且具有根据施加在第一电极和第二电极之间的电脉冲的极性而变化的电阻值 ; 并且电连接到可变电阻元件的电流导向元件允许电流双向流动,并且具有非线性电流 - 电压特性。 当前的操舵元件(i)具有第一电流操舵元件电极,第一半导体层和第二电流操舵元件电极依次层叠的结构,(ⅱ)包括覆盖侧面的第二半导体层 的第一电流操舵元件电极,第一半导体层和第二电流操舵元件电极。

    METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY ELEMENT AND METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE
    7.
    发明申请
    METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY ELEMENT AND METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE 有权
    制造非易失性半导体存储器元件的方法和制造非易失性半导体存储器件的方法

    公开(公告)号:US20120295413A1

    公开(公告)日:2012-11-22

    申请号:US13574254

    申请日:2010-12-28

    IPC分类号: H01L21/02

    摘要: A method of manufacturing a non-volatile semiconductor memory element including a variable resistance element and a non-ohmic element. The variable resistance element includes a first electrode, a variable resistance layer, and a shared electrode. The non-ohmic element includes the shared electrode, a semiconductor or insulator layer, and a second electrode. The method includes: forming the first electrode on a substrate; forming the variable resistance layer on the first electrode; forming the shared electrode by nitriding a front surface of the variable resistance layer; forming the semiconductor or insulator layer on the shared electrode; and forming the second electrode. In the forming of the shared electrode, a front surface of a transition metal oxide is nitrided by a plasma nitriding process to form the shared electrode comprising a transition metal nitride.

    摘要翻译: 一种制造包括可变电阻元件和非欧姆元件的非易失性半导体存储元件的方法。 可变电阻元件包括第一电极,可变电阻层和共用电极。 非欧姆元件包括共用电极,半导体或绝缘体层和第二电极。 该方法包括:在基板上形成第一电极; 在所述第一电极上形成所述可变电阻层; 通过对可变电阻层的前表面进行氮化而形成共用电极; 在共用电极上形成半导体层或绝缘体层; 并形成第二电极。 在共用电极的形成中,通过等离子体氮化处理使过渡金属氧化物的前表面氮化,形成包含过渡金属氮化物的共用电极。

    NONVOLATILE MEMORY DEVICE
    8.
    发明申请
    NONVOLATILE MEMORY DEVICE 审中-公开
    非易失性存储器件

    公开(公告)号:US20120292588A1

    公开(公告)日:2012-11-22

    申请号:US13503770

    申请日:2011-12-15

    IPC分类号: H01L47/00

    摘要: A nonvolatile memory device including: a strip-shaped first electrode line (151); a third interlayer insulating layer (16); a variable resistance layer having a stacked structure including a first variable resistance layer (18a) comprising an oxygen-deficient transition metal oxide and formed in a memory cell hole (29) to cover a bottom and a side face, and a second variable resistance layer (18b) comprising an oxygen- and/or nitrogen-deficient transition metal oxynitride having a different oxygen content than the first variable resistance layer; a first electrode (19) formed in the memory cell hole; and a strip-shaped first line (22) formed in a direction crossing the first electrode line (151) to cover at least an opening of the memory cell hole, and z>(x+y) is satisfied when the transition metal is represented by M and compositions of the first and the second variable resistance layers by MOz and MOxNy, respectively.

    摘要翻译: 一种非易失性存储器件,包括:带状第一电极线(151); 第三层间绝缘层(16); 具有堆叠结构的可变电阻层,包括由缺氧过渡金属氧化物构成的第一可变电阻层(18a),形成在存储单元孔(29)中以覆盖底部和侧面;以及第二可变电阻层 (18b),其包含氧含量低于所述第一可变电阻层的氧和/或氮缺乏的过渡金属氮氧化物; 形成在所述存储单元孔中的第一电极(19) 以及沿着与第一电极线(151)交叉的方向形成的带状第一线(22),以覆盖存储单元孔的至少一个开口,并且当表示过渡金属时,满足z>(x + y) 分别由M和第一和第二可变电阻层的组成分别由MOz和MOxNy组成。

    Manufacturing method of non-volatile memory device
    9.
    发明授权
    Manufacturing method of non-volatile memory device 有权
    非易失性存储器件的制造方法

    公开(公告)号:US09012294B2

    公开(公告)日:2015-04-21

    申请号:US13812227

    申请日:2011-07-26

    摘要: Each of the step of forming a first variable resistance layer (18a) and the step of forming a second variable resistance layer (18b) includes performing a cycle once or plural times, the cycle consisting of a first step of introducing a source gas composed of molecules containing atoms of a transition metal; a second step of removing the source gas after the first step; a third step of introducing a reactive gas to form a transition metal oxide after the second step; and a fourth step of removing the reactive gas after the third step. The step of forming the first variable resistance layer (18a) is performed in a state in which the substrate is kept at a temperature at which a self-decomposition reaction of the source gas does not occur. One or plural of conditions used for forming the second variable resistance layer (18b) is/are made different from the one or plural conditions used for forming the first variable resistance layer (18a), the conditions being the temperature of the substrate, an amount of the introduced source gas and an amount of the introduced reactive gas.

    摘要翻译: 形成第一可变电阻层(18a)的步骤和形成第二可变电阻层(18b)的步骤包括执行一次或多次的循环,所述循环包括:引入由 含有过渡金属原子的分子; 在第一步骤之后除去源气体的第二步骤; 在第二步骤之后引入反应气体以形成过渡金属氧化物的第三步骤; 以及在第三步骤之后除去反应气体的第四步骤。 形成第一可变电阻层(18a)的步骤是在基板保持在不发生源气体的自分解反应的温度的状态下进行的。 使用于形成第二可变电阻层(18b)的一个或多个条件与用于形成第一可变电阻层(18a)的一个或多个条件不同,条件是基板的温度, 的引入源气体和一定量的引入的反应气体。

    NONVOLATILE MEMORY ELEMENT AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明申请
    NONVOLATILE MEMORY ELEMENT AND METHOD FOR MANUFACTURING THE SAME 有权
    非易失性存储元件及其制造方法

    公开(公告)号:US20140021429A1

    公开(公告)日:2014-01-23

    申请号:US14006424

    申请日:2013-01-18

    IPC分类号: H01L45/00

    摘要: A nonvolatile memory element includes a first electrode, a second electrode, and a variable resistance layer positioned between the first electrode and the second electrode. The variable resistance layer has a resistance state which reversibly changes based on an electrical signal applied between the first electrode and the second electrode. The variable resistance layer includes a first variable resistance layer having a first metal oxide and a second variable resistance layer having a second metal oxide. The second variable resistance layer includes a metal-metal bonding region including a metal bond of metal atoms included in the second metal oxide, and the second metal oxide has a low degree of oxygen deficiency and a high resistance value compared to the first metal oxide.

    摘要翻译: 非易失性存储元件包括位于第一电极和第二电极之间的第一电极,第二电极和可变电阻层。 可变电阻层具有基于施加在第一电极和第二电极之间的电信号而可逆地改变的电阻状态。 可变电阻层包括具有第一金属氧化物的第一可变电阻层和具有第二金属氧化物的第二可变电阻层。 第二可变电阻层包括与第一金属氧化物相比具有包括在第二金属氧化物中的包含金属原子的金属键的金属 - 金属结合区域,并且第二金属氧化物具有低的氧缺乏程度和高的电阻值。