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公开(公告)号：US07440281B2
公开(公告)日：2008-10-21
申请号：US11344657
申请日：2006-02-01
申请人： Sean Ashley Bailey , Richard Lidio Blanco, Jr. , David Edwards , Supratik Guha , Michael David Hillman , Yves C. Martin , Phillip Lee Mort , Roger Schmidt , Prabjit Singh , Ronald Jack Smith , Gregory L. Tice , Theodore Gerard van Kessel
发明人： Sean Ashley Bailey , Richard Lidio Blanco, Jr. , David Edwards , Supratik Guha , Michael David Hillman , Yves C. Martin , Phillip Lee Mort , Roger Schmidt , Prabjit Singh , Ronald Jack Smith , Gregory L. Tice , Theodore Gerard van Kessel
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
摘要翻译： 一种用于将热量从计算机部件传导到散热器的装置。 本发明可以包括热界面材料（TIM）。 本发明还可以包括至少部分地包围TIM的密封件或垫圈。 垫圈可以有助于将TIM保持在其侧壁内，从而在计算机部件上或附近保持适当的位置。 通常，垫圈可以放置在计算机部件（或者硅板或计算机部件所在的其它材料）和散热器之间。 插入件可以放置在垫圈内并且限定孔。 芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。 干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。
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公开(公告)号：US07838418B2
公开(公告)日：2010-11-23
申请号：US11954158
申请日：2007-12-11
申请人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Amir Salehi , Richard Lidio Blanco, Jr. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson , James M. Crowder , Jeffrey J. Van Norden , Jonathan N. Urquhart
发明人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Amir Salehi , Richard Lidio Blanco, Jr. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson , James M. Crowder , Jeffrey J. Van Norden , Jonathan N. Urquhart
IPC分类号： H01L21/44
CPC分类号： H01L23/42 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.
摘要翻译： 描述了用于施加热界面材料的方法的实施例。 在该方法中，制备散热装置的第一表面和半导体管芯的第二表面。 接下来，定义作为第一表面和第二表面中的至少一个的给定表面上的区域。 然后，将热界面材料施加到至少该区域，其中热界面材料在半导体管芯的工作温度范围内包括作为液态金属的材料。
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3.发明授权Coupling heat sink to integrated circuit chip with thermal interface material 有权将散热片耦合到具有热界面材料的集成电路芯片公开(公告)号：US08564955B2
公开(公告)日：2013-10-22
申请号：US13151144
申请日：2011-06-01
申请人： Chad C Schmidt , Richard Lidio Blanco, Jr. , Douglas L Heirich , Michael D Hillman , Phillip L Mort , Jay S Nigen , Gregory L Tice
发明人： Chad C Schmidt , Richard Lidio Blanco, Jr. , Douglas L Heirich , Michael D Hillman , Phillip L Mort , Jay S Nigen , Gregory L Tice
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译： 本发明的实施例提供一种用于分配热界面材料的系统。 该系统包括：集成电路芯片; 散热器 以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。 在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的匹配表面之间时以预定图案分布 集成电路芯片。
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公开(公告)号：US07961469B2
公开(公告)日：2011-06-14
申请号：US12415760
申请日：2009-03-31
申请人： Chad C Schmidt , Richard Lidio Blanco, Jr. , Douglas L Heirich , Michael D Hillman , Phillip L Mort , Jay S Nigen , Gregory L Tice
发明人： Chad C Schmidt , Richard Lidio Blanco, Jr. , Douglas L Heirich , Michael D Hillman , Phillip L Mort , Jay S Nigen , Gregory L Tice
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译： 本发明的实施例提供一种用于分配热界面材料的系统。 该系统包括：集成电路芯片; 散热器 以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。 在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布 集成电路芯片。
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公开(公告)号：US07433191B2
公开(公告)日：2008-10-07
申请号：US11241061
申请日：2005-09-30
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/42 , H01L2924/0002 , H01L2924/10158 , Y10T29/49126 , Y10T29/49128 , Y10T29/49169 , Y10T29/4935 , H01L2924/00
摘要： A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of the heat sink and a second zone formed on a second area of the heat sink. The processor may overlap or overlie the first zone, with the second zone generally outside the footprint of the processor and optionally surrounding the processor's footprint. The first zone may have a generally smooth surface, while the second zone may have a surface rougher than the first zone. The first zone may be finished to a specific smoothness while the second zone may be finished to second particular smoothness that is generally less than the first zone.
摘要翻译： 热接触布置。 热接触布置可以减轻或减少位于芯片和散热器之间的热界面材料随时间的迁移。 热接触装置可以包括形成在散热器的第一区域上的第一区域和形成在散热器的第二区域上的第二区域。 处理器可以与第一区域重叠或覆盖，其中第二区域通常在处理器的占位面积之外，并且可选地围绕处理器的占用面积。 第一区域可以具有大致平滑的表面，而第二区域可以具有比第一区域更粗糙的表面。 第一区域可以完成到特定的平滑度，而第二区域可以被完成为通常小于第一区域的第二特定平滑度。
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公开(公告)号：US07701716B2
公开(公告)日：2010-04-20
申请号：US12141295
申请日：2008-06-18
CPC分类号： H05K7/20336 , F28D15/0275 , F28D2015/0216 , F28F2013/006
摘要： Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.
摘要翻译： 对传热机构的实施例进行说明。 该传热机构包括具有第一端和第二端的第一热管和具有第三端和第四端的第二热管。 此外，热管联接器热耦合到第一热管的第二端和第二热管的第三端。 该热管联接器包括围绕空腔的壳体和容纳在空腔内的液体金属，从而提供从第一热管的第一端（其被配置为连接到冷凝器）到第二热管的第四端的热路径， 其配置成耦合到蒸发器。
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公开(公告)号：US08305728B2
公开(公告)日：2012-11-06
申请号：US12827421
申请日：2010-06-30
IPC分类号： H01T23/00
CPC分类号： H01T23/00 , F28F13/16 , F28F27/02 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Embodiments provide various apparatus and techniques for deflecting or redirecting a flow of ionized air generated from an ionic wind generator. In general, a deflection field generator can be located proximate to the path of the flow of ionized air. The deflection field generator is configured to generate an electromagnetic field, which deflects a least a portion of the flow of ionized air to a different path and may possibly increase local heat transfer.
摘要翻译： 实施例提供了用于偏转或重定向从离子风发生器产生的电离空气流的各种装置和技术。 通常，偏转场发生器可以位于离电离空气流的路径附近。 偏转场发生器被配置为产生电磁场，其将至少一部分电离空气流偏转到不同的路径并且可能增加局部热传递。
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公开(公告)号：US08215012B2
公开(公告)日：2012-07-10
申请号：US12244192
申请日：2008-10-02
CPC分类号： H01L23/433 , H01L23/42 , H01L2924/0002 , H01L2924/10158 , Y10T29/49126 , Y10T29/49128 , Y10T29/49169 , Y10T29/4935 , H01L2924/00
摘要： A method of manufacturing a thermal contact arrangement. The method including the operations of providing a thermal conductor and forming a first zone having a first roughness on a first portion of a first exterior surface of the thermal conductor. The method further including the operation of forming a second zone having a second roughness on a second portion of the first exterior surface of the thermal conductor. The second portion is unique from the first portion and formed from a part of the thermal contact arrangement other than the first portion and the second roughness is rougher than the first roughness.
摘要翻译： 一种制造热接触装置的方法。 该方法包括提供热导体和在热导体的第一外表面的第一部分上形成具有第一粗糙度的第一区域的操作。 该方法还包括在热导体的第一外表面的第二部分上形成具有第二粗糙度的第二区的操作。 第二部分与第一部分是唯一的，并且由除第一部分之外的热接触装置的一部分形成，并且第二粗糙度比第一粗糙度更粗糙。
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