公开(公告)号：US20120263269A1

公开(公告)日：2012-10-18

申请号：US11008288

申请日：2004-12-10

申请人： Seiji Yamamoto ,  Tadasu Yotsuyanagi ,  Nagayoshi Ichikawa ,  Tetsuo Oosato ,  Masato Okamura ,  Junichi Takagi ,  Kenji Yamazaki ,  Shunichi Suzuki ,  Kenro Takamori ,  Mitsuru Sambongi ,  Takeshi Shibano ,  Takashi Hirano ,  Yuichi Fukaya

发明人： Seiji Yamamoto ,  Tadasu Yotsuyanagi ,  Nagayoshi Ichikawa ,  Tetsuo Oosato ,  Masato Okamura ,  Junichi Takagi ,  Kenji Yamazaki ,  Shunichi Suzuki ,  Kenro Takamori ,  Mitsuru Sambongi ,  Takeshi Shibano ,  Takashi Hirano ,  Yuichi Fukaya

IPC分类号： G21C9/00

CPC分类号： G21C17/0225 ,  G21C19/28

摘要： In a method of reducing corrosion of a material constituting a nuclear reactor structure, an electrochemical corrosion potential is controlled by injecting a solution or a suspension containing a substance generating an excitation current by an action of at least one of radiation, light, and heat existing in a nuclear reactor, or a metal or a metallic compound forming the substance generating the excitation current under the condition in the nuclear reactor to allow the substance generating the excitation current to adhere to the surface of the nuclear reactor structural material, and by injecting hydrogen in cooling water of the nuclear reactor while controlling the hydrogen concentration in a feed water.

摘要翻译： 在减少构成核反应堆结构的材料的腐蚀的方法中，电化学腐蚀电位通过注入含有产生激发电流的物质的溶液或悬浮液来控制，该溶液或悬浮液通过存在辐射，光和热中的至少一种的作用 或在核反应堆中形成产生激励电流的物质的金属或金属化合物，以使产生激发电流的物质附着到核反应堆结构材料的表面，并通过注入氢 同时控制供水中的氢浓度。

公开(公告)号：US20130070888A1

公开(公告)日：2013-03-21

申请号：US13619377

申请日：2012-09-14

申请人： Seiji YAMAMOTO ,  Tadasu Yotsuyanagi ,  Nagayoshi Ichikawa ,  Tetsuo Oosato ,  Masato Okamura ,  Junichi Takagi ,  Kenji Yamazaki ,  Shunichi Suzuki ,  Kenro Takamori ,  Mitsuru Sambongi ,  Takeshi Shibano ,  Takashi Hirano ,  Yuichi Fukaya

发明人： Seiji YAMAMOTO ,  Tadasu Yotsuyanagi ,  Nagayoshi Ichikawa ,  Tetsuo Oosato ,  Masato Okamura ,  Junichi Takagi ,  Kenji Yamazaki ,  Shunichi Suzuki ,  Kenro Takamori ,  Mitsuru Sambongi ,  Takeshi Shibano ,  Takashi Hirano ,  Yuichi Fukaya

IPC分类号： G21C9/00

CPC分类号： G21C9/00 ,  G21C3/324 ,  G21Y2002/103 ,  Y02E30/40

摘要： In a method of reducing corrosion of a material constituting a nuclear reactor structure, an electrochemical corrosion potential is controlled by injecting a solution or a suspension containing a substance generating an excitation current by an action of at least one of radiation, light, and heat existing in a nuclear reactor, or a metal or a metallic compound forming the substance generating the excitation current under the condition in the nuclear reactor to allow the substance generating the excitation current to adhere to the surface of the nuclear reactor structural material, and by injecting hydrogen in cooling water of the nuclear reactor while controlling the hydrogen concentration in a feed water.

摘要翻译： 在减少构成核反应堆结构的材料的腐蚀的方法中，电化学腐蚀电位通过注入含有产生激发电流的物质的溶液或悬浮液来控制，该溶液或悬浮液通过存在辐射，光和热中的至少一种的作用 或在核反应堆中形成产生激励电流的物质的金属或金属化合物，以使产生激发电流的物质附着到核反应堆结构材料的表面，并通过注入氢 同时控制供水中的氢浓度。

公开(公告)号：US08731131B2

公开(公告)日：2014-05-20

申请号：US13619377

申请日：2012-09-14

申请人： Seiji Yamamoto ,  Tadasu Yotsuyanagi ,  Nagayoshi Ichikawa ,  Tetsuo Oosato ,  Masato Okamura ,  Junichi Takagi ,  Kenji Yamazaki ,  Shunichi Suzuki ,  Kenro Takamori ,  Mitsuru Sambongi ,  Takeshi Shibano ,  Takashi Hirano ,  Yuichi Fukaya

发明人： Seiji Yamamoto ,  Tadasu Yotsuyanagi ,  Nagayoshi Ichikawa ,  Tetsuo Oosato ,  Masato Okamura ,  Junichi Takagi ,  Kenji Yamazaki ,  Shunichi Suzuki ,  Kenro Takamori ,  Mitsuru Sambongi ,  Takeshi Shibano ,  Takashi Hirano ,  Yuichi Fukaya

IPC分类号： G21C15/28

CPC分类号： G21C9/00 ,  G21C3/324 ,  G21Y2002/103 ,  Y02E30/40

摘要： In a method of reducing corrosion of a material constituting a nuclear reactor structure, an electrochemical corrosion potential is controlled by injecting a solution or a suspension containing a substance generating an excitation current by an action of at least one of radiation, light, and heat existing in a nuclear reactor, or a metal or a metallic compound forming the substance generating the excitation current under the condition in the nuclear reactor to allow the substance generating the excitation current to adhere to the surface of the nuclear reactor structural material, and by injecting hydrogen in cooling water of the nuclear reactor while controlling the hydrogen concentration in a feed water.

摘要翻译： 在减少构成核反应堆结构的材料的腐蚀的方法中，电化学腐蚀电位通过注入含有产生激发电流的物质的溶液或悬浮液来控制，该溶液或悬浮液通过存在辐射，光和热中的至少一种的作用 或在核反应堆中形成产生激励电流的物质的金属或金属化合物，以使产生激发电流的物质附着到核反应堆结构材料的表面，并通过注入氢 同时控制供水中的氢浓度。

公开(公告)号：US08295426B1

公开(公告)日：2012-10-23

申请号：US11008288

申请日：2004-12-10

申请人： Seiji Yamamoto ,  Tadasu Yotsuyanagi ,  Nagayoshi Ichikawa ,  Tetsuo Oosato ,  Masato Okamura ,  Junichi Takagi ,  Kenji Yamazaki ,  Shunichi Suzuki ,  Kenro Takamori ,  Mitsuru Sambongi ,  Takeshi Shibano ,  Takashi Hirano ,  Yuichi Fukaya

发明人： Seiji Yamamoto ,  Tadasu Yotsuyanagi ,  Nagayoshi Ichikawa ,  Tetsuo Oosato ,  Masato Okamura ,  Junichi Takagi ,  Kenji Yamazaki ,  Shunichi Suzuki ,  Kenro Takamori ,  Mitsuru Sambongi ,  Takeshi Shibano ,  Takashi Hirano ,  Yuichi Fukaya

IPC分类号： G21C9/00

CPC分类号： G21C17/0225 ,  G21C19/28

摘要： In a method of reducing corrosion of a material constituting a nuclear reactor structure, an electrochemical corrosion potential is controlled by injecting a solution or a suspension containing a substance generating an excitation current by an action of at least one of radiation, light, and heat existing in a nuclear reactor, or a metal or a metallic compound forming the substance generating the excitation current under the condition in the nuclear reactor to allow the substance generating the excitation current to adhere to the surface of the nuclear reactor structural material, and by injecting hydrogen in cooling water of the nuclear reactor while controlling the hydrogen concentration in a feed water.

摘要翻译： 在减少构成核反应堆结构的材料的腐蚀的方法中，电化学腐蚀电位通过注入含有产生激发电流的物质的溶液或悬浮液来控制，该溶液或悬浮液通过存在辐射，光和热中的至少一种的作用 或在核反应堆中形成产生激励电流的物质的金属或金属化合物，以使产生激发电流的物质附着到核反应堆结构材料的表面，并通过注入氢 同时控制供水中的氢浓度。

公开(公告)号：US08759957B2

公开(公告)日：2014-06-24

申请号：US12866108

申请日：2009-02-06

申请人： Takashi Hirano

发明人： Takashi Hirano

IPC分类号： H01L23/02

CPC分类号： H01L23/295 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/29 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27436 ,  H01L2224/29111 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A film for use in manufacturing a semiconductor device having at least one semiconductor element of the present invention is characterized by comprising: a base sheet having one surface; and a bonding layer provided on the one surface of the base sheet, the bonding layer being adapted to be bonded to the semiconductor element in the semiconductor device, the bonding layer being formed of a resin composition comprising a crosslinkable resin and a compound having flux activity. Further, it is preferred that in the film of the present invention, the semiconductor element is of a flip-chip type and has a functional surface, and the bonding layer is adapted to be bonded to the functional surface of the semiconductor element.

摘要翻译： 用于制造具有本发明的至少一个半导体元件的半导体器件的薄膜的特征在于包括：具有一个表面的基片; 以及设置在所述基片的一个表面上的接合层，所述接合层适于与所述半导体器件中的所述半导体元件接合，所述接合层由包含可交联树脂和具有助焊剂活性的化合物的树脂组合物形成 。 此外，优选在本发明的膜中，半导体元件为倒装型，具有功能面，并且接合层适于与半导体元件的功能面接合。

公开(公告)号：US08530119B2

公开(公告)日：2013-09-10

申请号：US13321180

申请日：2009-05-20

申请人： Takashi Hirano ,  Toshio Banba ,  Shusaku Okamyo ,  Hiroaki Makabe

发明人： Takashi Hirano ,  Toshio Banba ,  Shusaku Okamyo ,  Hiroaki Makabe

IPC分类号： G03F7/023

CPC分类号： G03F7/0233 ,  G03F7/0226

摘要： A positive photosensitive resin composition includes (A) a polybenzoxazole precursor resin, (B) a photosensitive diazoquinone compound, (C) a hindered phenol antioxidant shown by the following general formula (1), and (D) a phenol compound shown by the following general formula (2). Formula (1) is: wherein R1 represents a hydrogen atom or an organic group having 1 to 4 carbon atoms, a is an integer from 1 to 3, and b is an integer from 1 to 3. Formula (2) is: wherein R2 represents a methylene group or a single bond, c is an integer from 1 to 3, and d is an integer from 1 to 3. A protective film, an interlayer insulating film, and a semiconductor device and a display element using the same are also disclosed.

摘要翻译： 正型感光性树脂组合物包含（A）聚苯并恶唑前体树脂，（B）感光性重氮醌化合物，（C）下述通式（1）所示的受阻酚抗氧化剂，（D）下述通式 通式（2）。 式（1）为：式中，R 1表示氢原子或碳原子数1〜4的有机基团，a为1〜3的整数，b为1〜3的整数。式（2） 表示亚甲基或单键，c为1〜3的整数，d为1〜3的整数。保护膜，层间绝缘膜及半导体装置以及使用该键的显示元件也是 披露

公开(公告)号：US08209529B2

公开(公告)日：2012-06-26

申请号：US11179602

申请日：2005-07-13

申请人： Takashi Hirano ,  Atsushi Nunome ,  Hiroaki Hirata ,  Kiyoshi Shibayama

发明人： Takashi Hirano ,  Atsushi Nunome ,  Hiroaki Hirata ,  Kiyoshi Shibayama

IPC分类号： H04L29/06

CPC分类号： H04L63/08

摘要： A DHCP server 8 dispenses an IP address in response to a request from a terminal equipment 1. An authentication server 3 receives an authentication frame transmitted from the terminal equipment 1 using the dispensed IP address as a sender address and authenticates the terminal equipment 1. Upon completion of authentication, the authentication server 3 informs a registration information database 22 of an authentication hub 2 of communication permission for the terminal equipment 1. In the authentication hub 2, a frame receiving circuit 21 receives a transmission frame transmitted from the terminal equipment 1. The authentication hub 2 refers to the registration information database 22 on the basis of sender information of the transmission frame, determines transmission, rewriting-and-transmission, or discarding for the frame, and sends the transmission frame to a transmission buffer 23 if transmission or rewriting-and-transmission is permitted for the frame.

摘要翻译： DHCP服务器8响应于来自终端设备1的请求来分配IP地址。认证服务器3使用分配的IP地址作为发送者地址接收从终端设备1发送的认证帧，并对终端设备1进行认证。 认证服务器3向认证中心2的登记信息数据库22通知终端设备1的通信许可。在认证集线器2中，帧接收电路21接收从终端设备1发送的传输帧。 认证集线器2基于发送帧的发送者信息来参考注册信息数据库22，确定发送，重写和发送，或丢弃该帧，并且如果发送或发送，则将发送帧发送到发送缓冲器23 框架允许重写传输。

公开(公告)号：US20120108012A1

公开(公告)日：2012-05-03

申请号：US13382593

申请日：2010-05-31

申请人： Hiroyuki Yasuda ,  Takashi Hirano ,  Naoya Oda

发明人： Hiroyuki Yasuda ,  Takashi Hirano ,  Naoya Oda

IPC分类号： B32B3/00 ,  B32B7/02 ,  B32B3/02 ,  H01L21/78 ,  B32B5/00

CPC分类号： H01L24/27 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68359 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30105 ,  Y10T428/15 ,  Y10T428/24777 ,  Y10T428/2495 ,  Y10T428/24983 ,  Y10T428/265 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when the semiconductor elements obtained by the dicing are picked up. This film for semiconductor is characterized in that an average thickness of the second adhesive layer is in the range of 20 to 100 μm. This makes it possible to control cutting lines formed during the dicing so as to locate distal ends thereof within the first adhesive layer easily and reliably and to prevent defects which would be generated when the cutting lines come down to the support film.

摘要翻译： 半导体膜包括依次层叠在一起的支撑膜，第二粘合层，第一粘合层和接合层。 这种半导体膜被配置为当半导体晶片被切割时，它支撑层叠在其接合层上的半导体晶片，并且当通过切割获得的半导体元件被拾取时，从第一粘合剂层选择性地剥离接合层。 该半导体膜的特征在于，第二粘合层的平均厚度在20〜100μm的范围内。 这使得可以控制在切割期间形成的切割线，以便容易且可靠地将其远端定位在第一粘合层内，并且防止当切割线下降到支撑膜时会产生的缺陷。

公开(公告)号：US20120104942A1

公开(公告)日：2012-05-03

申请号：US13347884

申请日：2012-01-11

申请人： Tetsuo Nakayama ,  Takanori Shibasaki ,  Nobuo Ozawa ,  Eisuke Matsuda ,  Takashi Hirano ,  Tadashi Ishibashi ,  Yoichi Tomo ,  Keisuke Matsuo

发明人： Tetsuo Nakayama ,  Takanori Shibasaki ,  Nobuo Ozawa ,  Eisuke Matsuda ,  Takashi Hirano ,  Tadashi Ishibashi ,  Yoichi Tomo ,  Keisuke Matsuo

IPC分类号： H01J1/62

CPC分类号： H01L27/12 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/3244 ,  H01L51/0013 ,  H01L51/5228 ,  H01L51/5234 ,  H01L51/5284 ,  H01L51/56 ,  H01L2251/5315

摘要： A display device and a method for manufacturing the display device are provided. The display device includes an organic layer on an auxiliary wiring is removed with high precision by one operation and, thereby, the yield and the productivity are improved. A lower electrode is formed by patterning in each pixel on a substrate. An auxiliary wiring including a light absorption layer is formed between individual pixels. An organic layer is formed on the substrate while covering the lower electrodes. Laser irradiation is conducted from the organic layer side, the laser light is converted to heat in the light absorption layer exposed at a portion under the organic layer, and the organic layer portion above the light absorption layer is removed selectively. An upper electrode is formed on the organic layer and is connected to the light absorption layer portion of the auxiliary wiring.

摘要翻译： 提供一种显示装置及其制造方法。 显示装置包括通过一次操作以高精度去除辅助布线上的有机层，从而提高了产量和生产率。 通过在基板上的每个像素中图案化形成下电极。 在各个像素之间形成包括光吸收层的辅助布线。 在覆盖下电极的同时，在基板上形成有机层。 从有机层侧进行激光照射，在有机层下方露出的光吸收层中将激光转换成热，并且选择性地除去光吸收层上方的有机层部。 上电极形成在有机层上，与辅助布线的光吸收层部分相连。

公开(公告)号：US20120100697A1

公开(公告)日：2012-04-26

申请号：US13382596

申请日：2010-05-31

申请人： Hiroyuki Yasuda ,  Takashi Hirano

发明人： Hiroyuki Yasuda ,  Takashi Hirano

IPC分类号： H01L21/78 ,  B32B7/02 ,  B32B3/10 ,  B32B7/12 ,  C09J7/02

CPC分类号： H01L24/29 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68359 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/30105 ,  Y10T428/24942 ,  Y10T428/24983 ,  Y10T428/2809 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A film for semiconductor includes a support film, a second adhesive layer, a first adhesive layer and a bonding layer which are laminated together in this order. This film for semiconductor is configured so that it supports a semiconductor wafer laminated on the bonding layer thereof when the semiconductor wafer is diced and the bonding layer is selectively peeled off from the first adhesive layer when the diced semiconductor wafer (semiconductor element) is picked up. This film for semiconductor is characterized in that when the semiconductor wafer is laminated thereon and diced, and then adhesive strength of the obtained semiconductor element is measured, a ratio of “a (N/cm)” which is adhesive strength of an edge portion of the semiconductor element to “b (N/cm)” which is adhesive strength of a portion of the semiconductor element other than the edge portion thereof (that is, a/b) is in the range of 1 to 4. By optimizing the a/b, it is possible to reliably suppress defects such as breakage and crack which would be generated in the semiconductor element due to local impartation of a large load thereto when being picked up.

摘要翻译： 半导体膜包括依次层叠在一起的支撑膜，第二粘合层，第一粘合层和接合层。 这种半导体膜被配置为当半导体晶片被切割时，它支撑层叠在其接合层上的半导体晶片，并且当切割的半导体晶片（半导体元件）被拾取时，从第一粘合剂层选择性地剥离接合层 。 该半导体用薄膜的特征在于，在将半导体晶片层叠并切割后，测定所得到的半导体元件的粘合强度时，作为边界部分的粘合强度的“a（N / cm）” 作为半导体元件的除了其边缘部分以外的部分的粘合强度（即a / b）的“b（N / cm）”的半导体元件在1〜4的范围内。通过优化a / b时，可以可靠地抑制当拾取时由于局部赋予其大的载荷而在半导体元件中产生的诸如断裂和裂纹的缺陷。