Semiconductor device, storage device, and electronic device

    公开(公告)号:US12200934B2

    公开(公告)日:2025-01-14

    申请号:US17640549

    申请日:2020-09-15

    Abstract: A semiconductor device with high storage capacity is provided. The semiconductor device includes first to sixth insulators, first to third conductors, and first to third material layers. The first conductor overlaps with a first insulator and a first material layer. A first region of the first material layer overlaps with a second material layer, a second conductor, a second insulator, and a third insulator. The third material layer is positioned in a region including a second region of the first material layer and top surfaces of the second material layer, the second conductor, the second insulator, and the third insulator; a fourth insulator is positioned over the third material layer; the sixth insulator is positioned over the fourth insulator; and a fifth insulator is positioned over the sixth insulator. The third conductor is positioned over the fifth insulator overlapping with the second region of the first material layer. The first to third material layers include oxide containing indium, an element M (M is aluminum, gallium, tin, or titanium), and zinc.

    Transistor and display device
    2.
    发明授权

    公开(公告)号:US12009432B2

    公开(公告)日:2024-06-11

    申请号:US17679413

    申请日:2022-02-24

    CPC classification number: H01L29/78603 G09G3/32 H01L29/78681 G09G2300/0426

    Abstract: A transistor whose characteristic degradation due to stray light is small is provided. The transistor includes a first insulator, a second insulator over the first insulator, a metal oxide over the second insulator, a first and a second conductor over the metal oxide, a third insulator over the first insulator, the second insulator, the metal oxide, the first conductor, and the second conductor, a fourth insulator over the metal oxide, a fifth insulator over the fourth insulator, and a third conductor over the fifth insulator. The third insulator has an opening to overlap with a region between the first conductor and the second conductor. The fourth insulator, the fifth insulator, and the third conductor are positioned in the opening. The metal oxide has a bandgap greater than or equal to 3.3 eV. The transistor has Vsh higher than or equal to −0.3 V.

    Semiconductor device, semiconductor wafer, and electronic device

    公开(公告)号:US11876138B2

    公开(公告)日:2024-01-16

    申请号:US17284553

    申请日:2019-10-15

    CPC classification number: H01L29/7869 H01L29/24 H01L29/78669 H01L29/78678

    Abstract: A semiconductor device capable of measuring a minute current is provided. The semiconductor device includes an operational amplifier and a diode element. An inverting input terminal of the operational amplifier and an input terminal of the diode element are electrically connected to a first terminal to which current is input, and an output terminal of the operational amplifier and an output terminal of the diode element are electrically connected to a second terminal from which voltage is output. A diode-connected transistor that includes a metal oxide in a channel formation region is used as the diode element. Since the off-state current of the transistor is extremely low, a minute current can flow between the first terminal and the second terminal. Thus, when voltage is output from the second terminal, a minute current that flows through the first terminal can be estimated from the voltage.

    Semiconductor Device, Semiconductor Wafer, and Electronic Device

    公开(公告)号:US20240154040A1

    公开(公告)日:2024-05-09

    申请号:US18411830

    申请日:2024-01-12

    CPC classification number: H01L29/7869 H01L29/24 H01L29/78669 H01L29/78678

    Abstract: A semiconductor device capable of measuring a minute current is provided. The semiconductor device includes an operational amplifier and a diode element. An inverting input terminal of the operational amplifier and an input terminal of the diode element are electrically connected to a first terminal to which current is input, and an output terminal of the operational amplifier and an output terminal of the diode element are electrically connected to a second terminal from which voltage is output. A diode-connected transistor that includes a metal oxide in a channel formation region is used as the diode element. Since the off-state current of the transistor is extremely low, a minute current can flow between the first terminal and the second terminal. Thus, when voltage is output from the second terminal, a minute current that flows through the first terminal can be estimated from the voltage.

    Semiconductor Device
    6.
    发明申请

    公开(公告)号:US20220293603A1

    公开(公告)日:2022-09-15

    申请号:US17639744

    申请日:2020-08-26

    Abstract: A semiconductor device that occupies a small area is provided. The semiconductor device includes a first transistor including a first oxide semiconductor; a second transistor including a second oxide semiconductor; a capacitor element; a first insulator; and a first conductor in contact with a source or a drain of the second transistor. The capacitor element includes a second conductor, a third conductor, and a second insulator. The first transistor, the second transistor, and the first conductor are placed to be embedded in the first insulator. The second conductor is placed in contact with a top surface of the first conductor and a top surface of a gate of the first transistor. The second insulator is placed over the second conductor and the first insulator. The third conductor is placed to cover the second conductor with the second insulator therebetween.

    Storage device, semiconductor device, and electronic device

    公开(公告)号:US11410716B2

    公开(公告)日:2022-08-09

    申请号:US16962309

    申请日:2019-01-14

    Abstract: A novel storage device and a novel semiconductor device are provided.
    In the storage device, a cell array including a plurality of memory cells is stacked above a control circuit, and the cell array operates separately in a plurality of blocks. Furthermore, a plurality of electrodes are included between the control circuit and the cell array. The electrode is provided for a corresponding block to overlap with the block, and a potential of the electrode can be changed for each block. The electrode has a function of aback gate of a transistor included in the memory cell, and a potential of the electrode is changed for each block, whereby the electrical characteristics of the transistor included in the memory cell can be changed. Moreover, the electrode can reduce noise caused in the control circuit.

    Semiconductor device and electronic device

    公开(公告)号:US11335812B2

    公开(公告)日:2022-05-17

    申请号:US17011385

    申请日:2020-09-03

    Abstract: A novel semiconductor device is provided. A component extending in a first direction, and a first conductor and a second conductor extending in a second direction are provided. The component includes a third conductor, a first insulator, a first semiconductor, and a second insulator. In a first intersection portion of the component and the first conductor, the first insulator, the first semiconductor, the second insulator, a second semiconductor, and a third insulator are provided concentrically. In a second intersection portion of the component and the second conductor, the first insulator, the first semiconductor, the second insulator, a fourth conductor, and a fourth insulator are provided concentrically around the third conductor.

    Mixer and semiconductor device
    9.
    发明授权

    公开(公告)号:US12261570B2

    公开(公告)日:2025-03-25

    申请号:US17606825

    申请日:2020-05-20

    Abstract: To provide a mixer and a semiconductor device which each have a small circuit area and each of which operation capability is inhibited from being decreased due to heat. The mixer includes a differential portion, a current source, a first load, an input terminal, and a first output terminal; the differential portion includes a first and a second transistor; and each of the first and the second transistors includes a metal oxide in a channel formation region. A first terminal of each of the first and the second transistors is electrically connected to the input terminal and a current source and a second terminal of the first transistor is electrically connected to a first terminal of the first load and the first output terminal. The first load has a function of supplying a current between the first terminal and a second terminal of the first load by application of voltage to the second terminal of the first load, and the current source has a function of supplying a constant current to the current source from the first terminal of each of the first and the second transistors. The current source includes a transistor including silicon in a channel formation region, and the differential portion is positioned above the current source.

    Memory device, operation method of memory device, data processing device, data processing system, and electronic device

    公开(公告)号:US12237019B2

    公开(公告)日:2025-02-25

    申请号:US17772740

    申请日:2020-10-16

    Abstract: A low-power memory device in which a NAND flash memory and a controller are connected to each other with a short wiring, the controller and a cache memory are connected to each other with a short wiring, and signal transmission delay is small is provided. For example, the NAND flash memory is formed using a Si transistor formed with a single crystal silicon substrate. Since an OS transistor can be formed by a method such as a thin-film method, the cache memory formed using the OS memory can be stacked over the NAND flash memory. When the NAND flash memory and the cache memory are formed in one chip, the NAND flash memory and the controller can be connected to each other with a short wiring, and the controller and the cache memory can be connected to each other with a short wiring.

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