SEMICONDUCTOR DEVICE
    1.
    发明申请

    公开(公告)号:US20230055062A1

    公开(公告)日:2023-02-23

    申请号:US17796903

    申请日:2021-02-08

    摘要: A semiconductor device with a novel structure is provided. A plurality of memory circuits, a switching circuit, and an arithmetic circuit are included. Each of the plurality of memory circuits has a function of retaining weight data and a function of outputting the weight data to a first wiring. The switching circuit has a function of switching a conduction state between any one of the plurality of first wirings and a second wiring. The arithmetic circuit has a function of performing arithmetic processing using input data and the weight data supplied to the second wiring. The memory circuits are provided in a first layer. The switching circuit and the arithmetic circuit are provided in a second layer. The first layer is provided in a layer different from the second layer.

    Semiconductor Device, Semiconductor Wafer, and Electronic Device

    公开(公告)号:US20210384355A1

    公开(公告)日:2021-12-09

    申请号:US17284553

    申请日:2019-10-15

    IPC分类号: H01L29/786 H01L29/24

    摘要: A semiconductor device capable of measuring a minute current is provided. The semiconductor device includes an operational amplifier and a diode element. An inverting input terminal of the operational amplifier and an input terminal of the diode element are electrically connected to a first terminal to which current is input, and an output terminal of the operational amplifier and an output terminal of the diode element are electrically connected to a second terminal from which voltage is output. A diode-connected transistor that includes a metal oxide in a channel formation region is used as the diode element. Since the off-state current of the transistor is extremely low, a minute current can flow between the first terminal and the second terminal. Thus, when voltage is output from the second terminal, a minute current that flows through the first terminal can be estimated from the voltage.

    MEMORY DEVICE AND ELECTRONIC DEVICE

    公开(公告)号:US20210183860A1

    公开(公告)日:2021-06-17

    申请号:US17047143

    申请日:2019-04-11

    摘要: A novel semiconductor device is provided. A semiconductor device includes a plurality of cell arrays and a plurality of peripheral circuits. The cell array includes a plurality of memory cells. The peripheral circuit includes a first driver circuit, a second driver circuit, a first amplifier circuit, a second amplifier circuit, a third amplifier circuit, and a fourth amplifier circuit. The first driver circuit and the second driver circuit each have a function of supplying a selection signal to the cell array. The first amplifier circuit and the second amplifier circuit each have a function of amplifying a potential input from the cell array. The third amplifier circuit and the fourth amplifier circuit each have a function of amplifying a potential input from the first amplifier circuit or the second amplifier circuit. The first driver circuit, the second driver circuit, the first amplifier circuit, the second amplifier circuit, the third amplifier circuit, and the fourth amplifier circuit have a region overlapping with the cell array. A transistor included in the memory cell includes a metal oxide in a channel formation region.

    DATA PROCESSING SYSTEM AND OPERATION METHOD OF DATA PROCESSING SYSTEM

    公开(公告)号:US20210124578A1

    公开(公告)日:2021-04-29

    申请号:US17074872

    申请日:2020-10-20

    摘要: To provide a data processing system that includes a nonvolatile memory device capable of storing multilevel data and enables increasing storage capacity of a main memory device when the data processing system is activated. The data processing system includes an arithmetic processing device, a main memory device, and a nonvolatile memory device. The main memory device includes a volatile memory device, and the nonvolatile memory device is configured to store multilevel data in one memory cell. When the data processing system is deactivated, the nonvolatile memory device stores binary data, whereby the stored data can be held for a long time. Upon activation, the nonvolatile memory device stores multilevel data, whereby increasing storage capacity. When the storage capacity is increased, a free space is generated in the nonvolatile memory device, which can be used as a part of the main memory device of the data processing system.

    STORAGE DEVICE, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

    公开(公告)号:US20210081023A1

    公开(公告)日:2021-03-18

    申请号:US17104460

    申请日:2020-11-25

    摘要: To reduce the area of a memory cell having a backup function. A storage device includes a cell array, and a row circuit and a column circuit that drive the cell array. The cell array includes a first power supply line, a second power supply line, a word line, a pair of bit lines, a memory cell, and a backup circuit. The cell array is located in a power domain where power gating can be performed. In the power gating sequence of the cell array, data in the memory cell is backed up to the backup circuit. The backup circuit is stacked over a region where the memory cell is formed. A plurality of wiring layers are provided between the backup circuit and the memory cell. The first power supply line, the second power supply line, the word line, and the pair of bit lines are located in different wiring layers.

    SEMICONDUCTOR DEVICE
    8.
    发明申请

    公开(公告)号:US20200373302A1

    公开(公告)日:2020-11-26

    申请号:US16767645

    申请日:2018-11-30

    摘要: A novel semiconductor device is provided. A back gate voltage of a transistor including a gate and a back gate is adjusted based on the operating temperature. The operating temperature is acquired by a temperature detector circuit. The temperature detection circuit outputs the temperature information as a digital signal. The digital signal is input to a voltage control circuit. The voltage control circuit outputs a first voltage corresponding to the digital signal. The back gate voltage is determined by a voltage in which a first voltage is added to a reference voltage.

    Semiconductor Device
    9.
    发明申请

    公开(公告)号:US20200279589A1

    公开(公告)日:2020-09-03

    申请号:US16643755

    申请日:2018-09-03

    IPC分类号: G11C7/06 G11C14/00

    摘要: To provide a novel semiconductor device.The semiconductor device includes cell arrays and peripheral circuits; the cell arrays include memory cells; the peripheral circuits includes a first driver circuit, a second driver circuit, a first amplifier circuit, a second amplifier circuit, a third amplifier circuit, and a fourth amplifier circuit; the first driver circuit and the second driver circuit have a function of supplying a selection signal to the cell array; the first amplifier circuit and the second amplifier circuit have a function of amplifying a potential input from the cell array; the third amplifier circuit and the fourth amplifier circuit have a function of amplifying a potential input from the first amplifier circuit or the second amplifier circuit; the first driver circuit, the second driver circuit, the first amplifier circuit, the second amplifier circuit, the third amplifier circuit, and the fourth amplifier circuit include a region overlapping with the cell array; and the memory cells include a metal oxide in a channel formation region.

    STORAGE DEVICE, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

    公开(公告)号:US20190377401A1

    公开(公告)日:2019-12-12

    申请号:US16476642

    申请日:2018-01-09

    摘要: To reduce the area of a memory cell having a backup function. A storage device includes a cell array, and a row circuit and a column circuit that drive the cell array. The cell array includes a first power supply line, a second power supply line, a word line, a pair of bit lines, a memory cell, and a backup circuit. The cell array is located in a power domain where power gating can be performed. In the power gating sequence of the cell array, data in the memory cell is backed up to the backup circuit. The backup circuit is stacked over a region where the memory cell is formed. A plurality of wiring layers are provided between the backup circuit and the memory cell. The first power supply line, the second power supply line, the word line, and the pair of bit lines are located in different wiring layers.