Abstract:
A retention circuit provided in a logic circuit enables power gating. The retention circuit includes a first terminal, a node, a capacitor, and first to third transistors. The first transistor controls electrical connection between the first terminal and an input terminal of the logic circuit. The second transistor controls electrical connection between an output terminal of the logic circuit and the node. The third transistor controls electrical connection between the node and the input terminal of the logic circuit. A gate of the first transistor is electrically connected to a gate of the second transistor. In a data retention period, the node becomes electrically floating. The voltage of the node is held by the capacitor.
Abstract:
Provided is a semiconductor device having a memory cell array, which is capable of existing in three power-gating states depending on a non-access period to the memory cell array. The memory cell array includes a plurality of memory cells which each have an SRAM and a nonvolatile memory portion having a transistor with an oxide semiconductor in a channel region. The three power-gating states includes: a first state in which a power-gating to the memory cell array is performed; a second state in which the power-gating is performed on the memory cell array and peripheral circuits which control the memory cell array; and a third state in which, in addition to the memory cell array and the peripheral circuits, a power supply voltage supplying circuit is subjected to the power gating.
Abstract:
The power consumption of a semiconductor device that can function as a latch circuit or the like is reduced. The semiconductor device includes a first circuit and a switch that controls conduction between an input terminal and the first circuit. The first circuit includes n second circuits (n is an integer of 2 or more) and a variable resistor. An output node of any of the n second circuits is electrically connected to an input node of the second circuit in a first stage through the variable resistor. The variable resistor can be, for example, a transistor whose channel is formed in an oxide semiconductor layer. A reduction in the number of elements or signals leads to a reduction of the power consumption of the semiconductor device.
Abstract:
A memory device includes a first memory circuit including a silicon transistor, a selection circuit including a silicon transistor, and a second memory circuit including oxide semiconductor transistors and a storage capacitor, in which one terminal of the storage capacitor is connected to a portion where two oxide semiconductor transistors are connected in series, an output of the second memory circuit is connected to a second input terminal of the selection circuit, and an input of the second memory circuit is connected to a first input terminal of the selection circuit or an output terminal of the first memory circuit.
Abstract:
The storage circuit includes first and second logic circuits, first and second transistors whose channel formation regions include an oxide semiconductor, and a capacitor. The first and second transistors are connected to each other in series, and the capacitor is connected to a connection node of the first and second transistors. The first transistor functions as a switch that controls connection between an output terminal of the first logic circuit and the capacitor. The second transistor functions as a switch that controls connection between the capacitor and an input terminal of the second logic circuit. Clock signals whose phases are inverted from each other are input to gates of the first and second transistors. Since the storage circuit has a small number of transistors and a small number of transistors controlled by the clock signals, the storage circuit is a low-power circuit.
Abstract:
A retention circuit provided in a logic circuit enables power gating. The retention circuit includes a first terminal, a node, a capacitor, and first to third transistors. The first transistor controls electrical connection between the first terminal and an input terminal of the logic circuit. The second transistor controls electrical connection between an output terminal of the logic circuit and the node. The third transistor controls electrical connection between the node and the input terminal of the logic circuit. A gate of the first transistor is electrically connected to a gate of the second transistor. In a data retention period, the node becomes electrically floating. The voltage of the node is held by the capacitor.
Abstract:
Provided is a semiconductor device having a memory cell array, which is capable of existing in three power-gating states depending on a non-access period to the memory cell array. The memory cell array includes a plurality of memory cells which each have an SRAM and a nonvolatile memory portion having a transistor with an oxide semiconductor in a channel region. The three power-gating states includes: a first state in which a power-gating to the memory cell array is performed; a second state in which the power-gating is performed on the memory cell array and peripheral circuits which control the memory cell array; and a third state in which, in addition to the memory cell array and the peripheral circuits, a power supply voltage supplying circuit is subjected to the power gating.
Abstract:
A retention circuit provided in a logic circuit enables power gating. The retention circuit includes a first terminal, a node, a capacitor, and first to third transistors. The first transistor controls electrical connection between the first terminal and an input terminal of the logic circuit. The second transistor controls electrical connection between an output terminal of the logic circuit and the node. The third transistor controls electrical connection between the node and the input terminal of the logic circuit. A gate of the first transistor is electrically connected to a gate of the second transistor. In a data retention period, the node becomes electrically floating. The voltage of the node is held by the capacitor.
Abstract:
To provide a semiconductor device which can perform a scan test and includes a logic circuit capable of reducing signal delay. The semiconductor device includes a combinational circuit, sequential circuits each holding first data supplied to the combinational circuit or second data output from the combinational circuit, first memory circuits each holding first data supplied to the corresponding sequential circuit and holding second data output from the corresponding sequential circuit, and second memory circuits electrically connecting the first memory circuits in series by supplying the first data or second data supplied from one of the first memory circuits to another one of the first memory circuits. The second memory circuit includes a first switch controlling supply of the first data or second data to the node, a capacitor electrically connected to the node, and a second switch controlling output of the first data or second data from the node.
Abstract:
A semiconductor device including a memory which can perform a pipeline operation is provided. The semiconductor device includes a processor core, a bus, and a memory section. The memory section includes a first memory. The first memory includes a plurality of local arrays. The local array includes a sense amplifier array and a local cell array stacked thereover. The local cell array is provided a memory cell including one transistor and one capacitor. The transistor is preferably an oxide semiconductor transistor. The first memory is configured to generate a wait signal. The wait signal is generated when a request for writing data to the same local array is received over two successive clock cycles from the processor core. The wait signal is sent to the processor core via the bus. The processor core stands by for a request for the memory section on the basis of the wait signal.