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    High power light emitting diode package and fabrication method thereof
    1.
    发明授权
    High power light emitting diode package and fabrication method thereof 失效
    大功率发光二极管封装及其制造方法

    公开(公告)号：US07663199B2

    公开(公告)日：2010-02-16

    申请号：US11442414

    申请日：2006-05-30

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Young Jae Song ,  Young Sam Park ,  Chang Ho Song

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Young Jae Song ,  Young Sam Park ,  Chang Ho Song

    IPC分类号： H01L29/78

    CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.

    摘要翻译： 本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部 导热部件和引线部分。 导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。 本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

    HIGH POWER LED PACKAGE AND FABRICATION METHOD THEREOF
    2.
    发明申请
    HIGH POWER LED PACKAGE AND FABRICATION METHOD THEREOF 有权
    大功率LED封装及其制造方法

    公开(公告)号：US20100047941A1

    公开(公告)日：2010-02-25

    申请号：US12612268

    申请日：2009-11-04

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yoen Han ,  Dae Yeon Kim ,  Young Sam Park

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yoen Han ,  Dae Yeon Kim ,  Young Sam Park

    IPC分类号： H01L21/50

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

    摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

    High power LED package and fabrication method thereof
    3.
    发明授权
    High power LED package and fabrication method thereof 有权
    大功率LED封装及其制造方法

    公开(公告)号：US07875476B2

    公开(公告)日：2011-01-25

    申请号：US12612268

    申请日：2009-11-04

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

    摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

    High power LED package and fabrication method thereof
    4.
    发明授权
    High power LED package and fabrication method thereof 有权
    大功率LED封装及其制造方法

    公开(公告)号：US07626250B2

    公开(公告)日：2009-12-01

    申请号：US11445227

    申请日：2006-06-02

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

    IPC分类号： H01L23/495

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

    摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

    LED package
    9.
    发明授权
    LED package 有权
    LED封装

    公开(公告)号：US08105854B2

    公开(公告)日：2012-01-31

    申请号：US12612334

    申请日：2009-11-04

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/62 ,  F21K9/00 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/021 ,  H05K3/244 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

    摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

    摘要翻译： 通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。 封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。 本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。 这又提高了光源的发光效率，最终实现了高质量的光源。

    LED package
    10.
    发明授权
    LED package 有权
    LED封装

    公开(公告)号：US07683470B2

    公开(公告)日：2010-03-23

    申请号：US11709154

    申请日：2007-02-22

    申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Dae Yeon Kim

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/62 ,  F21K9/00 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/021 ,  H05K3/244 ,  H05K2201/09827 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

    摘要： A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality light source at low costs, and a manufacturing method thereof. The COB package includes a board-like substrate with a circuit printed on a surface thereof, the substrate having a through hole. The package also includes a light source positioned in the through hole and including a submount and a dome structure made of resin, covering and fixing the light source to the substrate. The invention allows a good heat radiation effect by using the general PCB as the substrate, enabling manufacture of a high quality COB package at low costs. This in turn improves emission efficiency of the light source, ultimately realizing a high quality light source.

    摘要翻译： 通过使用通用PCB作为基板可以降低制造成本的芯片上（COB）封装，增加了来自光源的散热效果，从而以低成本实现高质量的光源及其制造方法。 COB封装包括具有印刷在其表面上的电路的板状衬底，该衬底具有通孔。 封装还包括位于通孔中的光源，并且包括底座和由树脂制成的圆顶结构，将光源覆盖并固定到基板。 本发明通过使用通用PCB作为基板来实现良好的散热效果，能够以低成本制造高质量的COB封装。 这又提高了光源的发光效率，最终实现了高质量的光源。