Thin-film semiconductor integrated circuit device and picture display device with using thereof and manufacturing method thereof
    1.
    发明授权
    Thin-film semiconductor integrated circuit device and picture display device with using thereof and manufacturing method thereof 有权
    薄膜半导体集成电路器件及其使用的图像显示器件及其制造方法

    公开(公告)号:US06727514B2

    公开(公告)日:2004-04-27

    申请号:US09811561

    申请日:2001-03-20

    IPC分类号: H01L2906

    摘要: At least one of a semiconductor thin-film for forming a picture display portion and a semiconductor thin-film for forming a peripheral circuit portion, which are accumulated on one common insulative substrate, is constructed with a semiconductor thin-film having a plural number of semiconductor crystalline portions formed to be divided and disposed in a matrix-like, and TFTs are provided in the semiconductor thin-film by bringing those semiconductor single crystal portions into active portions thereof. For that purpose, a crystallization accelerating material is adhered at the position of lattice points of a matrix and is treated with heating process, for forming the single crystal portions disposed in the matrix-like manner, so as to form the TFTs on the surface thereof, thereby completing the thin-film semiconductor integrated circuit device.

    摘要翻译: 用于形成图像显示部分的半导体薄膜和积聚在一个公共绝缘基板上的用于形成外围电路部分的半导体薄膜中的至少一个由半导体薄膜构成,半导体薄膜具有多个 通过将这些半导体单晶部分置于其有效部分,半导体晶体部分被形成为分成矩阵状并且设置在半导体薄膜中。 为此,将结晶促进材料粘附在基体的晶格点的位置,并通过加热处理进行处理,以形成以矩阵状排列的单晶部分,从而在其表面上形成TFT 从而完成薄膜半导体集成电路器件。

    Semiconductor device and semiconductor substrate
    4.
    发明申请
    Semiconductor device and semiconductor substrate 失效
    半导体器件和半导体衬底

    公开(公告)号:US20080206961A1

    公开(公告)日:2008-08-28

    申请号:US12010123

    申请日:2008-01-22

    IPC分类号: H01L21/20

    摘要: In order to provide a semiconductor device having a field effect transistor with a low power consumption and a high speed by use of the combination of Si and an element such as Ge, C or the like of the same group as Si, a strain is applied by a strain applying semiconductor layer 2 to a channel forming layer I having a channel of the field effect transistor formed therein so that the mobility of carriers in the channel is made larger than the mobility of carriers in that material of the channel forming layer which is unstrained.

    摘要翻译: 为了提供一种具有低功耗和高速的场效晶体管的半导体器件,其通过使用Si和诸如与Si相同的组的诸如Ge,C等元素的组合,施加应变 通过将半导体层2施加到其中形成有场效应晶体管的沟道的沟道形成层I的应变,使得沟道中的载流子的迁移率大于沟道形成层的材料中的载流子的迁移率, 无限制

    Semiconductor device and semiconductor substrate
    6.
    发明授权
    Semiconductor device and semiconductor substrate 失效
    半导体器件和半导体衬底

    公开(公告)号:US07579229B2

    公开(公告)日:2009-08-25

    申请号:US12010123

    申请日:2008-01-22

    IPC分类号: H01L21/762

    摘要: In order to provide a semiconductor device having a field effect transistor with a low power consumption and a high speed by use of the combination of Si and an element such as Ge, C or the like of the same group as Si, a strain is applied by a strain applying semiconductor layer 2 to a channel forming layer I having a channel of the field effect transistor formed therein so that the mobility of carriers in the channel is made larger than the mobility of carriers in that material of the channel forming layer which is unstrained.

    摘要翻译: 为了提供一种具有低功耗和高速的场效晶体管的半导体器件,其通过使用Si和诸如与Si相同的组的诸如Ge,C等元素的组合,施加应变 通过将半导体层2施加到其中形成有场效应晶体管的沟道的沟道形成层I的应变,使得沟道中的载流子的迁移率大于沟道形成层的材料中的载流子的迁移率, 无限制