公开(公告)号：US20180096964A1

公开(公告)日：2018-04-05

申请号：US15718636

申请日：2017-09-28

申请人： X-Celeprint Limited

发明人： Salvatore Bonafede ,  Matthew Meitl ,  Ronald S. Cok

IPC分类号： H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L24/83 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/32 ,  H01L24/81 ,  H01L24/97 ,  H01L33/0079 ,  H01L33/62 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/16225 ,  H01L2224/16507 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32503 ,  H01L2224/81002 ,  H01L2224/81097 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/8182 ,  H01L2224/81907 ,  H01L2224/83002 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/8321 ,  H01L2224/83409 ,  H01L2224/83411 ,  H01L2224/83413 ,  H01L2224/83416 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83469 ,  H01L2224/838 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/83815 ,  H01L2224/8382 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method of making a micro-transfer printed structure includes providing a destination substrate and a source substrate having one or more micro-transfer printable components. A layer of volatile adhesive is formed over the destination substrate and one or more components are micro-transfer printed from the source substrate onto the volatile adhesive layer at a non-evaporable temperature of the volatile adhesive layer. The volatile adhesive layer is then heated to an evaporation temperature to evaporate at least a portion of the volatile adhesive after micro-transfer printing. In certain embodiments, a micro-transfer printed structure includes a destination substrate having one or more metal contacts and one or more micro-transfer printable components having one or more component contacts disposed on the destination substrate with the metal contact aligned with the component contact. The metal contact can form an intermetallic bond with the component contact.

公开(公告)号：US20130146341A1

公开(公告)日：2013-06-13

申请号：US13323843

申请日：2011-12-13

申请人： DA-JUNG CHEN ,  WEN-HSIUNG LIAO ,  CHUN-FU HU

发明人： DA-JUNG CHEN ,  WEN-HSIUNG LIAO ,  CHUN-FU HU

IPC分类号： H05K1/09 ,  H05K3/10

CPC分类号： H01L24/32 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16245 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/2902 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/30181 ,  H01L2224/32225 ,  H01L2224/32505 ,  H01L2224/32507 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83411 ,  H01L2224/83416 ,  H01L2224/83418 ,  H01L2224/83439 ,  H01L2224/83815 ,  H01L2224/8392 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2224/05552

摘要： The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.

摘要翻译： 本发明公开了一种具有覆盖焊料材料的覆盖金属材料的封装结构。 衬底包括第一焊盘和其上的第二焊垫。 衬底上的导电元件包括​​第一电极和第二电极。 焊料材料将第一焊盘和第二焊盘分别电连接到第一电极和第二电极。 覆盖金属材料覆盖焊料金属材料，第一焊盘，第二焊盘，第一电极和第二电极的暴露区域，其中暴露区域包括具有比第二金属材料低的熔点的金属材料。

公开(公告)号：US09171818B2

公开(公告)日：2015-10-27

申请号：US13323843

申请日：2011-12-13

申请人： Da-Jung Chen ,  Wen-Hsiung Liao ,  Chun-Fu Hu

发明人： Da-Jung Chen ,  Wen-Hsiung Liao ,  Chun-Fu Hu

IPC分类号： H05K1/16 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

CPC分类号： H01L24/32 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16245 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/2902 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/30181 ,  H01L2224/32225 ,  H01L2224/32505 ,  H01L2224/32507 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83411 ,  H01L2224/83416 ,  H01L2224/83418 ,  H01L2224/83439 ,  H01L2224/83815 ,  H01L2224/8392 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  Y10T29/49155 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2224/05552

摘要： The invention discloses a package structure with an overlaying metallic material overlaying a solder material. A substrate comprises a first solder pad and a second solder pad thereon. A conductive element on the substrate comprises a first electrode and a second electrode thereon. A solder material electrically connects the first solder pad and the second solder pad to the first electrode and the second electrode respectively. An overlaying metallic material overlays the exposed areas of the solder metallic material, the first solder pad, the second solder pad, the first electrode and the second electrode, wherein the exposed areas comprise metallic material having a lower melting point than the second metallic material.

摘要翻译： 本发明公开了一种具有覆盖焊料材料的覆盖金属材料的封装结构。 衬底包括第一焊盘和其上的第二焊垫。 衬底上的导电元件包括​​第一电极和第二电极。 焊料材料将第一焊盘和第二焊盘分别电连接到第一电极和第二电极。 覆盖金属材料覆盖焊料金属材料，第一焊盘，第二焊盘，第一电极和第二电极的暴露区域，其中暴露区域包括具有比第二金属材料低的熔点的金属材料。

公开(公告)号：US20150214179A1

公开(公告)日：2015-07-30

申请号：US14165645

申请日：2014-01-28

申请人： Infineon Technologies AG

发明人： Tian San Tan ,  Theng Chao Long

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/70 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/564 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/64 ,  H01L24/83 ,  H01L24/89 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29147 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32503 ,  H01L2224/33181 ,  H01L2224/83411 ,  H01L2224/83413 ,  H01L2224/83416 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15165 ,  H01L2924/15701 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01014 ,  H01L2924/01032 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/01051

摘要： A semiconductor device includes a semiconductor chip including a transistor. A first flexible lead is electrically coupled to a first electrode on a first surface of the semiconductor chip. A second flexible lead is electrically coupled to a second electrode on the first surface of the semiconductor chip. A third flexible lead is electrically coupled to a third electrode on a second surface of the semiconductor chip, the second surface opposite to the first surface.

摘要翻译： 半导体器件包括具有晶体管的半导体芯片。 第一柔性引线电耦合到半导体芯片的第一表面上的第一电极。 第二柔性引线电耦合到半导体芯片的第一表面上的第二电极。 第三柔性引线电连接到半导体芯片的第二表面上的第三电极，第二表面与第一表面相对。

公开(公告)号：US20110115069A1

公开(公告)日：2011-05-19

申请号：US12696897

申请日：2010-01-29

申请人： Serene Seoh Hian Teh ,  Won Yun Sung ,  Atapol Prajuckamol

发明人： Serene Seoh Hian Teh ,  Won Yun Sung ,  Atapol Prajuckamol

IPC分类号： H01L23/52 ,  H01L21/50 ,  H01L21/78

CPC分类号： H01L24/49 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83411 ,  H01L2224/83416 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

摘要： An electronic device can include a packaging substrate that including an organic material and a hole extending into the packaging substrate. An electrically conductive member can include a via within the hole, and a lead lying along a major surface of the packaging substrate and electrically connected to the via. In an embodiment, the electrically conductive material can be plated, printed, or otherwise formed within and over the organic material, and a leadframe and a corresponding formation of a molding compound around the leadframe are not necessary.

摘要翻译： 电子设备可以包括包括有机材料和延伸到包装衬底中的孔的包装衬底。 导电构件可以包括在孔内的通孔，以及沿着封装衬底的主表面并且电连接到通孔的引线。 在一个实施例中，导电材料可以在有机材料内部和外部进行电镀，印刷或以其它方式形成，并且引线框架和引线框架周围的模制化合物的相应形成是不必要的。