LIGHT EFFICIENT LED ASSEMBLY INCLUDING A SHAPED REFLECTIVE CAVITY AND METHOD FOR MAKING SAME
    2.
    发明申请
    LIGHT EFFICIENT LED ASSEMBLY INCLUDING A SHAPED REFLECTIVE CAVITY AND METHOD FOR MAKING SAME 有权
    有效的LED组件包括形成的反射腔及其制造方法

    公开(公告)号:US20080062701A1

    公开(公告)日:2008-03-13

    申请号:US11847033

    申请日:2007-08-29

    IPC分类号: F21V7/00 H01J9/00

    摘要: A method for making an efficient light emitting diode (LED) assembly by providing a thermally conductive base having a surface cavity, disposing a reflective paste in the surface cavity, and shaping the reflective paste to form a reflective cavity. The reflective cavity is shaped such that there is a mounting region and at least one reflective side wall at least partially surrounding the mounting region. Once shaped, the reflective paste is fired to set the reflective cavity in its shaped form. Next, one or more LED die may be mounted on the mounting region of the reflective cavity such that the emitted light is reflected by the side walls, thus increasing the light output of the LED assembly.

    摘要翻译: 一种制造高效发光二极管(LED)组件的方法,该方法通过提供具有表面空腔的导热底座,将反射浆料设置在表面空腔中,以及使反射浆料成形以形成反射腔。 反射腔被成形为使得存在至少部分地围绕安装区域的安装区域和至少一个反射侧壁。 一旦成型,反光膏被烧制,以将反射腔设置成其成形形式。 接下来,一个或多个LED管芯可以安装在反射腔的安装区域上,使得发射的光被侧壁反射,从而增加LED组件的光输出。

    Light efficient LED assembly including a shaped reflective cavity and method for making same
    3.
    发明授权
    Light efficient LED assembly including a shaped reflective cavity and method for making same 有权
    具有成形反射腔的光效LED组件及其制造方法

    公开(公告)号:US07719021B2

    公开(公告)日:2010-05-18

    申请号:US11847033

    申请日:2007-08-29

    IPC分类号: H01L33/00 H01L21/00 H01L33/48

    摘要: A method for making an efficient light emitting diode (LED) assembly by providing a thermally conductive base having a surface cavity, disposing a reflective paste in the surface cavity, and shaping the reflective paste to form a reflective cavity. The reflective cavity is shaped such that there is a mounting region and at least one reflective side wall at least partially surrounding the mounting region. Once shaped, the reflective paste is fired to set the reflective cavity in its shaped form. Next, one or more LED die may be mounted on the mounting region of the reflective cavity such that the emitted light is reflected by the side walls, thus increasing the light output of the LED assembly.

    摘要翻译: 一种制造高效发光二极管(LED)组件的方法,该方法通过提供具有表面空腔的导热底座,将反射浆料设置在表面空腔中,以及使反射浆料成形以形成反射腔。 反射腔被成形为使得存在至少部分地围绕安装区域的安装区域和至少一个反射侧壁。 一旦成型,反光膏被烧制,以将反射腔设置成其成形形式。 接下来,一个或多个LED管芯可以安装在反射腔的安装区域上,使得发射的光被侧壁反射,从而增加LED组件的光输出。

    Light emitting diodes with improved light collimation
    5.
    发明授权
    Light emitting diodes with improved light collimation 有权
    具有改进的光准直的发光二极管

    公开(公告)号:US07777235B2

    公开(公告)日:2010-08-17

    申请号:US11409847

    申请日:2006-04-24

    IPC分类号: H01L33/00

    摘要: A light emitting diode with improved light collimation comprises a substrate-supported LED die disposed within a transparent dome. A portion of the dome laterally circumscribe the die comprises light reflecting material to reflect emitted light back to the die. A portion of the dome centrally overlying the die is substantially free of light reflecting material to permit exit of light within a desired radiation pattern. The LED die may be packaged for high temperature operation by disposing them on a ceramic-coated metal base which can be coupled to a heat sink. The packaged LED can be made by the low temperature co-fired ceramic-on-metal technique (LTCC-M).

    摘要翻译: 具有改进的光准直的发光二极管包括设置在透明圆顶内的基板支撑的LED管芯。 横向包围模具的圆顶的一部分包括光反射材料,以将发射的光反射回模具。 中心地覆盖模具的圆顶的一部分基本上没有光反射材料,以允许在期望的辐射图案内的光出射。 LED芯片可以通过将其放置在可耦合到散热器的陶瓷涂覆的金属基底上来进行高温操作。 封装的LED可以通过低温共烧陶瓷金属技术(LTCC-M)制成。

    Interconvertible soft articles
    7.
    发明申请
    Interconvertible soft articles 审中-公开
    可互换软件

    公开(公告)号:US20050136794A1

    公开(公告)日:2005-06-23

    申请号:US10987779

    申请日:2004-11-12

    申请人: Greg Blonder

    发明人: Greg Blonder

    IPC分类号: A63H33/00

    CPC分类号: A63H33/00

    摘要: Robust, soft, interconvertible articles constructed from soft, resilient members, which articles adopt a substantially different geometry upon an interior to exterior interconversion. The articles of the invention provide a significant visual effect and are useful as educational aids, magician's props, and toys.

    摘要翻译: 坚固,柔软,相互转换的物品,由柔软的弹性构件构成,这些物品在内部至外部相互转换之间采用基本不同的几何形状。 本发明的物品提供显着的视觉效果,并且作为教具,魔术师道具和玩具是有用的。

    Light emitting diodes packaged for high temperature operation
    8.
    发明授权
    Light emitting diodes packaged for high temperature operation 有权
    封装用于高温运行的发光二极管

    公开(公告)号:US07095053B2

    公开(公告)日:2006-08-22

    申请号:US10638579

    申请日:2003-08-11

    IPC分类号: H01L27/15 H01L31/12 H01L33/00

    摘要: In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.

    摘要翻译: 根据本发明,用于高温操作的LED封装包括金属基底,其包括下面的热连接焊盘和一对电连接焊盘,上覆陶瓷层和安装在金属基底上的LED管芯。 LED通过金属基座热耦合到热连接焊盘,并且电极电连接到下面的电连接焊盘。 低热电绝缘层可以允许热通道使模具的其它区域与基座电绝缘。 可以通过热连接器垫的热通孔来增强热流。 形成在基座上方的陶瓷层可以增加电路并协助分配发射的光。 新型封装可在高达250°C的温度下工作