公开(公告)号：US09892944B2

公开(公告)日：2018-02-13

申请号：US15190813

申请日：2016-06-23

申请人： Sharp Laboratories of America, Inc.

发明人： Paul John Schuele ,  David Robert Heine ,  Mark Albert Crowder ,  Sean Mathew Garner ,  Changqing Zhan ,  Avinash Tukaram Shinde ,  Kenji Alexander Sasaki ,  Kurt Michael Ulmer

IPC分类号： H01L29/06 ,  H01L21/67 ,  H01L33/20 ,  H01L21/673

CPC分类号： H01L21/67121 ,  H01L21/67333 ,  H01L29/0657 ,  H01L33/20 ,  H01L2224/95085

摘要： Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

公开(公告)号：US09755110B1

公开(公告)日：2017-09-05

申请号：US15221571

申请日：2016-07-27

申请人： Sharp Laboratories of America, Inc.

发明人： Mark Albert Crowder ,  Paul J. Schuele ,  Changqing Zhan ,  Kenji Alexander Sasaki ,  Kurt Michael Ulmer

IPC分类号： H01L33/24 ,  H01L27/15 ,  H01L33/62

CPC分类号： H01L33/24 ,  H01L27/156 ,  H01L33/62 ,  H01L2224/95 ,  H01L2933/0066

摘要： Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

公开(公告)号：US10032957B2

公开(公告)日：2018-07-24

申请号：US15682260

申请日：2017-08-21

申请人： Sharp Laboratories of America, Inc.

发明人： Mark Albert Crowder ,  Paul J. Schuele ,  Changqing Zhan ,  Kenji Alexander Sasaki ,  Kurt Michael Ulmer

IPC分类号： H01L33/62 ,  H01L33/24 ,  H01L27/15

摘要： Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

公开(公告)号：US10347513B2

公开(公告)日：2019-07-09

申请号：US15859673

申请日：2018-01-01

申请人： Sharp Laboratories of America, Inc.

发明人： Paul John Schuele ,  David Robert Heine ,  Mark Albert Crowder ,  Sean Mathew Garner ,  Changqing Zhan ,  Avinash Tukaram Shinde ,  Kenji Alexander Sasaki ,  Kurt Michael Ulmer

IPC分类号： H01L21/67 ,  H01L29/06 ,  H01L21/673 ,  H01L23/00 ,  H01L33/00 ,  H01L25/075

摘要： Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

公开(公告)号：US20180144957A1

公开(公告)日：2018-05-24

申请号：US15859673

申请日：2018-01-01

申请人： Sharp Laboratories of America, Inc.

发明人： Paul John Schuele ,  David Robert Heine ,  Mark Albert Crowder ,  Sean Mathew Garner ,  Changqing Zhan ,  Avinash Tukaram Shinde ,  Kenji Alexander Sasaki ,  Kurt Michael Ulmer

IPC分类号： H01L21/67 ,  H01L33/20 ,  H01L29/06 ,  H01L21/673

CPC分类号： H01L21/67121 ,  H01L21/67333 ,  H01L24/95 ,  H01L25/0753 ,  H01L29/0657 ,  H01L33/0095 ,  H01L2224/95085

摘要： Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

公开(公告)号：US20180033915A1

公开(公告)日：2018-02-01

申请号：US15682260

申请日：2017-08-21

申请人： Sharp Laboratories of America, Inc.

发明人： Mark Albert Crowder ,  Paul J. Schuele ,  Changqing Zhan ,  Kenji Alexander Sasaki ,  Kurt Michael Ulmer

IPC分类号： H01L33/24 ,  H01L33/62 ,  H01L27/15

CPC分类号： H01L33/24 ,  H01L27/156 ,  H01L33/62 ,  H01L2224/95 ,  H01L2933/0066

摘要： Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.

公开(公告)号：US09627437B1

公开(公告)日：2017-04-18

申请号：US15199923

申请日：2016-06-30

申请人： Sharp Laboratories of America, Inc.

发明人： Kurt Michael Ulmer ,  Paul John Schuele

IPC分类号： H01L33/00 ,  H01L27/15 ,  H01L33/50 ,  H01L33/62 ,  H01L33/60

CPC分类号： H01L27/156 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

摘要： Embodiments are related generally to display fabrication, and more particularly to a fluidic assembly process for the placement of light emitting diodes on a transparent display substrate.