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公开(公告)号：US08586857B2
公开(公告)日：2013-11-19
申请号：US12264712
申请日：2008-11-04
IPC分类号： H01L31/05
CPC分类号： H01L24/83 , H01L24/33 , H01L2224/27013 , H01L2224/29109 , H01L2224/32245 , H01L2224/83051 , H01L2224/83385 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/12036 , H01L2924/19043 , H02S40/34 , H02S40/345 , H01L2924/3512 , H01L2924/00
摘要： A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.
摘要翻译： 一个组合的二极管，引线组件，包含两个伸缩接头。 包括两个扩展接头的组合二极管引线组件包括具有第一二极管端子和第二二极管端子的二极管，第一导体和第二导体。 第一导体包括在第一二极管端子处电耦合到二极管的第一端子和被配置为第一扩张接头的第二端子，其被配置为电耦合到第一互连导体并且被配置为减少 由第一导体施加到二极管的应力。 第二导体包括在第二二极管端子处电耦合到二极管的第一端子和被配置为第二扩展接头的第二端子，该第二端子被配置为电耦合到第二互连导体并且被配置为减少 由第二导体施加到二极管的应力。
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公开(公告)号：US20100108122A1
公开(公告)日：2010-05-06
申请号：US12264712
申请日：2008-11-04
CPC分类号： H01L24/83 , H01L24/33 , H01L2224/27013 , H01L2224/29109 , H01L2224/32245 , H01L2224/83051 , H01L2224/83385 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/12036 , H01L2924/19043 , H02S40/34 , H02S40/345 , H01L2924/3512 , H01L2924/00
摘要： A combined diode, lead assembly incorporating two expansion joints. The combined diode, lead assembly incorporating two expansion joints includes a diode having a first diode terminal and a second diode terminal, a first conductor and a second conductor. The first conductor includes a first terminal that is electrically coupled to the diode at the first diode terminal and a second terminal that is configured as a first expansion joint, which is configured to electrically couple to a first interconnecting-conductor and is configured to reduce a stress applied to the diode by the first conductor. The second conductor includes a first terminal that is electrically coupled to the diode at the second diode terminal and a second terminal that is configured as a second expansion joint, which is configured to electrically couple to a second interconnecting-conductor and is configured to reduce a stress applied to the diode by the second conductor.
摘要翻译： 一个组合的二极管，引线组件，包含两个伸缩接头。 包括两个扩展接头的组合二极管引线组件包括具有第一二极管端子和第二二极管端子的二极管，第一导体和第二导体。 第一导体包括在第一二极管端子处电耦合到二极管的第一端子和被配置为第一扩张接头的第二端子，其被配置为电耦合到第一互连导体并且被配置为减少 由第一导体施加到二极管的应力。 第二导体包括在第二二极管端子处电耦合到二极管的第一端子和被配置为第二扩展接头的第二端子，该第二端子被配置为电耦合到第二互连导体并且被配置为减少 由第二导体施加到二极管的应力。
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公开(公告)号：US20110121441A1
公开(公告)日：2011-05-26
申请号：US12626281
申请日：2009-11-25
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L24/34 , H01L23/3107 , H01L23/49551 , H01L23/49568 , H01L23/562 , H01L24/37 , H01L31/044 , H01L2224/32245 , H01L2224/37599 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/12036 , H01L2924/15747 , Y02E10/50 , H01L2924/00 , H01L2224/37099
摘要： A leadframe design for a diode or other semiconductor device that reduces stress on the device and provides increased heat dissipation is provided. According to various embodiments, the leadframe has a contoured profile including a recessed area and a raised surface within the recessed area. The surface supports the device such that the edges of the device extend past the surface. Also provided are device assemblies including the novel leadframes. In certain embodiments, the assemblies include one or more leadframes attached via a solder joint to a device. According to various embodiments, the leadframes are attached to the front side of the device, back side of the device or both. In particular embodiments, the device is a bypass diode for one or more solar cells in a solar module.
摘要翻译： 提供了一种二极管或其他半导体器件的引线框设计，可减少器件上的应力并提高散热。 根据各种实施例，引线框架具有包括凹陷区域和凹陷区域内的凸起表面的波形轮廓。 表面支撑设备，使得设备的边缘延伸越过表面。 还提供了包括新型引线框架的器件组件。 在某些实施例中，组件包括经由焊接接头连接到设备的一个或多个引线框架。 根据各种实施例，引线框架附接到设备的前侧，设备的背面或两者。 在具体实施例中，该装置是用于太阳能模块中的一个或多个太阳能电池的旁路二极管。
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公开(公告)号：US08203200B2
公开(公告)日：2012-06-19
申请号：US12626281
申请日：2009-11-25
IPC分类号： H01L23/498
CPC分类号： H01L24/34 , H01L23/3107 , H01L23/49551 , H01L23/49568 , H01L23/562 , H01L24/37 , H01L31/044 , H01L2224/32245 , H01L2224/37599 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/12036 , H01L2924/15747 , Y02E10/50 , H01L2924/00 , H01L2224/37099
摘要： A leadframe design for a diode or other semiconductor device that reduces stress on the device and provides increased heat dissipation is provided. According to various embodiments, the leadframe has a contoured profile including a recessed area and a raised surface within the recessed area. The surface supports the device such that the edges of the device extend past the surface. Also provided are device assemblies including the novel leadframes. In certain embodiments, the assemblies include one or more leadframes attached via a solder joint to a device. According to various embodiments, the leadframes are attached to the front side of the device, back side of the device or both. In particular embodiments, the device is a bypass diode for one or more solar cells in a solar module.
摘要翻译： 提供了一种二极管或其他半导体器件的引线框设计，可减少器件上的应力并提高散热。 根据各种实施例，引线框架具有包括凹陷区域和凹陷区域内的凸起表面的波形轮廓。 表面支撑设备，使得设备的边缘延伸越过表面。 还提供了包括新型引线框架的器件组件。 在某些实施例中，组件包括经由焊接接头连接到设备的一个或多个引线框架。 根据各种实施例，引线框架附接到设备的前侧，设备的背面或两者。 在具体实施例中，该装置是用于太阳能模块中的一个或多个太阳能电池的旁路二极管。
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公开(公告)号：US08833005B1
公开(公告)日：2014-09-16
申请号：US13085268
申请日：2011-04-12
申请人： Steven T. Croft , Shawn Everson
发明人： Steven T. Croft , Shawn Everson
IPC分类号： E04D13/18
CPC分类号： E04D13/00 , E04B1/38 , E04D3/35 , E04D3/3606 , H01L31/042 , H02S20/23 , H02S20/26 , H02S40/38 , Y02B10/12 , Y02P90/50
摘要： Provided are novel building integrable photovoltaic (BIP) assemblies and methods of installation thereof on building structures. The BIP assembly includes a base sheet or a sheath, which may be a plywood board or an oriented strand (OSB) board, and multiple electrically interconnected photovoltaic inserts, which are attached to and supported by the base sheet. The base sheet is configured to be positioned directly the building structures, such as roof rafters. Various electrical components may be positioned within cavities of the base sheet and/or at the back side of that sheet. Such components are configured to align in between the roof rafters during installation. The spacing between the rafters provides access to the components and allows the components to extend away from the base sheet and into the spacing. Various electrical components may be installed and removed from the BIP assembly during its fabrication and/or installation.
摘要翻译： 提供了新型建筑可集成光伏（BIP）组件及其在建筑结构上的安装方法。 BIP组件包括基片或护套，其可以是胶合板或取向线（OSB）板，以及多个电互连光伏插入件，其连接到基片并由基片支撑。 基片被构造成直接定位在建筑结构上，例如屋顶椽。 各种电气部件可以位于基片的空腔内和/或在该片材的背面。 这样的部件构造成在安装期间在屋顶椽子之间对准。 椽子之间的间距提供了对组件的访问，并允许组件从基片延伸到间隔中。 在其制造和/或安装期间，可以将BIP组件中的各种电气部件安装和移除。
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6.发明授权Thin-film photovoltaic power element with integrated low-profile high-efficiency DC-DC converter 有权具有集成低调高效率DC-DC转换器的薄膜光伏功率元件公开(公告)号：US09164525B2
公开(公告)日：2015-10-20
申请号：US13251333
申请日：2011-10-03
CPC分类号： H02M3/1582 , G05F1/67 , H02M7/003 , H02M2001/0077 , H02S40/34 , Y02E10/58 , Y10T307/685 , Y10T307/707
摘要： A photovoltaic device includes at least one photovoltaic cell and a DC/DC converter electrically coupled to the at least one photovoltaic cell. The at least one photovoltaic cell and the DC/DC converter are integrated into a photovoltaic package.
摘要翻译： 光伏器件包括至少一个光伏电池和电耦合到所述至少一个光伏电池的DC / DC转换器。 至少一个光伏电池和DC / DC转换器集成到光伏封装中。
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7.发明授权Thin-film photovoltaic power element with integrated low-profile high-efficiency DC-DC converter 有权具有集成低调高效率DC-DC转换器的薄膜光伏功率元件公开(公告)号：US08058752B2
公开(公告)日：2011-11-15
申请号：US12379197
申请日：2009-02-13
IPC分类号： H02J7/00
CPC分类号： H02M3/1582 , G05F1/67 , H02M7/003 , H02M2001/0077 , H02S40/34 , Y02E10/58 , Y10T307/685 , Y10T307/707
摘要： A photovoltaic device includes at least one photovoltaic cell and a DC/DC converter electrically coupled to the at least one photovoltaic cell. The at least one photovoltaic cell and the DC/DC converter are integrated into a photovoltaic package.
摘要翻译： 光伏器件包括至少一个光伏电池和电耦合到所述至少一个光伏电池的DC / DC转换器。 至少一个光伏电池和DC / DC转换器集成到光伏封装中。
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8.发明申请SHIELDING OF INTERIOR DIODE ASSEMBLIES FROM COMPRESSION FORCES IN THIN-FILM PHOTOVOLTAIC MODULES 审中-公开室内二极管组件从薄膜光伏模块中的压缩力的屏蔽公开(公告)号：US20110146778A1
公开(公告)日：2011-06-23
申请号：US12644360
申请日：2009-12-22
IPC分类号： H01L31/00 , H01L21/56 , H01L31/0203
CPC分类号： H01L31/0508 , H01L31/044 , H01L31/048 , H01L2224/33 , Y02E10/50
摘要： A method and apparatus for protecting a diode assembly of a photovoltaic module from compressive and tensile forces by providing at least one interior shielding element are provided. According to various embodiments, a photovoltaic module including a first encasing layer, a second encasing layer, at least one photovoltaic cell disposed between the first and second encasing layers, at least one shielded diode assembly disposed on the at least one photovoltaic cell and electrically connected to the at least one photovoltaic cell, and a pottant disposed between the at least one photovoltaic cell and the second encasing layer is provided. A localized shielding element may be used to shield the diode assembly.
摘要翻译： 提供了一种通过提供至少一个内部屏蔽元件来保护光伏组件的二极管组件免受压缩和拉伸力的方法和装置。 根据各种实施例，包括第一封装层，第二封装层，设置在第一和第二封装层之间的至少一个光伏电池的光伏模块，设置在至少一个光伏电池上的至少一个屏蔽二极管组件，并电连接 提供至少一个光伏电池，并且设置在所述至少一个光伏电池和所述第二包装层之间的电容器。 可以使用局部屏蔽元件来屏蔽二极管组件。
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公开(公告)号：US20100019580A1
公开(公告)日：2010-01-28
申请号：US12558355
申请日：2009-09-11
申请人： Steven Croft , Shawn Everson
发明人： Steven Croft , Shawn Everson
IPC分类号： H02J3/00 , H01L31/042
CPC分类号： H02S40/32 , Y10T307/707
摘要： Provided are novel detachable inverters, DC/DC converters, diodes and other detachable electrical circuitry components for solar modules. A detachable inverter or other component according to certain embodiments includes a fixed part and a separable part, i.e., an insert. The insert may include one or more bypass diodes, inverters, DC/DC converters or combinations thereof. According to various embodiments, the insert may or may not be movable between operating positions or orientations associated with different electrical connection configurations.
摘要翻译： 提供了用于太阳能模块的新型可拆卸逆变器，DC / DC转换器，二极管和其他可拆卸电路元件。 根据某些实施例的可拆卸逆变器或其它部件包括固定部分和可分离部分，即插入件。 插入件可以包括一个或多个旁路二极管，逆变器，DC / DC转换器或其组合。 根据各种实施例，插入件可以或可以不在与不同电连接构造相关联的操作位置或取向之间移动。
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10.发明申请Apparatus and method for low cost control of shape memory alloy actuators 审中-公开形状记忆合金致动器低成本控制的装置和方法公开(公告)号：US20060048511A1
公开(公告)日：2006-03-09
申请号：US10934037
申请日：2004-09-03
申请人： Shawn Everson , Ali Ghorbal , Henry Nash , Andrei Szilagyi , Roderick MacGregor , Kurt Kuhlmann
发明人： Shawn Everson , Ali Ghorbal , Henry Nash , Andrei Szilagyi , Roderick MacGregor , Kurt Kuhlmann
IPC分类号： F01B29/10
摘要： A method of controlling a shape memory alloy actuator includes applying power to a shape memory alloy actuator. A measured actuation parameter is obtained from the shape memory alloy actuator. An operational characteristic parameter is derived based upon the power and the measured actuation parameter. An actuation state parameter is identified from the operational characteristic parameter. The actuation state parameter is used to modify the control of the shape memory alloy actuator.
摘要翻译： 控制形状记忆合金致动器的方法包括向形状记忆合金致动器施加电力。 从形状记忆合金致动器获得测量的致动参数。 基于功率和测量的致动参数导出操作特性参数。 从操作特性参数识别致动状态参数。 致动状态参数用于修改形状记忆合金致动器的控制。
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